TelefunkenTVCR210ATVCR610A维修电路图、原理图.pdf
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1、SERVICE MANUAL Sec. 1: Main Section I Specifications I Preparation for Servicing I Adjustment Procedures I Schematic Diagrams I CBAs Sec. 2: Deck Mechanism Section I Standard Maintenance I Alignment for Mechanism I Disassembly/Assembly of Mechanism I Alignment Procedures of Mechanism Sec. 3: Explode
2、d views and Parts List Section I Exploded views I Parts List VIDEO CASSETTE RECORDER TVCR210(B) TVCR610(B) PAL MAIN SECTION VIDEO CASSETTE RECORDER TVCR210(B)/TVCR610(B) TABLE OF CONTENTS Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3、. . . . . . . . . . . . . . . . . . . . . . . . .1-1-1 Important Safety Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2-1 Standard Notes for Servicing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3-1 Preparation for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4-1 Cabinet Disassembly Instructions . . . . . . . . . . . . . . . . . . .
5、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5-1 Electrical Adjustment Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6-1 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . .
6、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7-1 Function Indicator Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7-13 Schematic Diagrams / CBAs and Test Poin
7、ts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8-1 Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-9-1 Wiring Diagram . . . . . . .
8、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10-1 IC Pin Function Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11-1 Lead Ide
9、ntifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-12-1 Sec. 1: Main Section I Specifications I Preparation for Servicing I Adjustment Procedures I Schematic Diagrams I CBAs 1-1-1HE2E0SP SPECIFICATIONS
10、 Note: Nominal specs represent the design specs. All units should be able to approximate these some will exceed and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might be considered acceptable; In no case should a unit fail to meet limit spec
11、s. DescriptionUnitMinimumNominalMaximumRemark 1. Video 1-1. Video Output (PB)Vp-p0.81.01.2FL6A 1-2. Video Output (R/P)Vp-p0.81.01.2 1-3. Video S/N Y (R/P)dB4045 SP Mode, W/O Burst 1-4. Video Color S/N AM (R/P)dB3741SP Mode 1-5. Video Color S/N PM (R/P)dB3036SP Mode 1-6. Resolution (PB)Line230245SP M
12、ode 2. Servo 2-1. Jitter Lowsec0.070.12SP Mode 2-2. Wow when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Caution: 1. The Fl
13、at Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around
14、the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 1-3-2NOTE_1 3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil
15、 of each pin or the solder lands under the IC when removing it. With Soldering Iron: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Lift each lead of
16、 the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack
17、-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When y
18、ou use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder
19、melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5 (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5)
20、 Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Hot-ai
21、r Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 1-3-3NOTE_1 2. Installation (1)Usin
22、g desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. (2)The “ I ” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installa
23、tion. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3)Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Instructions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference cau
24、sed by electro- static charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1M) that is prop- erly grounded to remove any static electricity that may be charged on the body. 2. Ground for Workbench Be sure to place a conductive sheet or copper plate with
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