Telefunken-TDV-3000-A-Service-Manual电路原理图.pdf
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1、SERVICE MANUAL DVD PLAYER In no case should a unit fail to meet limit specs. DescriptionUnitMinimumNominalMaximumRemark 1. Video 1-1. Video Output (PB)Vp-p0.81.01.2SP Mode 1-2. Video Output (R/P)Vp-p0.81.01.2 1-3. Video S/N Y (R/P)dB4045 SP Mode, W/O Burst 1-4. Video Color S/N AM (R/P)dB3741SP Mode
2、1-5. Video Color S/N PM (R/P)dB3036SP Mode 1-6. Resolution (PB)Line230245SP Mode 2. Servo 2-1. Jitter Lowsec0.070.12SP Mode 2-2. Wow when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release th
3、e flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Caution: 1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6
4、 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 1-4-2DVD_NOTE 3. The flat pack-IC
5、 on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it. With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins
6、of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3) Bottom
7、of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) With Iron Wire: (1) Usi
8、ng desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins u
9、sing a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5 Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 Flat Pack-IC Desoldering Braid Soldering Iron
10、Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 1-4-3DVD_NOTE (4)Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5)Release the f
11、lat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Installation (1)
12、Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. (2) The “I” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for insta
13、llation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3) Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers
14、Fig. S-1-6 Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-1-7 Presolder CBA Flat Pack-IC Fig. S-1-8 1-4-4DVD_NOTE Instructions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electro- static charge duri
15、ng unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1M) that is prop- erly grounded to remove any static electricity that may be charged on the body. 2. Ground for Workbench (1)Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the w
16、orkbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body ground- ing band, be careful to avoid contacting semi-con- ductors with your clothing. CBA CBA Grounding Band Conductive Sheet or Copper Plate 1M
17、1M 1-5-1H9700PFS PREPARATION FOR SERVICING How to Enter the Service Mode About Optical Sensors Caution: An optical sensor system is used for the Tape Start and End Sensors on this equipment. Carefully read and follow the instructions below. Otherwise the unit may operate erratically. What to do for
18、preparation Insert a tape into the Deck Mechanism Assembly and press the PLAY button. The tape will be loaded into the Deck Mechanism Assembly. Make sure the power is on, connect TP501 (S-INH) to GND. This will stop the function of Tape Start Sensor, Tape End Sensor and Reel Sensors. (If these TPs a
19、re connected before plugging in the unit, the function of the sensors will stay valid.) See Fig. 1. Note: Because the Tape End Sensors are inactive, do not run a tape all the way to the start or the end of the tape to avoid tape damage. Q504 Q503 TP501 S-INH Fig. 1 1-6-1H9700DC CABINET DISASSEMBLY I
20、NSTRUCTIONS 1. Disassembly Flowchart This flowchart indicates the disassembly steps to gain access to item(s) to be serviced. When reassembling, follow the steps in reverse order. Bend, route, and dress the cables as they were originally. 2. Disassembly Method Note: (1): Identification (location) No
21、. of parts in the figures (2): Name of the part (3): Figure Number for reference (4): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered. P=Spring, L=Locking Tab, S=Screw, CN=Connector *=Unhook, Unlock, Release, Unplug, or Desolder e.g. 2(S-2) =
22、two Screws (S-2), 2(L-2) = two Locking Tabs (L-2) (5): Refer to “Reference Notes.” ID/ LOC. No. PART REMOVAL Fig. No. REMOVE/*UNHOOK/ UNLOCK/RELEASE/ UNPLUG/DESOLDER Note 1Top CaseD18(S-1)- 2 Front Assembly D2*3(L-1), *3(L-2) 1 1-1 1-2 3 Top Bracket D23(S-2)- 4 DVD Mecha Assembly D3 4(S-3), *CN401,
23、*CN601 - 5 Partition Plate D3(S-4)- 6 Power Suppy CBA D32(S-5), CN501- 7 Loader Holder D32(S-6)- 1 Top Case 2 Front Assembly 3 Top Bracket 4 DVD Mecha Assembly8 DVD Main CBA Unit 5 Partition Plate 7 Loader Holder 6 Power Supply CBA 9 VCR Chassis Unit 10 Deck Assembly 11 DVD Open/Close CBA 12 Main CB
24、A 13 Jack-A CBA 8 DVD Main CBA Unit D4 2(S-7), *CN201, *CN301 2 2-1 2-2 3 9 VCR Chassis Unit D5 5(S-8), 2(S-9), (S-10), (L-3) - 10 Deck Assembly D6 Desolder, 2(S-11), (S-12) 4,5 11 DVD Open/ Close CBA D6Desolder- 12Main CBAD6- 13 Jack-A CBA D6Desolder, 6(S-13)- (1) (2) (3) (4) (5) ID/ LOC. No. PART
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