索尼 sony_MZ-R50_service_manual 电路图 维修手册.pdf
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1、MICROFILM MZ-R50 SERVICE MANUAL PORTABLE MINIDISC RECORDER SPECIFICATIONS US Model Canadian Model AEP Model UK Model E Model Australian Model Tourist Model Model Name Using Similar Machanism NEW MD Machanism Type MT-MZR-50-143 Optical Pick-up Type KMS-280A US and foreign parts licensed Dolby Laborat
2、ories Licensing Corporation. System Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAIAs Wavelength: l = 780 nm Emission duration: continuous Laser output: less than 44.6 m W (This output is the value measured at a distance of 200 mm from the lens surface on the
3、 optical pick-up block with 7 mm aperture.) Recording and playback time Maximum 74 minutes (MDW-74, stereo recording) Maximum 148 minutes (MDW-74, monaural recording) Revolutions 400 rpm to 900 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1 kHz
4、 Sampling rate converter Input: 32 kHz / 44.1 kHz / 48 kHz Coding Adaptive Transform Acoustic Coding (ATRAC) Modulation system EFM (Eight to Fourteen Modulation) Number of channels 2 stereo channels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Inp
5、uts Microphone: stereo mini-jack, 0.22-0.78 mV Line in: stereo mini-jack, 69-194 mV Optical (Digital) in: optical (digital) mini-jack Outputs Headphones: stereo mini-jack, maximum output level 5 mW+ 5 mW, load impedance 16 ohm Line out: stereo mini-jack, 194 mV , load impedance 10 kilohm General Pow
6、er requirements Sony AC Power Adaptor (supplied) connected at the DC IN 6 V jack: 120 V AC, 60 Hz (US, Canadian model) 220-230 V AC, 50/60 Hz (AEP model) 230-240 V AC, 50/60 Hz (UK, Hong Kong model) 240 V AC, 50/60 Hz (Australian model) 100-240 V AC, 50/60 Hz (E, Tourist model) Lithium ion rechargea
7、ble battery LIP-8 (supplied) Two LR6 (size AA) alkaline batteries (not supplied) Continued on page 2 2 Specifications . 1 1. SERVICING NOTE . 3 2. GENERAL Location and Function of Controls . 4 3. DISASSEMBLY 3-1. Upper Panel Assy, Bottom Panel Assy Removal . 20 3-2. Main Board Removal . 21 3-3. Mech
8、anism Deck (MT-MZR50-143) Removal . 21 3-4. Optical Pick-up Assy, REC Board Removal . 22 3-5. CLV Board Removal . 22 3-6. Battery Case Assy Removal . 23 3-7. Power Board, Switch Board Removal . 23 3-8. Switch Unit (with JOG Dial) Removal . 24 4. TEST MODE . 25 5. ADJUSTMENTS . 31 6. DIAGRAMS 6-1. Ex
9、planation of IC Terminals . 35 6-2. Block Diagrams . 39 6-3. Circuit Boards Location . 43 6-4. Printed Wiring Boards Main Section . 45 6-5. Schematic Diagram Main (1/3) Section . 49 6-6. Schematic Diagram Main (2/3) Section . 53 6-7. Schematic Diagram Main (3/3) Section . 57 7. EXPLODED VIEWS 7-1. U
10、pper Panel, Bottom Panel Section . 65 7-2. Chassis Section . 66 7-3. Mechanism Deck Section . 67 8. ELECTRICAL PARTS LIST . 68 ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT
11、DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRI
12、TICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the sa
13、me conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. TABLE OF CONTENT
14、S This MiniDisc Recorder is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the buttom exterior. For customers in Europe Battery operation time See “Battery life” Battery life Batteries Recording Playback LIP-8 lithium ion Approx. Approx. Rechargeable battery 4 h
15、ours 7 hours Two LR6 (size AA) Approx. Sony alkaline dry batteries 12 hours LIP-8 + Two LR6 (size AA) Approx. 22 hours Dimensions Approx. 109.5 x 19.7 x 77 mm (w/h/d) (4 3 /8 x 25 /32 x 3 1 /8 in.) Mass Approx. 190 g (6.8 oz) the recorder only Approx. 240 g (8.5 oz) incl, a recordable MD, and LIP-8
16、lithium ion rechargeable battery Supplied accessories AC power adaptor (1) Headphones with a remote control (1) LIP-8 lithium ion rechargeable battery (1) Dry battery case (1) Ear pads (2) Carrying case (1) Design and specifications are subject to change without notice. 3 SECTION 1 SERVICING NOTE Wh
17、en repairing this device with the power on, if you remove the main board or open the upper panel assembly, this device stops working. In this case, you can work without the device stopping by fastening the hook of the Open/Close detection switch (S817) with tape Upper panel assy Main board Door open
18、/close switch (S817) Tape 4 SECTION 2 GENERAL This section is extracted from instruction manual. 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SECTION 3 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 3-1. UPPER PANEL ASSY, BOTTOM PANEL ASSY REMOVAL rThe equipment can
19、be removed using the following procedure. Set Upper panel assy, Bottom panel assy Main board Mechanism deck SWITCH UNIT (with JOG DIAL) Power board, Switch board CLV board Optical pick-up assy, REC board Battery case assy 7 3 1 Screws(M1.4 precision pan) Upper panel assy 2 Knob (Open) 4 Screws(M1.4
20、precision pan) 6 Screw(M1.4 precision pan) 5 Screws(M1.4 precision pan) Bottom panel assy 21 3-3. MECHANISM DECK (MT-MZR50-143) REMOVAL 3-2. MAIN BOARD REMOVAL 8 7 LCD flexible board (Main board CN803) 1 Screws(M1.4 toothed lock) 5 Flat cable (24 core)(Main board CN801) 3 OP flexible board(Main boar
21、d CN501) 4 JOG unit flexible board(Main board CN904) 6 MD frexible board(Main board CN502) 2 Screw (HP) Main board 3 Mechanism deck 1 Screws (Damper) 2 Remove the damper (snap) retaining ring section. 22 3-4. OPTICAL PICK-UP ASSY, REC BOARD REMOVAL 3-5. CLV BOARD REMOVAL 3 6 Optical pick-up assy 2 S
22、crews(M1.4x3.0 locking) 5 Screw REC board 1 OP flexible board 4 MD flexible board 3 2 Remove solder CLV board 1 Screws(M1.4 precision pan) Mechanism deck 23 3-6. BATTERY CASE ASSY REMOVAL 3-7. POWER BOARD, SWITCH BOARD REMOVAL 3 3 4 1 Battery case assy Chassis (Main) assy 2 Screws(M1.4 precision pan
23、) 5 4 4 3 Remove solder 2 Remove solder Power board Switch board Battery case assy 1 Screws(M1.4 toothed lock) 24 3-8. SWITCH UNIT (WITH JOG DIAL) REMOVAL 3 5 2 Switch unit (with JOG dial) Ornamental belt assy 4 Screws (1.7) 1 Screw(Precision) Chassis (Main) assy Holder (dial) 25 SECTION 4 TEST MODE
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