Philips-BDP-5506-F-7-Service-Manual电路原理图.pdf
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1、SERVICE MANUALBLU-RAY DISC PLAYERBDP5506/F7IMPORTANT SAFETY NOTICEProper service and repair is important to the safe, reliable operation of all P when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4.
2、 Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat pack-IC for
3、over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-11-4-2 BDN_SN3. The flat pack-IC on the C
4、BA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.With Soldering Iron:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat
5、pack-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of the flat pack
6、-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)Hot-airFlat Pack-ICDesolderingMachineCBAFlat
7、 Pack-ICTweezersMasking TapeFig. S-1-2Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-41-4-3 BDN_SNWith Iron Wire:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the
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