Philips-MCD-302-Service-Manual电路原理图.pdf
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1、DVD Micro System TABLE OF CONTENTS3141 785 34490XL 09432008Location of PC Boards . 1-1Electronic Specification . 1-2Measurement Setup . 1-3Service Aids . 1-4Items Of Safety Attention .1-5Instruction On CD Playability .1-7 to 1-8Software Version Check include 60%Tin 40% lead.To maintain soldering iro
2、n and its tin very well.Use the wire brush but not spray cleaners such as Freon to clean the soldering surface.Adopt the melting ways:a) The temperature of soldering horn range from 350 to 390.b) Heat up the parts pin, until soldering tin is molten.c) Use the desoldering pump to suck out the molten
3、soldering tinquickly.Note: Quickly operating can prevent superheating the electronic-plating copper.Adopt the following soldering ways.a) The temperature of soldering horn range from 350 to 390. b) Hold the soldering iron and welding rod pointed to the parts pin,until soldering tin is molten. Then m
4、ove the soldering horn quickly to the location that you want to solder. Note: Quickly operating can prevent superheating electronic-plating copper of printed circuit board.c) Check the welting zone carefully, then brush the unwanted soldering tin away with a wire brush.Unsolder/Replace ICNotes:Do no
5、t touch the IC body directly with soldering iron. Pre-heating soldering iron at about 130 for some seconds avoid the damages caused by IC heated suddenly. For normal IC, the temperature of the solder horn is about 350, and can increase to 390 for some bigger IC.Use the filamentous welding rod and so
6、lder which thickness is about 0.3mm to solder thin IC and add the solder as needed.Replace the IC carefully and solder it quickly.After unsoldering the IC, clean the basic board carefully to ensure the board is usable.Prevent the molten soldering tin dripping on the board which will engender a short
7、 circuit.Aim at the first terminal and fix it, then aim at other terminals for correctly inserting IC. You can solder quickly just like this.Before operating, please make sure the IC is unusable. Do not unsolder repeatedly. During soldering especially soldering a thin IC with many pins, check the we
8、ld carefully.After replacing, check that there is not soldering leak, rosin joint, short circuit and so on. Unsolder:Use the soldering iron to melt the soldering tin.Before unsoldering IC, suck out the molten solder tin.ReplaceMake sure all the IC pins are on their correct location, then solder.Use
9、a wire brush to clean the welting zone.6HWUHPDLQVFORVHG13ODD&IRUDWOHDVWPLQXWHVSODDELOLWRN“1SODDELOLWRN“DGG,QIRIRUFXVWRPHU6(72.FKHFNSODDELOLW1SODDELOLWRN“FKHFNSODDELOLWFKHFNSODDELOLWUHWXUQVHW&XVWRPHUFRPSODLQW&UHODWHGSUREOHPIDVWOHQVFOHDQLQJ)RUIODSORDGHUV DFFHVVWR&GULYHSRVVLEOH FOHDQLQJPHWKRG LVUHFRPPH
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