Philips-DVP-3356-Service-Manual电路原理图.pdf

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1、TABLE OF CONTENTS Page Version 1.0 Service Manual . Technical Specifications.1-2 . Safety Instruction, Warning 525 (NTSC/60Hz) Playback: Multi-standard (PAL/NTSC) Video performance Video DAC: 12 bits, 108 MHz Y Pb Pr: 0.7 Vpp 75 ohm Video output: 1 Vpp 75 ohm Video format Digital compression: MPEG 2

2、: DVD/SVCD MPEG 1: VCD/DivX Horizontal resolution: DVD: 720 pixels (50 Hz); 720 pixels (60 Hz) VCD: 352 pixels (50 Hz); 352 pixels (60 Hz) Vertical resolution: DVD: 576 lines (50 Hz); 480 lines (60 Hz) VCD: 288 lines (50 Hz); 240 lines (60 Hz) Audio performance DA converter: 24 bits, 192 kHz Frequen

3、cy response: DVD: 4 Hz - 22 kHz (48 kHz); 4 Hz - 44 kHz (96 kHz) SVCD: 4 Hz - 20 kHz (44.1 kHz); 4 Hz - 22 kHz (48 kHz) CD/VCD: 4 Hz - 20 kHz (44.1 kHz) Signal-Noise (1 kHz): 90 dB (A-weighted) Dynamic range (1 kHz): 80 dB (A-weighted) Crosstalk (1 kHz): 70 dB Distortion/noise (1 kHz): 65 dB MPEG MP

4、3: MPEG Audio L3 Audio format Digital: MPEG/AC-3/PCM: Compressed digital (16, 20, 24 bits fs, 44.1, 48, 96 kHz) MP3 (ISO 9660): 96, 112, 128, 256 kbps IEC61937 for MPEG 1/2, Dolby Digital 5.1 channel analog output Audio Front L + R: Cinch (white/red) Audio Rear L + R: Cinch (white/red) Audio Center:

5、 Cinch (blue) Audio Subwoofer: Cinch (black) Main unit Dimensions (w x h x d): 360 x 37 x 209 (mm) Net Weight: approximately 1.3 kg Power Power supply rating: 110 V - 240V; 50/60 Hz Power consumption: 10 W Power consumption in standby mode: 1 W Laser Speci cation Type: Semiconductor laser InGaAIP (D

6、VD), AIGaAs (CD) Wave length: 658 nm (DVD), 790 nm (CD) Output Power: 7.0 mW (DVD), 10.0 mW (VCD/CD) Beam divergence: 60 degrees 1-2Safety instruction 1. General safety Safety regulations require that during a repair: . Connect the unit to the mains via an isolation transformer. . Replace safety com

7、ponents indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that after a repair, you must return the unit in its original condition. P

8、ay, in particular, attention to the following points: . Route the wires/cables correctly, and fix them with the mounted cable clamps. . Check the insulation of the mains lead for external damage. . Check the electrical DC resistance between the mains plug and the secondary side: 1) Unplug the mains

9、cord, and connect a wire between the two pins of the mains plug. 2) Set the mains switch the “on” position (keep the mains cord unplug). 3) Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom. 4) Repair or correct unit when the resistance measurement

10、 is less than 1M . 5) Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492). 6) Switch the unit “off”, and remove the wire between the two pins of the mains plug. 2.Laser safety This unit employs a laser. Only qualified service personnel may remove the cover, or at

11、tempt to service this device (due to possible eye injury). Laser device unit T ype : Semiconductor laser GaAlAs Wavelength : 650nm (DVD) : 780nm (VCD/CD) Output power : 7mW (DVD) : 10mW (DVD /CD) Beam divergence: 60 degree Note: Use of controls or adjustments or performance of procedure other than t

12、hose specified herein, may result in hazardous radiation exposure. Avoid direct exposure to beam. Safety instruction, Warning & Notes 1-3Warning 1.General . All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD). Careless handing during repair can reduce life drastic

13、ally. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: 1) Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth c

14、able) 4822 310 10671. 2) Wristband tester 4822 344 13999. . Be careful during measurements in the live voltage section. The primary side of the power supply , including the heat sink, carries live mains voltage when you connect the player to the mains (even when the player is “off”!). It is possible

15、 to touch copper tracks and/or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A “lighting stroke” and a stripe-marked printing on the printed wiring board, indicate the primary

16、 side of the power supply. . Never replace modules, or components, while the unit is “on”. 2. Laser . The use of optical instruments with this product, will increase eye hazard. . Only qualified service personnel may remove the cover or attempt to service this device, due to possible eye injury. . R

