Sony-BDPS500-bdp-sm 维修电路原理图.pdf
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1、SERVICE MANUALUS ModelCanadian ModelAEP ModelUK ModelRussian ModelAustralian ModelBDP-S500RMT-B101A/B101PSPECIFICATIONSVer. 1.1 2008.1SystemLaser: Semiconductor laserOutputs(Jack name: Jack type/Output level/Load impedance)AUDIO OUT L/R:Phono jack/2 Vrms/10 kilohmsDIGITAL OUT (OPTICAL): Optical outp
2、ut jack/18 dBm (wave length 660 nm)DIGITAL OUT (COAXIAL): Phono jack/0.5 Vp-p/75 ohms5.1CH OUTPUT: Phono jack/2 Vrms/10 kilohmsHDMI OUT:HDMI 19-pin standard connectorCOMPONENT VIDEO OUT(Y, PB,PR):Phono jack/Y: 1.0 Vp-p/PB, PR:progressive or interlace = 0.7 Vp-p/75 ohmsVIDEO: Phono jack/1.0 Vp-p/75 o
3、hmsS VIDEO: 4-pin mini DIN/Y:1.0 Vp-p, C: 0.286 Vp-p/75 ohmsGeneralPower requirements:120 V AC, 60 Hz (US, Canadian)220-240 V AC, 50/60 Hz (Except US, Canadian)Power consumption: 33 WDimensions (approx.):430 99.2 361 mm (17 4 141/4in.) (width/height/depth) incl. projecting partsMass (approx.): 4.8 k
4、g (103/4lb)Operating temperature:5 C to 35 C (41F to 95F)Operating humidity:25 % to 80 %Supplied accessoriesSpecifications and design are subject to change without notice. Video cord (phono plug 1) (1) Stereo audio cord (phono plug 2) (1) Power cord (1) Remote commander (remote) (1) Size AA (R6) bat
5、teries (2) GNU License Information (English only) (1)(Except US, Canadian)BLU-RAY DISC PLAYERTMRadioFans.CN 收音机爱 好者资料库 2 WARNING!WHEN SERVICING, DO NOT APPROACH THE LASEREXIT WITH THE EYE TOO CLOSELY. IN CASE IT ISNECESSARY TO CONFIRM LASER BEAM EMISSION,BE SURE TO OBSERVE FROM A DISTANCE OFMORE THA
6、N 25 cm FROM THE SURFACE OF THEOBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK.CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous ra-diation exposure.SAFETY-RELATED COMPONENT WARNING!COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINEWI
7、TH MARK 0 ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS LIST ARE CRITICAL TO SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTS WHOSEPART NUMBERS APPEAR AS SHOWN IN THIS MANUALOR IN SUPPLEMENTS PUBLISHED BY SONY.Fig. A.Using an AC voltmeter to check AC leakage.1.5 k0.15 FACvoltmeter(0.75 V)To Expos
8、ed MetalParts on SetEarth GroundLEAKAGE TESTThe AC leakage from any exposed metal part to earthground and from all exposed metal parts to any exposed metalpart having a return to chassis, must not exceed 0.5 mA (500 mi-croamperes). Leakage current can be measured by any one ofthree methods.1.A comme
9、rcial leakage tester, such as the Simpson 229 or RCAWT-540A. Follow the manufacturers instructions to use theseinstruments.2.A battery-operated AC milliammeter. The Data Precision 245digital multimeter is suitable for this job.3.Measuring the voltage drop across a resistor by means of aVOM or batter
10、y-operated AC voltmeter. The “limit” indica-tion is 0.75V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-amples of a passive VOM that is suitable. Nearly all batteryoperated digital multimeters that have a 2V AC range are suit-able. (See Fig. A)1
11、.Check the area of your repair for unsoldered or poorly-sol-dered connections. Check the entire board surface for soldersplashes and bridges.2.Check the interboard wiring to ensure that no wires are“pinched” or contact high-wattage resistors.3.Look for unauthorized replacement parts, particularly tr
12、ansis-tors, that were installed during a previous repair. Point themout to the customer and recommend their replacement.4.Look for parts which, though functioning, show obvious signsof deterioration. Point them out to the customer and recom-mend their replacement.5.Check the line cord for cracks and
13、 abrasion. Recommend thereplacement of any such line cord to the customer.6.Check the B+ voltage to see it is at the values specified.7.Check the antenna terminals, metal trim, “metallized” knobs,screws, and all other exposed metal parts for AC leakage.Check leakage as described below.SAFETY CHECK-O
14、UTAfter correcting the original service problem, perform the followingsafety checks before releasing the set to the customer:CAUTION:The use of optical instrument with this product will increase eyehazard.Unleaded solderBoards requiring use of unleaded solder are printed with the lead-free mark (LF)
15、 indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.) : LEAD FREE MARKUnleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher thanordinary solder.Ordi
16、nary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350C.Caution: The printed pattern (copper foil) may peel away if theheated tip is applied for too long, so be careful!
