Technics-SAHT-340E-340EB-340-EG-Service-Manual (1)电路原理图.pdf

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1、lGeneral Power Source: E/ EG areas:AC 230V, 50Hz EB area:AC 230V-240V, 50Hz Power consumption:90 W Dimensions (WHD):43060342 mm Mass:3kg lAmplifier section RMS Output Power: Dolby Digital Mode lTotal RMS Dolby Digital mode Power:330 W At 1kHz and total harmonic of 10% lFront:55 W/ Channel (5) lCente

2、r:55 W/ Channel (5) lSurround:55 W/ Channel (5) At 100Hz and total harmonic of 10% lActive subwoofers:55 W/ Channel (5) DIN Output Power: Dolby Digital Mode: lTotal DIN Dolby Digital mode Power: 150 W At 1kHz and total harmonic of 1% lFront:25 W/ Channel (5) lCenter:25 W/ Channel (5) lSurround:25 W/

3、 Channel (5) 2006 Panasonic AVC Networks Singapore Pte. Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law. SA-HT340E SA-HT340EB SA-HT340EG Colour (S).Silver Type At 100Hz and total harmonic of 1% lSubwoofer:25 W/ Channel (5) lFM tuner section (FM) Preset Memory:FM

4、 15 stations AM/MW 15 stations Frequency Range:87.5-108.00MHz (50kHz step) Sensitivity:1.8V (IHF) S/N 26dB1.4V Antenna Terminals:75 (unbalanced) lAM tuner section (AM/MW) Frequency Range:522-1629kHz (9kHz step) AM Sensitivity S/N 20dB at 999kHz: 560V/m lDisc section Discs played (8 cm or 12 cm): (1)

5、 DVD DVD-Video, DivX(*6,7) (2) DVD-RAM DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (3) DVD-R DVD-Video, DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (4) DVD-R DL DVD-Video, DVD-VR (5) DVD-RW DVD-Video, DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (6) +R/RW Video DVD Ho

6、me Theater Sound System Specifications ORDER NO.MD0605168C2 (7) +R DL Video (8) CD, CD-R/RW CD-DA, Video CD, SVCD(*1), MP3(*2,7), WMA(*3,7), JPEG(*4,7), MPEG4(*5,7), DivX (*6,7), HighMAT Level 2 (Audio and Image) *1Conforming to IEC62107 *2MPEG-1 Layer 3, MPEG-2 Layer 3 *3Windows Media Audio Ver.9.0

7、 L3 lNot compatible with Multiple Bit Rate (MBR) *4Exif Ver 2.1 JPEG Baseline files lPicture resolution: between 160 x 120 and 6144 x 4096 pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2, 4:4:4). Extremely long and narrow pictures may not be displayed. *5MPEG4 data recorded with Panasonic SD multi camer

8、as or DVD video recorders. lConforming to SD VIDEO specifications (ASF standard)/ MPEG4 (Simple Profile) video system/G.726 audio system. *6Plays all versions of DivX video (including DivX6) with standard playback of DivX media files. Certified to the DivX Home Theater Profile. lGMC (Global Motion C

9、ompensation) is not supported. *7The total combined maximum number of recognizable audio, picture and video contents and groups: 4000 audio, picture and video contents and 400 groups. Pick up: Wavelength: lCD:785nm lDVD:662nm Laser power: lCD:CLASS 1M lDVD:CLASS 1 Audio output (DISC): Number of chan

10、nels:5.1 ch (FL, FR, C, SL, SR, SW) Audio performance: Frequency response: DVD (linear audio):4 Hz-22 kHz (48 kHz sampling) 4 Hz-44 kHz (96 kHz sampling) CD-Audio:4 Hz-20 kHz S/N ratio: CD-Audio:105 dB Dynamic range: DVD (linear audio):95 dB CD-Audio:95 dB Total harmonic distortion: CD-Audio:0.005 %

