Philips-MCD-703-Service-Manual电路原理图.pdf
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1、Version 1.1MCD703 3141 785 30931Service ManualDVD Micro Systemall versionsPublished by LX 0610 Service Audio Printed in The Netherlands Subject to modificationCopyright 2006 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced
2、, stored in a retrievalsystem or transmitted, in any form or by any means, electronic, mechanical, photocopying,or otherwise without the prior permission of Philips.Handling chip components .1-1Information about lead-free soldering.1-2Technical specification.2-1Service tools .2-1Service measurement
3、setup.2-2Connections and controls.3-1.3-3Troubleshooting.3-4.3-5Disassembly diagram .4-1.4-2Software version and upgrading.5-1Set block diagram.5-2Set wiring diagram.5-3VFD / KEY BOARD ASSEMBLYcircuit diagram .6-1layout diagram .6-2TUNER BOARD circuit diagram .7-1layout diagram .7-2DVD BLOCKcircuit
4、diagram .8-1 layout diagram .8-2AMP BLOCKcircuit diagram .9-1 layout diagram .9-2DVD MPEG BOARD circuit diagram .10-1.10-5layout diagram .10-6Exploded view diagram.11-1Mechanical partslist .11-2Electrical partslist.12-1.12-3Revision list.13-1TABLE OF CONTENTSCLASS 1LASER PRODUCT1 - 1HANDLING CHIP CO
5、MPONENTS1 - 2INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE i s producing lead-free sets from 1.1.2005 on w a rds. IDENT I FIC A TION: Regardless of special logo (not alw a ys indicated) one must treat all sets from 1 Jan 2005 on w a rds, according next rules: Example S/ N: Bottom line of typeplat
6、e gives a 14-digit S/N. Digit 5&6 is the y ear, digit 7&8 is the week number, so in this case 2 005 w k 12 So from 0501 on w a rds = from 1 J an 2005 on wards Im por t a n t no t e : In fac t also pro duct s of year 20 04 mus t be trea t e d in this way a s lon g as you av oid mixi n g sol d er-all
7、oys ( l eaded/ lead -fre e ). So b est to al ways use SAC 3 05 and the high er te mpera tures bel o n g t o t h is. Due to lead-free technolog y some rules have to be respected b y t he w o rkshop during a repair: Use onl y lead-f re e solder allo y Philips SAC305 w i th order code 0622 149 00106. I
8、f lead-free solder-pa ste is required, please co ntact the manufacturer of y o u r solder-equipment. In general use of so lder-paste w i thin w o rkshops should be avoided because paste is n ot eas y to store and to handle. Use onl y adequa te solder tools applicable for lead-free solder alloy . The
9、 solder tool must be able o To reach at least a solder-tempe r a ture of 40 o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust y o ur solder tool so that a temperature aroun d is reached and stabilized at the solder joint. Heating-t
10、ime of the solder-joint should not ex cee d 4 sec. Av oid temperatures above 4 00 othe rw ise w e ar-out of tips w ill rise drastically and f lu x-fluid w ill be destro yed . To avoid w ear-out of tips sw itch off un-used equipment, or reduce heat. Mix of lead-free s o lder alloy / parts w i th lead
11、ed solder alloy / pa rts is possible but PHILIPS recommends strongl y to av oid m ixed solder alloy t y pe s (leaded and lead-free ). If one cannot avoid or does not know whether prod uct is lead-free, clean carefull y the solder-joint from old solder alloy and r e-solde r wi th new solder alloy (SA
12、C305). Use onl y original spare-pa rts listed in the Service-Manuals. Not listed standard-m ateri al (commodities) has to be purcha sed a t external companies. Special information for B G A-ICs: - alwa y s use the 12nc-recogni zable soldering temperature profile of the specific BGA (for de-soldering
13、 alw a ys use the lead-free temperature profile, in case of doubt) - lead free B G A-I Cs w ill be delivered in so-called dry -packaging (sealed pack includi ng a silica gel pa ck) to protect the IC against moisture. After opening, depende n t of MSL-level seen on indicator-l abel in the bag, the BG
14、 A-I C possibly still has to be baked d ry . (MSL=Moistur e Sensitiv ity Level). This w ill be communicated via AY S-website. Do not re-use B G As at all. For sets prod uced before 1. 1.200 5 (except produc ts of 2004), cont aining leaded solder-allo y and co mponents, all needed spare- parts w ill
15、be available till the end of the service-period. For repair of such sets nothing changes. On ou r w ebsite www . a ty ourser v i ce .ce.Philips. com you find mo re information to: BGA-de -/soldering (+ baking instructions) Heating-p rofiles of BGAs and oth er ICs used in Ph ilips-sets Y ou w ill fin
16、d this and more technic al information w i thin the “magazin e“, chapter “w o r kshop ne w s “. For additional questions please contact y o u r local repair-helpdesk. SERVICE INSTRUCTION 1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.2. Set the AC Power swit
17、ch to the “on“ position (keep theAC Power cord unplugged!).3. Measure the resistance value between the pins of the AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be larger than 4.5 Mohm (For U.S. it should be between 4.2 Mohm and 12 Mohm).4
18、. Switch “off“ the set, and remove the wire between the two pins of the AC Power plug.Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention tothe following points: Route the wire trees correctly and fix them with themounted ca
19、ble clamps. Check the insulation of the AC Power lead for externaldamage. Check the strain relief of the AC Power cord for proper function. Check the electrical DC resistance between the AC PowerPlug and the secondary side (only for sets which have a ACPower isolated power supply): Check the cabinet
20、 for defects, to avoid touching of any inner parts by the customer.2 - 1GENERALMains voltage -/98/55 -/98/55 : 120 / 230 V -/37 -/37 : 120VMains frequency : 50 / 60 Hz :6 0 H zBattery for remote : 3V (R03, AAA x 2) Pow e r consumption Max. : 150cd/m2 Contrast dark room : 150 :1 LOUDSPEAKERS2-w ay ba
21、ss reflex sy stem Dimension (W x H x D) : 145 x 230 x 210 mm Weight : 2.4 Kg each SUBWOOFERDimension (W x H x D) : 80 x 270 x 330 mm Weight : 4.4 Kg SERVICE TOOLSAudio signal disc SBC 429 . .4822 397 30184Playability test disc SBC 444 .4822 397 30245Test disc 5 (disc without errors ) +Test disc 5A (
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