Philips-MCM-393-Service-Manual电路原理图.pdf

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1、 MCM393/all versionCopyright 2007 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the p

2、rior permission of Philips.Published by SL 0833 Service Audio Printed in The Netherlands Subject to modificationMicro SystemVersion 1.2CLASS 1LASER PRODUCT 3141 785 31552TABLE OF CONTENTSPagePCBs Location .1-2Specifi cations .1-3Measurement Setup .1-4Service Aids, Safety Instruction, etc .1-5 to 1-7

3、Service Test Program . 2Set Block Diagram . 3Set Wiring Diagram . 4Main Board . 5Display fr Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utili

4、zzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con !GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth ground toassure no shock hazard exist. The leakage current must not

5、exceed0.5mA.1-7INFORMATION ABOUT LEAD-FREE SOLDERINGPhilips CE is producing lead-free sets from 1.1.2005 onwards.IDENTIFICATION:Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules:Example S/N:Bottom line of typeplate gives a 14-digi

6、t S/N. Digit 5&6 is the year, digit 7&8 is the week number,so in this case 2005 wk12So from 0501 onwards = from 1 Jan 2005 onwardsImportant note: In fact also products of year 2004 must be treated in this way as long asyou avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305

7、and thehigher temperatures belong to this.Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contactthe manufacturer of your solder-e

8、quipment. In general use of solder-paste within workshops should be avoided because paste is noteasy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be ableo To reach at least a solder-temperature of 40o To stabilize the adjusted tem

9、perature at the solder-tipo To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around is reached and stabilized at the solder joint. Heating-time of thesolder-joint should not exceed 4 sec. Avoid temperatures above 400 otherwise wear-out of tips will ri

10、se drastically and flux-fluidwill be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixedsolder alloy types (leaded and lead-free).If one ca

11、nnot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solderwith new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased atexternal compani

12、es. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use the lead-freetemperature profile, in case of doubt)- lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica ge

13、l pack) to protect the IC againstmoisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry.(MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005

14、(except products of 2004), containing leaded solder-alloy and components, all needed spare-partswill be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you find more information to:BGA-de-/soldering (+ baking instructions)H

15、eating-profiles of BGAs and other ICs used in Philips-setsYou will find this and more technical information within the “magazine“, chapter “workshop news“.For additional questions please contact your local repair-helpdesk.SERVICE INSTRUCTION1. Unplug the AC Power cord and connect a wirebetween the t

16、wo pins of the AC Power plug.2. Set the AC Power switch to the “on“ position (keep theAC Power cord unplugged!).3. Measure the resistance value between the pins of theAC Power plug and the metal shielding of the tuner orthe aerial connection on the set. The reading should belarger than 4.5 Mohm (For

17、 U.S. it should be between4.2 Mohm and 12 Mohm).4. Switch “off“ the set, and remove the wire between thetwo pins of the AC Power plug.Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention tothe following points: Route the wire

18、 trees correctly and fix them with themounted cable clamps. Check the insulation of the AC Power lead for externaldamage. Check the strain relief of the AC Power cord for properfunction. Check the electrical DC resistance between the AC PowerPlug and the secondary side (only for sets which have a AC

19、Power isolated power supply): Check the cabinet for defects, to avoid touching of anyinner parts by the customer.3-1 3-1SET BLOCK DIAGRAMSET WIRING DIAGRAM4-1 4-1MAIN BOARDTABLE OF CONTENTSMain PCB - Layout Top View . 5-2Main PCB - Layout Bottom View . 5-3Main & Headphone PCB - Circuit Diagram . 5-4Headphone PCB - Layout Diagram . 5-55-1 5-1