17、epair handing should take place as much as possible with a disc loaded inside the player. . Text below is placed inside the unit, on the laser cover shield: Notes: Manufactured under licence from Dolby Laboratories. The double-D symbol is trademarks of Dolby Laboratories, Inc. All rights reserved. C

18、AUTION: VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN, AVOID EXPOSURE TO BEAM. 1-4Lead-Free requirement for service INDENTIFICATION: Regardless of special logo (not always indicated) One must treat all sets from 1.1.2005 onwards, according next rules. Important note: In fact also products a little

19、 older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy

20、Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicabl

21、e for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and s

22、tabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder al

23、loy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts l

24、isted in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use highest lead-free temperature profile

25、, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. This will be com

26、municated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website: www.atyourservice.ce.P You fi

27、nd more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. Notes 1-

28、5Product overview Main unit a2 (Standby-on) Turn on the DVD player or switch to standby mode. b Disc compartment c Display panel d Z (Open/Close) Open or close the disc compartment. e u (Play/Pause) Start, pause or resume disc play. f (USB) jack Connect a USB ash drive. 4 3 1 2 6 5 Remote control 4

29、3 6 7 9 8 1 5 2 16 17 12 15 13 14 10 11 18 a2 (Standby-On) Turn on the DVD player or switch to standby mode. b Z (Open/Close) Open or close the disc compartment. c DISC MENU Access or exit the disc menu. Switch to disc mode. For VCD/SVCD, turn PBC (Playback Control) on or off in PBC mode. 2-1d v V b

30、 B (Navigation buttons) Navigate through the menus. Search fast-forward ( B) or fast- backward (b). Press repeatedly to change the search speed. Search slow-forward ( v) or slow- backward (V). Press repeatedly to change the search speed. e BACK Return to the previous display menu. For DVD, navigate

31、to the title menu. For VCD version 2.0 or SVCD with PBC turned on, return to the menu. f / (Previous/Next) Skip to the previous or next title, chapter, or track. Press and hold for fast-backward or fast-forward search. g (USB) Switch to USB mode and display the content. h Numeric buttons Select an i

32、tem to play. i SUBTITLE Select DVD or DivX subtitle language. Access the menu to USB copy or USB delete. j, ZOOM Fit the picture format to the TV screen. Zoom in or out of the picture. k VOLUME Display the current volume level and use (b) or (B) navigation buttons to set the volume level between 0 2

33、0. l REPEAT/ REPEAT A-B Toggles between various repeat modes. Marks the section for repeat play, or turns off repeat mode. m AUDIO/CREATE MP3 Select an audio language/channel. Access the menu to create MP3. n x (Stop) Stop disc play. o u (Play/Pause) Start, pause or resume disc play. p INFO For disc

34、, display the current status or disc information. For slideshows, display a thumbnail view of photo les. q OK Con rm an entry or selection. r SETUP Access or exit the setup menu. 2-2Mechanical and Dismantling Instructions Dismantling Instruction The following guidelines show how to dismantle the pla

35、yer. Step1: Remove 5 screws around the Top Cover, and then remove the Top Cover (Figure 1). Figure 1 Step2: If it is necessary to dismantle Loader or Front Panel, the Front door should be removed first. (Figure 2) Note: Make sure to operate gently otherwise the guider would be damaged. Figure 2 3-1

36、Please kindly note that dismantle the front door assembly carefully to avoid damage tray and the front door. Detailed information please refer to the model set.Mechanical and Dismantling Instructions Dismantling Instruction Step3: If the tray cant open in normal way, you can make it through the inst

37、ruction as below (Figure 3). Note: Make sure to operate gently otherwise the guider would be damaged. Figure 3 Step4: Dismantling Front Panel, disconnect the connectors (XP5, XP6. XP7), need release 4 snaps of Front Panel and 2 snaps of bottom cabinet , then gently pull the Panel out from the set. (

38、Figure 4 - Figure 6) Figure 4 3-2 Detailed information please refer to the model set. XP2 XP3 XP4 XP5 XP1 XP7 SNAP SNAP SNAP SNAP SNAP3-3 Mechanical and Dismantling Instructions Dismantling InstructionFigure 5 Step5: Dismantling Loader, disconnect the 3 connectors (XP2, XP3, XP4) aiming in the below

39、 figure, and remove 1 screw that connects the loader and the bottom cabinet. (Figure 5 & 6) Figure 6 Detailed information please refer to the model set.Mechanical and Dismantling Instructions Dismantling Instruction Step6: Dismantling Main Board, first disconnect the connector (XP1), and then remove 5 screws. (Figure 7) Figure 7 Step7: Remove the 2 screws on Power Board to dismantle the Power Board. (Figure 7) 3-4 Detailed information please refer to the model set.