Philips-HTS-3610-K-Service-Manual电路原理图.pdf
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1、Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modication EN 3139 785 31630HTS3300K/51 fr Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni ori
2、ginali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con !GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth ground toassure no shock hazard exist. The l
3、eakage current must not exceed0.5mA.EN 73139 785 31630Measurements Setup, Service Aid & Lead Free Requirements 2.2.1 Lead Free RequirementsPb(Lead) Free SolderWhen soldering , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated) one must treat all sets
4、from 1 Jan 2005 onwards, according next rules:Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules h
5、ave to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided becau
6、se paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applicat
7、ions. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid we
8、ar-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free,
9、 clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12
10、nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After
11、opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded sol
12、der-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs and other
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