Philips-DVD-740-VR-Service-Manual电路原理图.pdf
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1、Published by MW 0269 Service PaCE Printed in the Netherlands Subject to modification EN 3122 785 12940Copyright 2002 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any f
2、orm or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.DVD-Video Player DVD740VRDVD740VR /001 /051Contents PageLaser Beam Safety Precautions 1-1-1Important Safety Precautions 1-2-1Preparation for Servicing 1-3-1Standart Notes for Servicing 1-4
3、-1Operating Controls and Functions 1-5-1Signal Name Abbreviations 1-6-1Cabinet Disassembly Instructions 1-7-1Electrical Adjustment Instructions 1-8-1Firmware Renewal Mode 1-9-1Block Diagrams 1-10-1Schematic Diagrams/CBAs and Test Points 1-11-1Waveforms 1-12-1Wiring Diagram 1-13-1System Control Timin
4、g Charts 1-14-1IC Pin Function Descriptions 1-15-1Lead Identifications 1-16-1Exploded Views 1-18-1Spare Parts ListMAIN SECTIONDIGITAL VIDEO DISC PLAYER when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-
5、6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Caution:1. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damage tothe chip parts may occur. Put masking tape aroundthe flat pack-IC to protect other parts from damage.(Fig. S-1-2)2. T
6、he flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC when removingit.Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-1Hot-airFlat Pack-ICDesolderingMach
7、ineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-21-3-2 NOTE_1-3With Soldering Iron:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Lift each lead of the
8、flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating the pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)(3) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first
9、applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)With Iron Wire:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder flux
10、which is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Affix the wire to a workbench or solid mountingpoint, as shown in Fig. S-1-5.(3) While heating the pins using a fine tip solderingiron or hot air blower, pull up the wire as the soldermelts so as to lift the I
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