JBL-SG2020-cs-psm 维修电路原理图.pdf

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1、 Soundgear SeriesSG2020 SG30303 CD Changer Hi-Fi SystemPRELIMINARYSERVICE MANUALJBL Incorporated, Inc.250 Crossways Park Dr.Woodbury, New York 11797RadioFans.CN 收音机爱 好者资料库CONTENTSSERVICING PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3ESD PRECAUTIONS . . . . . . . . . . . . .

2、 . . . . . . . . . . . . . . . . . . . . . . . .5SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6ADJUSTMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7TROUBLESHOOTING GUIDE. . . . . . . . . . . . . . . . . . . . . .

3、 . . . . . . . .9WAVEFORMS OF MAJOR CHECK POINTS . . . . . . . . . . . . . . . . . .14WIRING DIAGRAM (SG2020). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15WIRING DIAGRAM (SG3030). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16BLOCK DIAGRAM (SG2020) . . . . . . . . . .

4、 . . . . . . . . . . . . . . . . . . . .17BLOCK DIAGRAM (SG3030). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18SCHEMATIC DIAGRAMS (SG2020/3030). . . . . . . . . . . . . . . . . . . . .19PCB BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35PA

5、CKAGE PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . . . . .40MECHANICAL PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . .40ELECTRICAL PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . . .43PACKAGE PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . .

6、 . . . . . .54MECHANICAL PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . .54ELECTRICAL PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . . .57RadioFans.CN 收音机爱 好者资料库-3-SERVICING PRECAUTIONSNOTES REGARDING HANDLING OF THE PICK-UP1. Notes for transport and storage1) The pic

7、k-up should always be left in its conductive bag until immediately prior to use.2) The pick-up should never be subjected to external pressure or impact.2. Repair notes1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.2) The pick-up should always

8、be handled correctly and carefully, taking care to avoid external pressure andimpact. If it is subjected to strong pressure or impact, the result may be an operational malfunctionand/or damage to the printed-circuit board.3) Each and every pick-up is already individually adjusted to a high degree of

9、 precision, and for that reasonthe adjustment point and installation screws should absolutely never be touched.4) Laser beams may damage the eyes!Absolutely never permit laser beams to enter the eyes!Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged

10、.5) Cleaning the lens surfaceIf there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as usedfor camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot-ton swab should be used, taking care not to distort this.6) N

11、ever attempt to disassemble the pick-up.Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Donot use any other liquid cleaners, because they will damage the lens.) Take care not to use too much ofthis alcohol on the swab, and do not allow the alco

12、hol to get inside the pick-up.Storage in conductive bagNEVER look directly at the laser beam, and dont let contactfingers or other exposed skin.MagnetHow to hold the pick-upConductive SheetCotton swabPressurePressureDrop impact-4-NOTES REGARDING COMPACT DISC PLAYER REPAIRS1. Preparations1) Compact d

13、isc players incorporate a great many ICs as well as the pick-up (laser diode). These compo-nents are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage,components can be damaged, and for that reason components should be handled with care.2) The pick-

14、up is composed of many optical components and other high-precision components. Care mustbe taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strongmagnetism is present, or where there is excessive dust.2. Notes for repair1) Before replacing a component par

15、t, first disconnect the power supply lead wire from the unit2) All equipment, measuring instruments and tools must be grounded.3) The workbench should be covered with a conductive sheet and grounded.When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This i

16、sbecause there is the possibility of damage by static electricity.)4) To prevent AC leakage, the metal part of the soldering iron should be grounded.5) Workers should be grounded by an armband (1M)6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to p

17、reventstatic electricity changes in the clothing to escape from the armband.7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.CLEARING MALFUNCTIONYou can reset your unit to initial status if malfunction occur(button malfunction, display, etc.).Using a pointed g

18、ood conductor(such as driver), simply short the RESET jump wire on the inside of thevolume knob for more than 3 seconds.If you reset your unit, you must reenter all its settings(stations, clock, timer)NOTE: 1. To operate the RESET jump wire, pull the volume rotary knob and release it.2. If you wish

19、to operate the RESET jump wire, it is necessary to unplug the power cord.Resistor(1 Mohm)VOLUMEUPDOWNVOLUME KNOBRESET jump wireConductiveSheetResistor(1 Mohm)Armband-5-ESD PRECAUTIONSElectrostatically Sensitive Devices (ESD)Some semiconductor (solid state) devices can be damaged easily by static ele

20、ctricity. Such components com-monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir-cuits and some field-effect transistors and semiconductor chip components. The following techniques shouldbe used to help reduce the incidence of component dam

21、age caused by static electricity.1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain offany electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device, whic

22、h should be removed for potential shock reasonsprior to applying power to the unit under test.2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.3.

