Philips-HTS-3110-Mk1-Service-Manual电路原理图.pdf
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1、Published by KC-TE 0634 AV Systems Printed in the Netherlands Subject to modication EN 3139 785 31981HTS3110MKI/75/93/96/98fr Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle cond
2、izioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con !GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth ground toassure no shock hazard ex
3、ist. The leakage current must not exceed0.5mA.EN 73139 785 3198xMeasurements Setup, Service Aid & Lead Free Requirements 2.2.1 Lead Free RequirementsPb(Lead) Free SolderWhen soldering , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated) one must treat
4、 all sets from 1 Jan 2005 onwards, according next rules:Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology so
5、me rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avo
6、ided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for differen
7、t applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. T
8、o avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is
9、lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always
10、use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moistu
11、re. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing
12、leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs
13、and other ICs used in Philips-setsYou will fi nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-helpdesk.EN 8 3139 785 3198x2. Measurements Setup, Service Aid & Lead Free Requirements2.2 Service HintsCAUTIO
14、NCHARGED CAPACITORS ON THE SERVO BOARD MAY DAMAGE THE DRIVE ELECTRONICS WHEN CONNECTING A NEW DRIVE.THATS WHY, BESIDES THE SAFETY MEASURES LIKE SWITCH OFF POWER SUPPLY ESD PROTECTIONADDITIONAL ACTIONS MUST BE TAKEN BY THE REPAIR TECHNICIAN.The following steps have to be done when replacing the defec
15、tive loader :1. Dismantling of the loader to access the ESD protection point if necessary.2. Solder the ESD protection point*. 3. Disconnect fl exfoil cable from the defective loader.4. Put a paper clip on the fl exfoil to short-circuit the contacts (fi g.1) 5. Replace the defective loader with a ne
16、w loader.6. Remove paperclip from the fl exfoil and connect it to the new loader.7. Remove solder joint on the ESD protection point.ATTENTION: The laser diode of this loader is protected against ESD by a solder joint which shortcircuits the laserdiode to ground. For proper functionality of the loade
17、r this solder joint must be remove after connection loader to the set.Type 1 Type 2(ESD protection point is accessible from top of loader) (ESD protection point is accessible from bottom of the loader)*Only applicable for defective loader needed to be sent back to supplier for failure analysis and t
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