Audiolab-8000S-int-sm维修电路原理图.pdf
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1、? ? RadioFans.CN 收音机爱 好者资料库 introduction No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express written permission of International Audio Group Limited (IAG). This manual is for the exclusive use of IAG, i
2、ts approved distributors and approved UK service agents. No part of this manual shall be transferred to a third party without the written permission of IAG. It is the responsibility of the user to ensure that all the information contained in this manual is current. Notification for new issues of thi
3、s manual and minor updates will be given via the IAG web-site or on request. This manual has been prepared with the greatest care, it is intended for information only and no liability shall be accepted for errors or changes to specification. For further service information, parts lists and updates,
4、please contact our web-site. 2005 International Audio Group Limited. All rights reserved. Notification for new issues of this service manual will be given via the Audiolab web site:- issue number :- 2005/001/8000SG GR RP P0 00 00 00 03 3. .0011 issue date :- September 04 20052 2 5 5 . . 0 0 1 1 . .
5、1 1 9 9 92 2 5 5 . . 0 0 1 1 . . 1 1 9 9 9 99999 RadioFans.CN 收音机爱 好者资料库 index 1.0safety and servicing notes 1.1Safety precautions.1 1.2Electrostatic discharge precautions .1 1.3Soldering.1 2.0front and rear panel layouts 2.1Front panel controls .3 2.2Rear panel connections.3 3.0disassembly instruct
6、ionsdisassembly instructionsPages 4 and 5 DELETED 4.0functional tests 4.1Test equipment required .6 4.2Functional test procedure.7 5.0performance tests 5.1Test equipment required .11 5.2Performance test procedure .12 6.0test points 6.1Functional and performance test points .16 7.0circuit schematics
7、7.1Master schematic diagram (SCH267M-01-05).17 7.2Line amplifier left channel schematic (SCH26701-07-02) .18 7.3 Line amplifier right channel schematic (SCH26701-08-02).19 7.4Power amplifier left channel schematic (SCH26701-09-02).20 7.5Power amplifier right channel schematic (SCH26701-10-02).21 7.6
8、Power supplies schematic (SCH26701-01-02) .22 7.7Protect and turn on schematic (SCH26701-06-02) .23 7.8Digital system controller schematic (SCH26701-02-01).24 7.9Digital system interface schematic (SCH26701-03-01).25 7.10Input interface schematic (SCH26701-04-04) .26 7.11Relay coils schematic (SCH26
9、701-05-01) .27 7.12Front panel schematic (SCH26702-01-01) .28 7.13Speaker outputs schematic (SCH26703-01-01).29 8.0printed circuit board layout 8.1Printed circuit board layout (top view).30 8.2 Printed circuit board layout (bottom view).31 9.0technical data 9.1 8000S Technical specifications.32 9.2I
10、nternational standards.34 1 1.0 safety and servicing notes 1.1Safety precautions 1.This unit is Class II, which means that it is not connected to the protective earth system. All live voltages are insulated from the case by double insulation. 2.Do not attempt to service unless qualified to do so. 3.
11、Disconnect unit from AC power supply before removing cover. 4.Components marked with the symbol on the circuit schematic are safety critical and must only be replaced with an identical component, or an alternative approved by the manufacturer. 5.Switch unit off, and disconnect from supply before mak
12、ing and breaking any connections. 6.Do not adjust any controls unless instructed to do so in this manual. 1.2Electrostatic discharge precautions Electrostatic discharge (ESD) is due to charges produced by insulating materials rubbing together. Humans collect electrostatic charge through normal activ
13、ities when clothes rub together and when walking on carpet. This charge may be discharged suddenly when you touch a conductor. If the conductor is connected to a sensitive electronic circuit, you may damage the components. It is also possible to reduce the life of components without causing any obvi
14、ous damage. To prevent ESD damage, it is necessary to follow these guidelines. 1.Prepare work area. Place an ESD protective mat on the bench, strapped to the protective earth circuit. 2.Prepare yourself. Put on an ESD protective wrist band, strapped to the protective earth circuit, or to the ESD pro
15、tective mat. 3.Keep all PCBs removed from unit in ESD protective bags. 4.Keep all replacement electronic components, PCBs and stock items in ESD protective bags or boxes. 5.Be particularly careful with components marked with the following symbol: 1.3Soldering How to de-solder components Components s
16、hould be removed, wherever possible, using a de-soldering tool. Be careful not to damage tracks and pads by applying too much pressure. How to make good solder joints 1.Ensure surfaces are clean. 2.Keep soldering iron clean and wetted with solder. Use an appropriate bit. Do not leave soldering iron
17、on when not in use. 2 1.0 safety and servicing notes 3.Apply soldering iron to both component lead and pad before applying solder. Make sure that the soldering iron is applied long enough for the solder to wet properly, but do not apply for too long or component damage may occur. 4.Allow a small gap
18、 between component body and pad. Solder must not reach the base of the component. How to detect acceptable joints 1.Solder joints should have from a shiny to satin lustre and a generally smooth appearance. 2.Solder should have wetted both the component lead and pad. 3.There should be a concave menis
19、cus between the objects being soldered. The angle of solder to pad should be less than 90 unless the solder joint extends over the edge of the pad. 4.Solder should fill the component pad and wet component lead around the full circumference (360). How to detect unacceptable joints 1.Poor wetting prod
20、uces a bead of solder. The fillet will be convex instead of concave, and there will not be a feather edge. 2.On double-sided PCBs, solder should wet all round plated-through hole, on both sides of the PCB. Cleaning up after soldering 1.Flux is very corrosive. Remove with IPA (propan-2-ol) before com
21、pleting the job. 2.Remove any solder balls and splashes from the unit. 3.Check all new solder joints and ensure all PCBs are clean before replacing covers. 4.After replacing covers, clean the case and any display windows with a damp cloth. Do not use any organic solvents. If scratched, replace displ
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