Sony-SCDXE670-sacd-sm 维修电路原理图.pdf
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1、SERVICE MANUALSUPER AUDIO CD PLAYERUS ModelCanadian ModelAEP ModelUK ModelSCD-XE670Ver 1.0 2001.07SPECIFICATIONSModel Name Using Similar MechanismNEWCD Mechanism TypeCDM66B-DVBU6ABase Unit NameDVBU6AOptical Pick-up NameKHM-230AAA9-873-176-01Sony Corporation2001G0500-1Home Audio CompanyC 2001.7Shinag
2、awa Tec Service Manual Production GroupWhen a super audio CD is playedPlaying frequency range2 Hz to 100 kHzFrequency response2 Hz to 50 kHz (3 dB)Dynamic range103 dB or moreTotal harmonic distortionrate0.0020 % or lessWow and flutterValue of measurable limit(0.001 % W. PEAK) orlessWhen a CD is play
3、edFrequency response2 Hz to 20 kHzDynamic range98 dB or moreTotal harmonic distortionrate0.0025 % or lessWow and flutterValue of measurable limit(0.001 % W. PEAK) orlessOutput connectorANALOGOUTDIGITAL(CD) OUTOPTICAL *PHONES*Output only the audio signals of the CDLoadimpedanceOver 10kilohmsWavelengt
4、h:660 nm32 ohmsJacktypePhonojacksSquareopticaloutputconnectorStereophonejackOutput level2 Vrms(at 50 kilohms)18 dBm10 mWGeneralLaser:Semiconductor laser(SACD: = 650 nm)(CD: = 780 nm)Emission duration: continuousPower requirements120 V AC, 60 HzPower consumption26 WDimensions (w/h/d)430 95 285 mm(w/h
5、/d)(17 x 3 3/4 x 11 1/4 in.)incl. projecting partsMass (approx.)3.9 kg (9 lbs 5 oz)Supplied accessoriesDesign and specifications are subject to changewithout notice.This player comes with the following items: Audio connecting cordphono jack 2 (Red and White) y phonojack 2 (Red and White) (2)phono ja
6、ck 1 (Black) y phono jack 1(Black) (2) Remote commander RM-SX700 (1) Size AA (R6) batteries (2)RadioFans.CN 收音机爱 好者资料库2SCD-XE670TABLE OF CONTENTS1.SERVICING NOTES.42.GENERAL.63.DISASSEMBLY3-1.Disassembly Flow .83-2.Case (408226) .93-3.Front Panel Section .93-4.AUDIO Board, MAIN Board. 103-5. Mechani
7、sm Deck (CDM66B-DVBU6A) . 103-6.Base Unit (DVBU6A) . 114.TEST MODE. 125.DIAGRAMS5-1.Block Diagram RF/SERVO Section . 265-2.Block Diagram SERVO Section . 275-3.Block Diagram MAIN Section . 285-4.Block Diagram AUDIO Section . 295-5.Block Diagram DISPLAY/KEY CONTROL/POWER SUPPLY Section . 305-6.Note fo
8、r Printed Wiring Boards andSchematic Diagrams . 315-7.Schematic Diagram RF Board . 325-8.Printed Wiring Boards RF/LOADING Boards . 335-9.Printed Wiring Board MAIN Board (Component Side) . 345-10. Printed Wiring Board MAIN Board (Conductor Side) . 355-11. Schematic Diagram MAIN (1/5)/LOADING Boards .
9、 365-12. Schematic Diagram MAIN Board (2/5) . 375-13. Schematic Diagram MAIN Board (3/5) . 385-14. Schematic Diagram MAIN Board (4/5) . 395-15. Schematic Diagram MAIN Board (5/5) . 405-16. Schematic Diagram AUDIO/HEADPHONE Boards . 415-17. Printed Wiring Board AUDIO Board (Component Side) . 425-18.
