Philips-MCD-705-Service-Manual电路原理图.pdf
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1、Version 1.0MCD705 3141 785 30630Service ManualDVD Micro Systemall versionsPublished by LX 0539 Service Audio Printed in The Netherlands Subject to modificationCopyright 2005 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced
2、, stored in a retrievalsystem or transmitted, in any form or by any means, electronic, mechanical, photocopying,or otherwise without the prior permission of Philips.Handling chip components .1-1Information about lead-free soldering.1-2Technical specification.2-1Service tools .2-1Service measurement
3、setup.2-2Connections and controls.3-1.3-4Disassembly diagram .4-1.4-2Software version and upgrading.5-1Set block diagram.5-2Set wiring diagram.5-3VFD BOARDcircuit diagram .6-1layout diagram .6-2TUNER BOARD circuit diagram .7-1layout diagram .7-2layout diagram-amp box pcb assy.7-2AMP BOARDcircuit dia
4、gram .8-1 layout diagram .8-2CPU BOARDcircuit diagram .9-1 layout diagram .9-2ALC VOLUME BOARDcircuit diagram .10-1 layout diagram .10-2DVD MPEG BOARD circuit diagram .11-1.11-5layout diagram .11-6Exploded view diagram.12-1Mechanical partslist .12-2Electrical partslist.13-1.13-3TABLE OF CONTENTSCLAS
5、S 1LASER PRODUCT1 - 1HANDLING CHIP COMPONENTS1 - 2INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE is producing lead-free sets from 1.1.2005 onwards. IDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Example S/N:
6、Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12 So from 0501 onwards = from 1 Jan 2005 onwards Important note : In fact also products of year 2004 must be treated in this way as long as you avoid mixin g solder-alloys ( le
7、aded/ lead -free). So best to always use SAC305 and the higher temperatures belon g t o t his. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is requ
8、ired, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a
9、 solder-temperature of 40 o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoi
10、d temperatures above 400 otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to av
11、oid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standar
12、d-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use the lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be deli
13、vered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-
14、website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P
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