Sony-BDPS560-bdp-sm 维修电路原理图.pdf
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1、Sony CorporationVideo Business GroupSERVICE MANUAL9-890-712-112009F0500-1 2009.6Published by Quality Assurance Dept.BLU-RAY DISC/DVD PLAYERVer. 1.0 2009.06BDP-S560RMT-B104ASPECIFICATIONSUS ModelCanadian ModelSystemLaser: Semiconductor laserInputs and outputs(Jack name:Jack type/Output level/Load imp
2、edance)LINE OUT R-AUDIO-L:Phono jack/2 Vrms/10 kilohmsDIGITAL OUT (OPTICAL):Optical output jack/18 dBm(wave length 660 nm)DIGITAL OUT (COAXIAL):Phono jack/0.5 Vp-p/75 ohmsHDMI OUT:HDMI 19-pin standard connectorCOMPONENT VIDEO OUT (Y, PB, PR):Phono jack/Y: 1.0 Vp-p/PB, PR: 0.7 Vp-p/75 ohmsLINE OUT VI
3、DEO:Phono jack/1.0 Vp-p/75 ohmsLINE OUT S VIDEO:4-pin mini DIN/Y: 1.0 Vp-p, C: 0.286 Vp-p/75 ohmsLAN (100):100BASE-TX TerminalEXT:External memory slot (For connecting the external memory)DC output: 5 V 500 mA MaxUSB:USB jack Type A (For connecting digital still camera and USB memory)WirelessWireless
4、 LAN standard:IEEE802.11a/b/gIEEE802.11n draft 2.0Frequency range:U.S. models:2.4 GHz band: Channels 1-115 GHz band: Channels 36-64, 100-140, 149-165Canada models:2.4 GHz band: Channels 1-115 GHz band: Channels 36-64, 100-116, 132-140, 149-165Modulation:DS-SS Modem and OFDM ModemGeneralPower require
5、ments:120 V AC, 60 HzPower consumption:28 WDimensions (approx.):430 mm 216 mm 70 mm(17 in. 8 5/8 in. 2 13/16 in.)(width/depth/height) incl. projecting partsMass (approx.):2.4 kg (5 lb 4 5/8 oz)Operating temperature:5 C to 35 C (41 F to 95 F)Operating humidity:25 % to 80 %Supplied accessoriesSpecific
6、ations and design are subject to change without notice.? Audio/video cable (phono plug 3) (1)? AC power cord (1)? Remote commander (remote) (1)? Size AA (R6) batteries (2)RadioFans.CN 收音机爱 好者资料库 2 BDP-S560SAFETY CHECK-OUTLEAKAGE TESTThe AC leakage from any exposed metal part to earth ground and from
7、 all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods.1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use t
8、hese instruments.2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75V, so analog meters must have an accurate low-v
9、oltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board su
10、rface for solder splashes and bridges.2. Check the interboard wiring to ensure that no wires are “pinched” or contact high-wattage resistors.3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommen
11、d their replacement.4. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement.5. Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer.6. Check the B+ voltage
12、 to see it is at the values specified.7. Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.After correcting the original service problem, perform the following safety checks before releasing the set
13、 to the customer:1.5 k0.15 FACvoltmeter(0.75 V)To Exposed MetalParts on SetEarth GroundFig. A. Using an AC voltmeter to check AC leakage.Unleaded solderBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circu
14、it boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARKUnleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be appli
15、ed to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, l
16、ess prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.CAUTION:The use of optical instrument with this product will inc
17、rease eye hazard.CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia-tion exposure.This label is located on the laser protective housing inside the enclosure.WARNING!WHEN SERVICING, DO NOT APPROACH THE LASER EXIT WITH THE
18、 EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO CONFIRM LASER BEAM EMISSION, BE SURE TO OBSERVE FROM A DISTANCE OF MORE THAN 25 cm FROM THE SURFACE OF THE OBJEC-TIVE LENS ON THE OPTICAL PICK-UP BLOCK.SAFETY-RELATED COMPONENT WARNING!COMPONENTS IDENTIFIED BY MARK ? OR DOTTED LINE WITH MARK ? ON THE SCHE
19、MATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE-PLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT!LES COMPOSANTS IDENTIFIS PAR UNE MARQUE ? SUR LES DIAGRA
20、MMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPL-MENTS PUBLIS PAR SONY.RadioFans.CN 收音机爱 好者资料库 3 BDP-S560TABLE OF CONTENTSSection Title PageSection Ti
21、tle Page1. SERVICE NOTE1-1. Disc Removal Procedure If The Tray Cannot Be Ejected (Forced Ejection) . 1-11-2. Work when optical device are replaced . 1-11-3. Test Disc . 1-2 1-3-1. Operation and Display . 1-22. DISASSEMBLY2-1. Disassembly Flow . 2-12-2. Upper Case . 2-12-3. Front Panel Block . 2-22-4
22、. BD Drive . 2-32-5. Wireless Lan Card Block . 2-32-6. Rear Panel Block. 2-42-7. MB-127 Board . 2-42-8. Switching Regulator . 2-52-9. Circuit Boards Location . 2-53. BLOCK DIAGRAMS3-1. Overall Block Diagram. 3-13-2. DSP Block Diagram . 3-23-3. AV OUT Block Diagram . 3-33-4. USB/ETHER, FL Block Diagr
23、am . 3-43-5. Power Block Diagram (1/3) . 3-53-6. Power Block Diagram (2/3) . 3-63-7. Power Block Diagram (2/3) . 3-74. SCHEMATIC DIAGRAMS4-1. This Note Is Common For Schematic Diagrams . 4-14-2. Frame Schematic Diagram. 4-24-3. ANT-001 Board (ANTENNA) Schematic Diagram. 4-34-4. ANT-002 Board (ANTENN
24、A) Schematic Diagram. 4-44-5. FL-194 Board (SWITCH) Schematic Diagram . 4-54-6. FR-302 Board (FL DRIVER) Schematic Diagram . 4-64-7. HU-012 Board (USB HUB) Schematic Diagram. 4-74-8. MB-127 Board (EMMA3P DDR2-A) Schematic Diagram (1/14). 4-84-9. MB-127 Board (EMMA3P DDR2-B) Schematic Diagram (2/14).
25、 4-94-10. MB-127 Board (POWER1) Schematic Diagram (3/14). 4-104-11. MB-127 Board (CLK/POWER2) Schematic Diagram (4/14). 4-114-12. MB-127 Board (FLASH/HOST) Schematic Diagram (5/14). 4-124-13. MB-127 Board (USB) Schematic Diagram (6/14). 4-134-14. MB-127 Board (HDMI/SATA) Schematic Diagram (7/14). 4-
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