17、 Strong viscosityUnleaded solder is more viscous (sticky, less prone to flow) thanordinary solder so use caution not to let solder bridges occursuch as on IC pins, etc. Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.ATTENTION
18、 AU COMPOSANT AYANT RAPPORT LA SCURIT!LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0 SURLES DIAGRAMMES SCHMATIQUES ET LA LISTE DESPICES SONT CRITIQUES POUR LA SCURIT DEFONCTIONNEMENT. NE REMPLACER CES COM- POSANTSQUE PAR DES PICES SONY DONT LES NUMROS SONTDONNS DANS CE MANUEL OU DANS LES SUPPLMENTSPUBLIS
19、 PAR SONY.This label is located on the laser protective housing inside the enclosure.This appliance is classified as a CLASS1 LASER product. The CLASS1 LASER PRODUCT MARKING is located on the laser protective housing inside the enclosure.RadioFans.CN 收音机爱 好者资料库 3 TABLE OF CONTENTSSectionTitlePageSec
20、tionTitlePageSERVICE NOTE1.DISC REMOVAL PROCEDURE IF THE TRAYCANNOT BE EJECTED (FORCED EJECTION) . 42.TEST DISC . 43.POSITION OF COUNTERMEASURE PARTS . 171.GENERALGetting Started . 1-2Basic Operations . 1-5Watching Movie Files . 1-8Listening to Music Files. 1-9Viewing Photo Files. 1-10Changing the I
21、nitial Settings . 1-11Additional Information . 1-132.DISASSEMBLY AND REASSEMBLY2-1.Disassembly Flow . 2-12-2.Upper Case . 2-12-3.Front Display Block Assy. 2-22-4.Tray Cover Assy . 2-22-5.BD Drive (Service Use) . 2-32-6.MAIN Board . 2-32-7.AU-258 Board . 2-42-8.Power Block . 2-42-9.Circuit Boards Loc
22、ation . 2-53.BLOCK DIAGRAMS3-1.Main Block Diagram . 3-13-2.Audio Block Diagram . 3-33-3.FL/FR Block Diagram . 3-53-4.Power 1 Block Diagram . 3-73-5.Power 2 Block Diagram . 3-93-6.Power 3 Block Diagram . 3-114.SCHEMATIC DIAGRAMS AND PRINTED WIRINGBOARDS4-1.Frame Schematic Diagram. 4-14-2.Printed Wiri
23、ng Boards and Schematic Diagrams . 4-5AU-258 (ANALOG AUDIO) Schematic Diagram. 4-5AU-258 Printed Wiring Board. 4-7FL-180 (1/2) (INDICATOR DRIVE)Schematic Diagram . 4-11FL-180 (2/2) (DOOR DRIVE)Schematic Diagram . 4-13FL-180 Printed Wiring Board . 4-15FR-276 Printed Wiring Board. 4-19FR-276 (LED DRIV
24、E, FUNCTION KEY)Schematic Diagram . 4-23IR-063 (CONNECTOR)Schematic Diagram . 4-25IR-063 Printed Wiring Board . 4-265.TROUBLESHOOTINGMain Set, Power Supply Section. 5-1Operation&Display Section . 5-9Audio Section . 5-13FL Section . 5-146.REPAIR PARTS LIST6-1.Exploded Views . 6-16-1-1.Case Assy . 6-1
25、6-1-2.Main Chassis Block . 6-26-1-3.Main Block . 6-36-2.Electrical Parts List . 6-4 4 cliptray2.TEST DISCPart No.DescriptionLayerJ-6090-199-ABLX-104Single LayerJ-6090-200-ABLX-204Dual Layer3-702-101-01CD (YEDS-18)J-6090-088-AHLX-504Single Layer (NTSC)J-6090-089-AHLX-505Dual Layer (NTSC)J-6090-077-AH
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