Aiwa-CXLDB30-cs-sm维修电路原理图.pdf
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1、SERVICE MANUALSony CorporationPersonal Audio GroupPublished by Sony Engineering CorporationAEP ModelCX-LDB30/LDB50UK ModelCX-LDB30E ModelCX-LDB30/LDB50MICRO HI-FI COMPONENT SYSTEM9-879-476-022005D16-1 2005.04Ver. 1.1 2005.04SPECIFICATIONSCX-LDB30/LDB50CX-LDB30/LDB50 are the Amplifier, CD player,Tape
2、 Deck and Tuner section in XR-DB30/DB50. Continued on next page Model Name Using Similar MechanismNEWCDCD Mechanism TypeCDM80BV-F4BD81SectionBase Unit NameBU-F4BD81BOptical Pick-up NameKSM-215CFP/C2NPTAPEModel Name Using Similar MechanismCX-LEM330SectionTape Transport Mechanism TypeCMAL5Z220ACX-LDB5
3、0European model:DIN power output (rated): 60 + 60 W (6 ohms at 1 kHz, DIN)Continuous RMS power output (reference):80 + 80 W (6 ohms at 1 kHz, 10% THD)Music power output (reference):200 + 200 W(6 ohms at 1 kHz, 10% THD)Other models:The following measured at AC 220 240 V, 50/60 HzDIN power output (rat
4、ed): 60 + 60 W (6 ohms at 1 kHz, DIN)Continuous RMS power output (reference):80 + 80 W (6 ohms at 1 kHz, 10% THD)CX-LDB30European model:DIN power output (rated): 45 + 45 W (6 ohms at 1 kHz, DIN)Continuous RMS power output (reference):60 + 60 W(6 ohms at 1 kHz, 10% THD)Music power output (reference):
5、140 + 140 W(6 ohms at 1 kHz, 10% THD)Other models:The following measured at AC 220 240 V, 50/60 HzDIN power output (rated): 45 + 45 W(6 ohms at 1 kHz, DIN)Continuous RMS power output (reference):60 + 60 W (6 ohms at 1 kHz, 10% THD)InputsAUDIO IN (RCA pin jacks):Sensitivity 700 mV, impedance 47 kiloh
6、msOutputsPHONES (stereo mini jack):accepts headphones with an impedance of 32 ohms or moreSPEAKER:accepts impedance of 6 ohmsCD player sectionSystemCompact disc and digital audio systemLaser Diode PropertiesEmission duration: continuousLaser Output*: Less than 44.6 W* This output is the value measur
7、ement at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm apertureRadioFans.CN 收音机爱 好者资料库2CX-LDB30/LDB50SAFETY-RELATED COMPONENT WARNING!COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINEWITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS LIST ARE CRITICAL TO
8、 SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTS WHOSEPART NUMBERS APPEAR AS SHOWN IN THIS MANUAL ORIN SUPPLEMENTS PUBLISHED BY SONY.Frequency response20 Hz 20 kHzSignal-to-noise ratioMore than 90 dBDynamic rangeMore than 90 dBTape deck sectionRecording system4-track 2-channel stereoFrequenc
9、y response100 10,000 Hz, using Sony TYPE I cassettesTuner sectionFM stereo, FM/AM superheterodyne tunerFM tuner sectionTuning range87.5 108.0 MHz (50-kHz step)AntennaFM lead antennaAntenna terminals75 ohms unbalancedIntermediate frequency10.7 MHzAM tuner sectionTuning rangeEuropean model:531 1,602 k
10、Hz (with the tuning interval set at 9 kHz) Other models:530 1,710 kHz (with the tuning interval set at 10 kHz)531 1,602 kHz (with the tuning interval set at 9 kHz)AntennaAM loop antenna, external antenna terminalIntermediate frequency450 kHz GeneralPower requirementsEuropean model:AC 230 V, 50/60 Hz
11、Other models:AC 120, 220 or 230 240 V, 50/60 HzAdjustable with voltage selectorPower consumptionXR-DB50European model:85 W 0.3 W (in Power Saving mode)Other models:85 WXR-DB30European model:70 W0.3 W (in Power Saving mode)Other models:70 WDimensions (w/h/d) excl. speakers:Approx. 190 x 277 x269 mmMa
12、ss excl. speakersCX-LDB50:5.4 kgCX-LDB30:5.1 kgDesign and specifications are subject to change without notice. Standby power consumption: 0.3 W Halogenated flame retardants are not used in the certain printed wiring boards. Lead-free solder is used for soldering certain parts. Halogenated flame reta