11、 lVideo section Video system: Signal system:PAL 625/50, PAL 525/60, NTSC Composite video output: Output level:1 Vp-p (75 ) Terminal:Scart jack (1 system) S-video output: Y output level:1 Vp-p (75 ) C output level:PAL; 0.3Vp-p (75) NTSC; 0.286 Vp-p (75 ) TerminalScart jack (1 system) RGB video output

12、: R output level:0.7 Vp-p (75 ) G output level:0.7 Vp-p (75 ) B output level:0.7 Vp-p (75 ) Terminal:Scart jack (1 system) Power consumption in standby mode: approx 1W Note: 1.Specifications are subject to change without notice. Mass and dimensions are approximate. 2.Total harmonic distortion is mea

13、sured by the digital spectrum analyzer. Solder: This model uses lead free solder (PbF). Mechanism: This model uses DL2SU (Single tray) mechanism. Power Supply: This model uses Switching Mode Power Supply (SMPS) Module for power-up unit. Refer to original service manual for *1, *2, *3, *4. 2 SA-HT340

14、E / SA-HT340EB / SA-HT340EG 3 SA-HT340E / SA-HT340EB / SA-HT340EG 1 Safety Precautions 5 1.1. GENERAL GUIDELINES 5 1.2. Before Repair and Adjustment (Using SMPS) 5 1.3. Protection Circuitry 5 1.4. Caution for AC Cord 6 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES

15、) Devices 7 3 Precaution of Laser Diode 8 4 About Lead Free Solder (PbF) 9 4.1. Service caution based on legal restrictions 9 5 Handling Precautions for Traverse Unit 10 5.1. Cautions to Be Taken in Handling the Optical Pickup Unit 10 5.2. Grounding for electrostatic breakdown prevention 10 6 Access

16、ories 12 7 Operation Procedures 13 7.1. Remote Control Keys Operation 13 7.2. Main Unit Keys Operation 14 7.3. Connection Setup 15 7.4. Disc information 16 7.5. About DivX VOD Content 18 8 Self-Diagnosis and special mode setting 19 8.1. Service Mode Summary Table 19 8.2. Service Mode Table 1 19 8.3.

17、 DVD Self Diagnostic Function-Error Code 24 8.4. Sales Demonstration Lock Function 26 8.5. Service Precautions 27 9 Assembling and Disassembling 28 9.1. Disassembly Flow Chart 29 9.2. Main Components and P.C.B. Locations 29 9.3. Disassembly of Top Cabinet 30 9.4. Disassembly of the DVD Lid (When tak

18、ing out disc manually) 30 9.5. Disassembly of Front Panel Assembly 31 9.6. Disassembly of FL P.C.B. & Volume P.C.B. 31 9.7. Disassembly of DVD Mechanism Unit 32 9.8. Disassembly of DVD Module P.C.B. 32 9.9. Disassembly of Rear panel 33 9.10. Disassembly of SMPS Module P.C.B. 33 9.11. Disassembly of

19、Main P.C.B. & Tuner Extent P.C.B. 33 9.12. Disassembly of Digital Amp IC 33 10 Service Position 34 10.1. Servicing position of the DVD Module P.C.B. 34 10.2. Servicing position of the Main P.C.B. 34 10.3. Servicing position of the SMPS Module P.C.B. 34 11 Assembly and disassembly of Mechanism Unit 3

20、5 11.1. Disassembly Procedure 35 12 Measurements and Adjustments 41 12.1. Service Tools and Equipment 41 12.2. Important points in adjustment 41 12.3. Storing and handling of test discs 41 12.4. Optical adjustment 42 13 Abbreviations 43 14 Voltage and Waveform Chart 45 14.1. DVD Module P.C.B. 45 14.

