Philips-DVDR-3545-V-Service-Manual电路原理图.pdf

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1、ContentsChapterSec. 1: Adjustment ProceduresSchematic Diagrams and CBAsExploded ViewsMechanical and Electrical Parts ListsSec. 2: Standard MaintenanceMechanism Alignment ProceduresDisassembly / Assembly of MechanismDeck Exploded ViewsDeck Parts ListSurvey of versions:Published by FU-KC 0715 Service

2、AV Systems Printed in The Netherlands Subject to modificationVersion 1.1/37 NTSCDVD Recorder when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers

3、. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may o

4、ccur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)Fig. S-1-11-3-3 DVDN_PC_SN3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.With Soldering Iro

5、n:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will

6、not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove

7、 (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)With Iron Wire:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily

8、. (Fig. S-1-3)2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.4. Bottom of th

9、e flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)Note: When using a soldering iron

10、, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-2Flat Pack-ICDesoldering Brai

11、dSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-4To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-61-3-4 DVDN_PC_SN2. Installation1. Using desoldering braid, remove the solder from the foil of each pin of th

12、e flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.2. The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8

13、.)3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.Instructions for Handling Semi-conductorsElectrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work.1. Ground for Hum

14、an BodyBe sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body.2. Ground for WorkbenchBe sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors

15、 are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.Example :Pin 1 of the Flat Pack-ICis indicated by a “ “ mark.Fig. S-1-7PresolderCBAFlat Pack-ICFig. S-1-8CBAGroundin

16、g BandConductive Sheet orCopper Plate1M1MCBA1-4-1 E9H90FISFUNCTION INDICATOR SYMBOLSNote:If a mechanical malfunction occurs, the power is turned off. When the power comes on again after that bypressing button, an error message is displayed on the TV screen for 5 seconds. TV screenWhen reel or capsta

17、n mechanism is not functioningcorrectlyWhen tape loading mechanism is not functioning cor-rectlyWhen cassette loading mechanism is not functioningcorrectlyWhen the drum is not working properlyP-ON+5V Power safety detectionLed Mode Indicator ActiveWhen reel or capstan mechanism is not functioning cor

18、rectly“A R” is displayed on a TV screen. (Refer to Fig. 1.)When tape loading mechanism is not functioning correctly“A T” is displayed on a TV screen. (Refer to Fig. 2.)When cassette loading mechanism is not functioning correctly“A C” is displayed on a TV screen. (Refer to Fig. 3.)When the drum is not working properly“A D” is displayed on a TV screen. (Refer to Fig. 4.)P-ON+5V Power safety detection“A P” is displayed on a TV screen. (Refer to Fig. 5.)ARSP 0:00:00Fig. 1ATSP 0:00:00Fig. 2ACSP 0:00:00Fig. 3ADSP 0:00:00Fig. 4APSP 0:00:00Fig. 5