13、rdants are not used in cabinets.RadioFans.CN 收音机爱 好者资料库3CX-LDB30/LDB50TABLE OF CONTENTS1.SERVICING NOTES.42.GENERAL.53.DISASSEMBLY3-1.Disassembly Flow .73-2.Side Panel (L)(R), Top Panel, Back Panel.83-3.CD Mechanism Section.83-4.Front Panel Section .93-5.Power Transformer .93-6.MAIN Board. 103-7.PAN
14、EL Board, CD EJECT Board, JACK Board . 103-8.Cassette Deck Mechanism. 113-9.Cassette Panel. 113-10. CD Mechanism Deck (CDM80BV-F4BD81) . 123-11. Chassis (Top) . 123-12. Lever (Loading R/L). 133-13. Disc Stop Lever, Disc Sensor Lever . 143-14. DRIVER Board . 143-15. BD Board. 153-16. Optical Pick-up
15、(KSM-215CFP/C2NP) . 153-17. Base Unit (BU-F4BD81B) . 163-18. Lever (BU Lock) . 163-19. Close Lever. 173-20. DIR Lever, Gear (IDL-B) . 173-21. Gear (IDL-C) . 184.TEST MODE. 195.MECHANICAL ADJUSTMENTS. 206.ELECTRICAL ADJUSTMENTS. 207.DIAGRAMS7-1.Block Diagram BD Section . 257-2.Block Diagram MAIN Sect
16、ion . 267-3.Printed Wiring Board BD Board . 277-4.Schematic Diagram BD Board . 287-5.Printed Wiring Board DRIVER Board, JACK Board . 297-6.Schematic Diagram DRIVER Board, JACK Board . 307-7.Printed Wiring Board MAIN Section (1/2) . 317-8.Printed Wiring Board MAIN Section (2/2) . 327-9.Schematic Diag
17、ram MAIN Section (1/5) . 337-10. Schematic Diagram MAIN Section (2/5) . 347-11. Schematic Diagram MAIN Section (3/5) . 357-12. Schematic Diagram MAIN Section (4/5) . 367-13. Schematic Diagram MAIN Section (5/5) . 377-14. Printed Wiring Board PANEL Board . 387-15. Schematic Diagram PANEL Board . 397-
18、16. Printed Wiring Board PT Board . 407-17. Schematic Diagram PT Board . 418.EXPLODED VIEWS8-1.Panel Section . 478-2.Front Panel Section . 488-3.Chassis Section. 498-4.CD Mechanism Deck Section 1 (CDM80BV-F4BD81) . 508-5.CD Mechanism Deck Section 2 (CDM80BV-F4BD81) . 518-6.CD Mechanism Deck Section
19、3 (CDM80BV-F4BD81) . 528-7.Base Unit Section . 539.ELECTRICAL PARTS LIST. 54RadioFans.CN 收音机爱 好者资料库4CX-LDB30/LDB50SECTION 1SERVICING NOTESThe laser diode in the optical pick-up block may suffer electrostaticbreak-down because of the potential difference generated by thecharged electrostatic load, et
20、c. on clothing and the human body.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The flexible board is easily damaged and should be handled withcare.NOTES ON LASER DIODE EMISSION CHECKThe laser beam on thi
21、s model is concentrated so as to be focused onthe disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission,observe from more than 30 cm away from the objective lens.LASER DIODE AND FOCUS SEARCH OPERATIONCHECKCarry out the “S curve
22、check” in “CD section adjustment” and checkthat the S curve waveforms is output three times.NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNITNotes on chip component replacementNever reuse a disconnected chip component.Notice that the minus side of a tantalum capacitor may bedamaged by heat.Fle
23、xible Circuit Board RepairingKeep the temperature of the soldering iron around 270 Cduring repairing.Do not touch the soldering iron on the same conductor of thecircuit board (within 3 times).Be careful not to apply force on the conductor when solderingor unsoldering.CAUTIONUse of controls or adjust
24、ments or performance of proceduresother than those specified herein may result in hazardous radiationexposure.UNLEADED SOLDERBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come prin
25、ted withthe lead free mark due to their particular size): LEAD FREE MARKUnleaded solder has the following characteristics.Unleaded solder melts at a temperature about 40 C higherthan ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slig
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