23、Use only a grounded-tip soldering iron to solder or unsolder ESD devices.4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-staticcan generate electrical charges sufficient to damage ESD devices.5. Do not use freon-propelled chemicals. These can gene

24、rate electrical charges sufficient to damage ESDdevices.6. Do not remove a replacement ESD device from its protective package until immediately before you areready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together byconductive foam, aluminum foil or c

25、omparable conductive materials).7. Immediately before removing the protective material from the leads of a replacement ESD device, touch theprotective material to the chassis or circuit assembly into which the device will by installed.CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT,

26、AND OBSERVE ALLOTHER SAFETY PRECAUTIONS.8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-erate static electricity sufficient to damage a

27、n ESD device).-6-SPECIFICATIONSSECTIONSG2020SG3030AMPOutput Power65W+65W (6, 2ch, T.H.D 10%)30W+30W (6, 2ch, T.H.D 10%)Woofer60W+60W (6, 2ch, T.H.D 10%)Frequency Response(MAIN)4025,000 Hz20025,000 HzFrequency Response(Woofer)45120 HzSignal-to-Noise Ratio83dB83dBTunerFMTuning Range(OPTICAL)87.5 108 M

28、Hz87.5 108 MHzIntermediate Frequency10.7 MHz10.7 MHzSignal-to-Noise Ratio61/58 dBA61/58 dBA(Mono/Stereo, 98MHz)Frequency Response6010,000 Hz20010,000 HzAM(MW)Range(OPTICAL)5221,611 kHz or 5301,720 kHz5221,611 kHz or 5301,720 kHzIntermediate Frequency450 kHz450 kHzFrequency Response1002,000 Hz2002,00

29、0 HzSW(OPTICAL)Tuning Range5.818.0 MHz5.818.0 MHzIntermediate Frequency450 kHz450 kHzSignal-to-Noise Ratio(11MHz)35 dB35 dB 3LW(OPTICAL)Tuning Range153281 kHz153281 kHzIntermediate Frequency450 kHz450 kHzSignal-to-Noise Ratio(11MHz)28 dB28 dB CASSETTE DECKFF, REW Time (C-60)120 sec.120 sec.Frequency

30、 Response1258,000 Hz25018,000 HzSignal-to-Noise Ratio43dB(P/B), 43dB(R/P)43dB(P/B), 43dB(R/P)Channel Separation50dB(P/B), 45dB(R/P)50dB(P/B), 45dB(R/P)CDFrequency Response4018,000 Hz2008,000 HzSignal-to-Noise Ratio70 dB70 dBGENERALPower RequirementsRefer to the back panel of the unit.Refer to the ba

31、ck panel of the unit.Net Dimensions(WxHxD)273 x 326 x 344 mm273 x 326 x 344 mmNet Weight? kg? kgSpeaker SystemTypeBass Reflex 2 Way Bi AMP3 Speaker System(Main Speaker, Super Woofer)3 Speaker SystemImpendance66Frequency Response(MAIN)6020,000 Hz14020,000 HzSound Pressure Level(MAIN)85 dB/W(1m)90 dB/

32、W(1m)Rated Input Power(MAIN)65 W30 WRated Input Power(SUPER WOOFER)60 WMax. Input Power(MAIN)130W60 WMax. Input Power(SUPER WOOFER)120 WNet Dimensions(WxHxD)220 x 326 x 252 mm220 x 372 x 252 mmNet Weight? kg? kg: EUROPE : ULNOTE: Designs and specification are subject to change without notice for imp

33、rovement.-7-ADJUSTMENTSThis set has been aligned at the factory and normally will not require further adjustment. As a result, it is notrecommended that any attempt is made to modificate any circuit. If any parts are replaced or if anyone tam-pers with the adjustment, realignment may be necessary.IM

34、PORTANT1. Check Power-source voltage.2. Set the function switch to band being aligned.3. Turn volume control to minimum unless otherwise noted.4. Connect low side of signal source and output indicator to chassis ground unless otherwise specified.5. Keep the signal input as low as possible to avoid A

35、GC and AC action.TAPE DECK ADJUSTMENT1. AZIMUTH ADJUSTMENT2. NORMAL SPEED ADJUSTMENTDeck ModeA Deck PlaybackMTT-114Speaker OutDECK ScrewAzimuth ScrewMaximumB Deck PlaybackMTT-114Speaker OutAzimuth ScrewMaximumTest TapeTest PointAdjustmentAdjust forDeck ModeNormal SpeedMTT-111Speaker OutVR2013kHz 1%H

36、i-SpeedMTT-111Speaker Outmore than 5.4kHzA DeckHi-SpeedDubbing ModeTest TapeTest PointAdjustmentAdjust forRemarkCH1 CH2Speaker OutPlayback ModeHeadTest TapeMTT-114L chR chGNDDual-tracesynchroscopeElectronicVoltmeterL outR outUnitFigure 1. Azimuth Adjustment Connection DiagramHeadPlayback ModeUnitSpe

37、aker OutGNDL outR outRecord/PlaybackheadTest TapeMTT-111Frequency CounterFigure 2. Normal Speed Adjustment Connection Diagram3. RECORD BIAS ADJUSTMENT4. TUNER ADJUSTMENT-8-Deck ModeRec/PauseMTT-5511ERASE HEADWIRE(PN402)L20160kHz5kHz (Auto-stop)85kHz5kHz (Auto-Reverse)Test TapeTest PointAdjustmentAdj

