Philips-HTS-3050-Service-Manual电路原理图.pdf

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1、Published by KC-TE 0552 AV Systems Printed in he Netherlands Subject to modication EN 3139 785 31790HTS3050/16DVD ReceiverCLASS 1LASER PRODUCT1 Technical Specications and ConnectionFacilities 22 Measurements Setup, Service Aid fr Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile

2、 sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con !GBAfter servicing and before returning set to customer perform a

3、leakagecurrent measurement test from all exposed metal parts to earth ground toassure no shock hazard exist. The leakage current must not exceed0.5mA.EN 73139 785 31790Measurements Setup, Service Aid & Lead Free Requirements 2.2.1 Lead Free RequirementsPb(Lead) Free SolderWhen soldering , be sure to

4、 use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules:Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free)

5、. So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact

6、the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature o

7、f 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temper

8、atures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid m

9、ixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-mat

10、erial (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be deliver

11、ed in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-web

12、site.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you

13、fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs and other ICs used in Philips-setsYou will fi nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-helpde

14、sk.EN 8 3139 785 317902. Measurements Setup, Service Aid & Lead Free Requirements2.2 Service HintsCAUTIONCHARGED CAPACITORS ON THE SERVO BOARD MAY DAMAGE THE DRIVE ELECTRONICS WHEN CONNECTING A NEW DRIVE.THATS WHY, BESIDES THE SAFETY MEASURES LIKE SWITCH OFF POWER SUPPLY ESD PROTECTIONADDITIONAL ACT

15、IONS MUST BE TAKEN BY THE REPAIR TECHNICIAN.The following steps have to be done when replacing the defective loader :1. Dismantling of the loader to access the ESD protection point if necessary.2. Solder the ESD protection point*. 3. Disconnect fl exfoil cable from the defective loader.4. Put a pape

16、r clip on the fl exfoil to short-circuit the contacts (fi g.1) 5. Replace the defective loader with a new loader.6. Remove paperclip from the fl exfoil and connect it to the new loader.7. Remove solder joint on the ESD protection point.ATTENTION: The laser diode of this loader is protected against E

17、SD by a solder joint which shortcircuits the laserdiode to ground. For proper functionality of the loader this solder joint must be remove after connection loader to the set.Type 1 Type 2(ESD protection point is access ble from top of loader) (ESD protection point is accessible from bottom of the lo

18、ader)*Only applicable for defective loader needed to be sent back to supplier for failure analysis and to support backcharging evidence.This is also applicable for all partnership workshops.EN 93139 785 31790Dismantling Instructions & Service Positions 2.3. Mechanical Instructions3.1 Dismantling of

19、the Front Board, PSU Module & DVD Loader.1) Release 4 snap hooks to remove the Front Board.- 1 snap hook each on the left & right side - 2 snap hooks on the bottom side2) Loosen 4 screws A (See Figure 3-1) to remove the PSU Module.Figure 3-13) Loosen 4 screws B (See Figure 3-2) to remove the DVD Loa

20、der.Figure 3-2A ABB3.2 Dismantling of the Tuner Module & Mono Board.1) Loosen 1 screw C (See Figure 3-3) to remove the Tuner Module.Figure 3-32) Loosen 2 screws D and E (See Figure 3-4 & Figure 3-5) to remove the Mono Board.Figure 3-4(AP) Figure 3-4(Europe)Figure 3-5CDEFEN 10 3139 785 317903. Dismantling Instructions & Service Positions3.3 Dismantling of the Amp-module Board1) Loosen 4 screws F and 2 screws G (See Figure 3-6 & Figure 3-7) to remove Amp-Module BoardFigure 3-6Figure 3-7GGH