Philips-DVP-620-VR-Service-Manual电路原理图.pdf
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1、ContentsChapterTechnical SpecificationsSchematic Diagrams and CBAsExploded ViewsMechanical and Electrical Parts ListsSec. 1: Sec. 2: Standard MaintenanceMechanism Alignment ProceduresDisassembly / Assembly of MechanismDeck Exploded ViewsSurvey of versions:Published by FU 0436 Service AVS Printed in
2、The Netherlands Subject to modificationVersion 1.0/04 PALDVD + VCR Combi DVP620VR/04cCopyright 2004 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means
3、, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.CLASS 1 LASER PRODUCTKLASSE 1 LASER PRODUKTKLASS 1 LASER APPARATCLASSE 1 PRODUIT LASERGB 3139 785 30810Service ManualServiceServiceServiceMAIN SECTIONDIGITAL VIDEO DISC PLAYER when removing entire flat pack-
4、IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Caution:1. The Flat Pack-IC shape may differ by models. Usean appropriate hot-air flat pack-IC desolderingmach
5、ine, whose shape matches that of the FlatPack-IC.2. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damage tothe chip parts may occur. Put masking tape aroundthe flat pack-IC to protect other parts from damage.(Fig. S-1-2)Top ViewOut InBottom ViewInput510Pin
6、 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-11-3-2 NOTE_13. The flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC when removingit.With Soldering Iron:(1) Using desoldering braid, remov
7、e the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Lift each lead of the flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating th
8、e pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)(3) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Rel
9、ease the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)With Iron Wire:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Affix the wire to a workb
10、ench or solid mountingpoint, as shown in Fig. S-1-5.(3) While heating the pins using a fine tip solderingiron or hot air blower, pull up the wire as the soldermelts so as to lift the IC leads from the CBA contactpads as shown in Fig. S-1-5Fig. S-1-2Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-I
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