Yamaha-CDXE410-cs-sm 维修电路原理图.pdf
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1、101018P.O.Box 1, Hamamatsu, JapanSERVICE MANUALCDX-E410IMPORTANT NOTICEThis manual has been provided for the use of authorized YAMAHA Retailers and their service personnel.It has been assumed that basic service procedures inherent to the industry, and more specifically YAMAHA Products, are alreadykn
2、own and understood by the users, and have therefore not been restated.WARNING:Failure to follow appropriate service and safety procedures when servicing this product may result in personalinjury, destruction of expensive components, and failure of the product to perform as specified. For these reaso
3、ns,we advise all YAMAHA product owners that any service required should be performed by an authorizedYAMAHA Retailer or the appointed service representative.IMPORTANT:The presentation or sale of this manual to any individual or firm does not constitute authorization, certification orrecognition of a
4、ny applicable technical capabilities, or establish a principle-agent relationship of any form.The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research, engineering, andservice departments of YAMAHA are continually striving to improve YAMAHA prod
5、ucts. Modifications are, therefore, inevitableand specifications are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, pleasecontact the distributors Service Division.WARNING:Static discharges can destroy expensive components. Discharge any static el
6、ectricity your body may haveaccumulated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect to this buss).IMPORTANT:Turn the unit OFF during disassembly and part replacement. Recheck all work before you apply power to the unit.I CONTENTSTO SERVICE PERSONNEL . 23PREV
7、ENTION OF ELECTROSTATIC DISCHARGE . 4FRONT PANEL . 5REAR PANEL . 5SPECIFICATIONS. 5INTERNAL VIEW . 6REPAIR NOTES. 6HOW TO MANUALLY EJECT THE TRAY. 6DISASSEMBLY PROCEDURES . 7TEST MODE . 8IC DATA . 913BLOCK DIAGRAM. 14WIRING DIAGRAM . 15PRINTED CIRCUIT BOARDS. 1618SCHEMATIC DIAGRAMS. 1920REPLACEMENT
8、PARTS LIST . 2223SYSTEM CONTROL . 2431 2006 All rights reserved.This manual is copyrighted by YAMAHA and may not be copied orredistributed either in print or electronically without permission.CDX-E410 06.08MICRO COMPONENT SYSTEM MCR-E410CD PLAYERThe MCR-E410 is composed of the CDX-E410, RX-E410 and
9、NX-E800.This service manual is for the CDX-E410.For service manual of the RX-E410 and NX-E800, please refer to the following publication number:RX-E810/RX-E410/NX-E800 101019RadioFans.CN 收音机爱 好者资料库CDX-E4102CDX-E410I TO SERVICE PERSONNELWARNING: Laser SafetyThis product contains a laser beam componen
10、t. This component may emit invisible, as well as visible radiation,which may cause eye damage. To protect your eyes and skin from laser radiation, the following precautions must beused during servicing of the unit.1) When testing and/or repairing any component within the product, keep your eyes and
11、skin more than 30 cm away fromthe laser pick-up unit at all times. Do not stare at the laser beam at any time.2) Do not attempt to readjust, disassemble or repair the laser pick-up, unless noted elsewhere in this manual.3) CAUTION: Use of controls, adjustments or performance of procedures other than
12、 those specified herein may result inhazardous radiation exposure.WARNING: CHEMICAL CONTENT NOTICE!The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic(where applicable) components may also contain traces of chemicals found by the C
13、alifornia Health and WelfareAgency (and possibly other entities) to cause cancer and/or birth defects or other reproductive harm.DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANYREASON WHATSOEVER!Avoid prolonged, unprotected contact between solder and your skin!
14、When soldering, do not inhale solder fumes orexpose eyes to solder/flux vapor!If you come in contact with solder or components located inside the enclosure of this product, wash your handsbefore handling food.Laser Emitting conditions:1) When the top cover is removed, and the “STANDBY/ON” SW is turn
15、ed to the “ON” position, the laser component will emita beam for several seconds to detect if a disc is present. During this time (5-10 sec.) the laser may radiate through thelens of the laser pick-up unit. Do not attempt any servicing during this period!If no disc is detected, the laser will stop e
16、mitting the beam. When a disc is set, you will not be exposed to any laseremissions.2) The laser power level can be adjusted with the VR on the pick-up PWB. However, this level has been set by the factoryprior to shipping from the factory. Do not adjust this laser level control unless instruction is
17、 provided elsewhere in thismanual. Adjustment of this control can increase the laser emission level from the device.All of the P.C.B.s installed in this unit are soldered using the lead free solder.Among some types of lead free solder currently available, it is recommended to use one of the followin
18、g types for the repairwork. Sn + Ag + Cu (tin + silver + copper) Sn + Cu (tin + copper) Sn + Zn + Bi (tin + zinc + bismuth)Caution:As the melting point temperature of the lead free solder is about 30C to 40C (50F to 70F) higher than that of the lead solder, be sureto use a soldering iron suitable to
19、 each solder.About Lead Free SolderRadioFans.CN 收音机爱 好者资料库CDX-E4103CDX-497/CDX-397CDX-E410WARNINGLaser Diode PropertiesType:GaAlAsWave length:780 nmEmission duration:continuousLaser output:max. 44.6 W *This output is the value measuredat a distance of about 200 mm fromthe objective lens surface on t
20、heoptical pick-up block.CDX-E4104CDX-E410I PREVENTION OF ELECTROSTATIC DISCHARGESome semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits an
21、d some field-effect transistorsand semiconductor “chip” components. The following techniques should be used to help reduce the incidence of componentdamage caused by electro static discharge (ESD).1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain of
22、f any ESD onyour body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wriststrap, which should be removed for potential shock reasons prior to applying power to the unit under test.2. After removing an electrical assembly equipped with ES dev
23、ices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.4. Use only an anti-static solder removal device. Some solder removal devices not clas
24、sified as “anti-static (ESD protected)”can generate electrical charge sufficient to damage ES devices.5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.6. Do not remove a replacement ES device from its protective package until immediately
25、before you are ready to install it. (Mostreplacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compa-rable conductive material).7. Immediately before removing the protective material from the leads of a replacement ES divice, touch the prot
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