38、ust forItemDC VoltageChecker PinTP101, 1020V50mVTest PointAdjustmentAdjust forHeadUnitPN402GNDRecord/PlaybackheadTest TapeMTT-5511Record/Playbackand Pause ModeFrequency CounterFigure 3. Record Bias Adjustment Connection DiagramUnitSignal GeneratorGNDElectronicOSCILLOSCOPEFM AntennaTerminalSpeakeFigu

39、re 4. Tuner(S curve) Adjustment Connection Diagram-9-TROUBLESHOOTING GUIDETurn power on.Is power on?Does initial read work?Does it play?Does it output audio?Check power supply circuit.(Check PN 807)Check laser circuit.Check focus circuit.Check disc.Check tracking servo circuit.Check audio circuit.OK

40、YESYESYESYESNONONONOFails to initial read-10-1.3VABYESYESYESYESYESYESYESYESNONONONONONONONONONODoes laser light?Disc motor turns.Does RFwaveformappear?TP 801(RF)Does trackingservo work?Lower envelopeof TP801(RF)waveform is flat.Does signalappear atTP801(TEO)?Does signal appear at IC 803Pin and Pin ?

41、Does GFS (IC802 pin )show as below?Is rotation normal?Is there no dropout of RFsignal?Does TE2 signalappear at pin53of IC801?Defective IC801, pick upand/or openwire.Detective pattern.Defective IC 801and/or IC 803Defective pick-upand/or connector.Defective IC 801.Scratch in discinitial read area.Defe

42、ctive pick-upadjustment focus offset.262725-11-ANONONONONONOLaser does not light.Is “3.5V” applied to pin of IC 801?Is power supplied to laser Q801?(Q 801 collector: about 1.8V)Does laser current flow?1.0V across R801Is data transferred fromMICOM IC ?Does voltage appear at IC803 pin , ?Defective MIC

43、OM.Defective MICOM.Defective connector.Defective IC 801, 803 Defective slide motor and/orconnector.Defective LMT SW and/orconnector.Defective Q 801 and/or laser.Defective laser and/orconnector.Did pickup return toinnermost circular?Does it stop at inner pickcircular after shift?Is defect output from

44、 LMSW applied to pin ofPN803?R8011.0VR8011.0VYESYESYESYESOPENCLOSEYESYESYESYESYESYES7011122-12-BCDoes lens move up/down?Does IC 801 out focussearch signal?IC 801 pin (FEO)Is focus search signalapplied to pin , ofCN801?Laser lights.Confirminitialread withdiscDefective IC801 Defective IC803 Defective

45、IC 801.Open activator and/orconnector.Open connector and/ordefective IC 801.Incorrect turntable height.Degraded laser diode.Does TP 801 RF signal appear even inlow level?Is laser output adjustment correct?Does FOK(focus ok) signal appear?YESYESYESYESYESYESTP801(RF)IC801 pin (FOK)NONONONONONO48131640

46、-13-FERISTAT(SENSE)CStart modeDoes FE1 signal appear? IC 801 pinDoes FZC signal (focus zero cross signal)appear at pin of IC 801, ISTAT (SENSE)terminal?Does SMON signal appear at pin of IC 802?Does SMPO signal appear at pin of IC 802?Is drive voltage applied to disk motor?Defective IC 801.Open pick

47、diodeDefective IC 801.Defective Pattern between IC 801 andIC 802.Defective IC 801, 803 and/orperipheral circuit.Defective disk motor and/or insulation.(Focus servo turnsON by FZC signalof FOK mod.)NONONONOYESYESYESYESYES59317375-14-WAVEFORMS OF MAJOR CHECK POINT1. HF signal (RF signal ) waveform(Tes

48、t Point TP801) during normal play2. EFM signal (pin IC 801)waveformduring Normal Play0V0V3. Focus coil drive waveform(Pin NO 1, 2 of IC 803) When focus search failed or there is no disc onthe tray3. Focus coil drive waveform(Pin NO , of IC 803) Focus coil drive waveform(pin NO 1, 2 ofIC803) and FOK

49、(pin NO 40 of IC 801) whenfocus search is accomplished0VCH1 : FOCUS COIL DRIVESIGNAL 2V/Div.CH2 : FOAK(CH1 : TEO(TP801) 1V/Div.CH2 : TRACKING COIL DRIVESIGNAL 2V/Div.(CH1 : TEO(TP801) 1V/Div.CH2 : TRACK COIL DRIVESIGNAL 2V/Div.(CH1 : TEO(TP801) 1V/Div.CH2 : TRACK COIL DRIVESIGNAL 2V/Div.(0V(CH1)0V(C

50、H2)4. Tracking coil drive waveform (pin NO 26, 27of IC 803) and TEO during track traverse(1) When time division is 20nS/div4. Tracking coil drive waveform (pin NO 26, 27 of IC803) and TEO during track traverse(2) When time division 0.5nS/div.(During forward track traverse)0V(CH1)0V(CH2)0V(CH1)0V(CH2