21、2. Main P.C.B. 46 14.3. FL P.C.B. & Tray Loading P.C.B. 47 14.4. SMPS Module P.C.B. 47 14.5. Waveform Chart 48 15 Illustration of ICs, Transistors and Diodes 49 16 Wiring Connection Diagram 51 17 Block Diagram 53 18 Schematic Notes 59 19 Schematic Diagram 61 19.1. (A) DVD Module (DV3.2) Circuit 61 1

22、9.2. (B) Main/FL/Volume/Tray Loading/Tuner Extent Circuit 65 20 Printed Circuit Board 71 20.1. (A) DVD Module P.C.B. 71 20.2. (B) Main/Power P.C.B. 72 20.3. (C) FL, Volume, Tuner Extent, & Tray Loading P.C.B. 73 21 Basic Troubleshooting Guide 75 21.1. Basic Troubleshooting Guide for Traverse Unit (D

23、VD Module P.C.B.) 75 21.2. Troubleshooting Guide for Power section (Power circuit) 75 22 Overall Block (HT340) 76 22.1. HT340 DVD Unit Block 77 22.2. HT340 Block (Analog Signal : DVD 5.1ch Play Back Mode) 78 22.3. HT340 Block (Analog Signal : 2ch Analog Input Mode) 79 22.4. HT340 Power Supply Block

24、80 22.5. HT340 Power (Main) Block 81 23 Terminal Function of ICs 82 23.1. IC2018 (C2CBYY000194): System Control Microprocessor IC 82 24 Exploded Views 83 24.1. Cabinet Parts Location 83 24.2. Packaging 85 25 Replacement Parts List 86 25.1. Component Parts List 87 CONTENTS Page Page 4 SA-HT340E / SA-

25、HT340EB / SA-HT340EG 1 Safety Precautions 1.1. GENERAL GUIDELINES 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insul

26、ation barriers, insulation papers shields are properly installed. 3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards. 1.1.1. LEAKAGE CURRENT COLD CHECK 1. Unplug the AC cord and connect a jumper between the two prongs on the

27、 plug. 2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.

28、2M. When the exposed metal does not have a return path to the chassis, the reading must be. Figure 1 1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel

29、 with a 0.15F capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure

30、the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed

31、 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. 1.2. Before Repair and Adjustment (Using SMPS) This model uses Switching Mode Power Supply (SMP

32、S) Module to provide the neccessary voltages for the unit. DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices. After repairs are completed, restore power gradually using a variac, to avoid overcurrent. Current consumption at AC 230 V, 50 H

33、z in NO SIGNAL mode volume minimal should be 650 mA. (For E/EG) Current consumption at AC 230V240V, 50 Hz in NO SIGNAL mode volume minimal should be 650 mA. (For EB) 1.3. Protection Circuitry The protection circuitry may have operated if either of the following conditions are noticed: No sound is he

34、ard when the power is turned on. Sound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the a

35、mplifier are used. 5 SA-HT340E / SA-HT340EB / SA-HT340EG If this occurs, follow the procedure outlines below: 1. Turn off the power. 2. Determine the cause of the problem and correct it. 3. Turn on the power once again after one minute. Note: When the protection circuitry functions, the unit will no

36、t operate unless the power is first turned off and then on again. 1.4. Caution for AC Cord 6 SA-HT340E / SA-HT340EB / SA-HT340EG 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by static electri

37、city. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage cau

38、sed by electro static discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be

39、removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a

40、grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can

41、 generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foi

42、l or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circ

43、uit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficien

44、t to damage an ES device). 7 SA-HT340E / SA-HT340EB / SA-HT340EG 3 Precaution of Laser Diode 8 SA-HT340E / SA-HT340EB / SA-HT340EG 4 About Lead Free Solder (PbF) 4.1. Service caution based on legal restrictions 4.1.1. General description about Lead Free Solder (PbF) The lead free solder has been use

45、d in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (

46、Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used The letter of “PbF” is printed either foil side or components side on the PCB using the lead free sol

47、der. (See right figure) Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, i

48、t should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the lead free so

49、lder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 35030 degrees C (66286F). Recommended Lead Free Solder (Service Parts Route.) The following 3 types of lead free solder are available through the service parts route. RFKZ03D01K-(0.3mm 100g Reel) RFKZ06D01K-(0.6mm 100g Reel) RFKZ10D01K-(1.0mm 100g Reel) Note * Ingredient: tin (Sn),