10、Printed Wiring Boards AUDIO (Conductor Side)/HEADPHONE Boards . 435-19. Printed Wiring Boards DISPLAY/KEY Boards . 445-20. Schematic Diagram DISPLAY/KEY Boards . 455-21. Printed Wiring Boards POWER/POWER SW/PT Boards . 465-22. Schematic Diagram POWER/POWER SW/PT Boards . 475-23. IC Pin Function Desc
11、ription . 556.EXPLODED VIEWS6-1.Case Section . 706-2.Front Panel Section . 716-3.Chassis Section . 726-4.Mechanism Deck Section (CDM66B-DVBU6A) . 736-5.Base Unit Section (DVBU6A). 747.ELECTRICAL PARTS LIST. 75RadioFans.CN 收音机爱 好者资料库3SCD-XE670This label is located on the LEFT exterior.Notes on chip c
12、omponent replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam-aged by heat.Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C dur-ing repairing. Do not touch the soldering iron on the same conductor
13、 of thecircuit board (within 3 times). Be careful not to apply force on the conductor when solderingor unsoldering.CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous ra-diation exposure.SAFETY CHECK-OUTAfter correcting the orig
14、inal service problem, perform the follow-ing safety check before releasing the set to the customer:Check the antenna terminals, metal trim, “metallized” knobs,screws, and all other exposed metal parts for AC leakage.Check leakage as described below.LEAKAGE TESTThe AC leakage from any exposed metal p
15、art to earth ground andfrom all exposed metal parts to any exposed metal part having areturn to chassis, must not exceed 0.5 mA (500 microamperes.).Leakage current can be measured by any one of three methods.1.A commercial leakage tester, such as the Simpson 229 or RCAWT-540A. Follow the manufacture
16、rs instructions to use theseinstruments.2.A battery-operated AC milliammeter. The Data Precision 245digital multimeter is suitable for this job.3.Measuring the voltage drop across a resistor by means of aVOM or battery-operated AC voltmeter. The “limit” indica-tion is 0.75 V, so analog meters must h
17、ave an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-amples of a passive VOM that is suitable. Nearly all batteryoperated digital multimeters that have a 2 V AC range are suit-able. (See Fig. A)Fig. A.Using an AC voltmeter to check AC leakage.1.5 k0.15 FACvoltmeter(0.75 V)To
18、Exposed MetalParts on SetEarth GroundATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT!LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTEDES PICES SONT CRITIQUES POUR LA SCURITDE FONCTIONNEMENT. NE REMPLACER CES COM-POSANTS QUE PAR DES PICES SONY DONT LESNUMROS SONT DON
19、NS DANS CE MANUEL OUDANS LES SUPPLMENTS PUBLIS PAR SONY.SAFETY-RELATED COMPONENT WARNING!COMPONENTS IDENTIFIED BY MARK 0 OR DOTTEDLINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMSAND IN THE PARTS LIST ARE CRITICAL TO SAFEOPERATION. REPLACE THESE COMPONENTS WITHSONY PARTS WHOSE PART NUMBERS APPEAR ASSHOWN I
20、N THIS MANUAL OR IN SUPPLEMENTS PUB-LISHED BY SONY.This appliance is classified as a CLASS 1LASER product.The CLASS 1 LASER PRODUCTMARKING is located on the rear exterior.The following caution label is locatedinside the unit.4SCD-XE670(1) CD 1.Sled reverse move (sled in) 2.Disc detect 3.IC setting f
21、or CD 4.Servo error signal offset auto adjustment 5.Spindle kick for LD on 6.LD on 7.Focus search 8.Focus servo on 9.Spindle kick 10. Spindle servo on 11. E-F balance auto adjustment 12. Tracking & sled servo on 13. Focus bias auto adjustment 14. Focus servo gain auto adjustment 15. Tracking servo g
22、ain auto adjustment 16. Jump to lead-in area 17. Read TOC 18. Stop(2) SACD (single layer) 1.Sled reverse move (sled in) 2.Disc detect 3.IC setting for SACD 4.Servo error signal offset auto adjustment 5.Spindle kick for LD on 6.LD on 7.Focus search 8.Focus servo on 9.Spindle kick 10. Spindle servo on
23、 11. E-F balance auto adjustment 12. Tracking & sled servo on 13. Focus bias auto adjustment 14. Focus servo gain auto adjustment 15. Tracking servo gain auto adjustment 16. Jump to lead-in area 17. Read TOC 18. Stop(3) SACD (dual layer) 1.Sled reverse move (sled in) 2.Disc detect 3.IC setting for S
24、ACD 4.Servo error signal offset auto adjustment 5.Spindle kick for LD on 6.LD on 7.Focus search 8.Focus servo on (layer 0) 9.Spindle kick 10. Spindle servo on 11. E-F balance auto adjustment (layer 0) 12. Tracking & sled servo on (layer 0) 13. Focus bias auto adjustment (layer 0) 14. Focus servo gai
25、n auto adjustment (layer 0) 15. Tracking servo gain auto adjustment (layer 0) 16. Jump to lead-in area 17. Read TOC 18. Focus jump (layer 0tlayer 1) 19. E-F balance auto adjustment (layer 1) 20. Tracking & sled servo on (layer 1) 21. Focus bias auto adjustment (layer 1) 22. Focus servo gain auto adj
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