Yamaha-Audiogram3-usb-sm维修电路原理图.pdf

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1、SERVICE MANUAL HAMAMATSU, JAPAN Copyright (c) Yamaha Corporation. All rights reserved. PDF & 08.07 SPECIFICATIONS（総合仕様） .3 DIMENSIONAL DIAGRAM（寸法図） .3 PANEL LAYOUT（） .4 CIRCUIT BOARD LAYOUT（） .5 DISASSEMBLY PROCEDURE（分解手順） .6 LSI PIN DESCRIPTION（LSI 端子機能表） .8 IC BLOCK DIAGRAM（IC 図） .9 CIRCUIT BOARDS

2、（基板図） .10 INSPECTIONS（検査） .12/15 RECORDING USING THE CUBASE AI 4 （Cubase AI 4 使用録音） .18/23 RECORDING USING THE TWE （TWE 使用録音） .28/31 PARTS LIST BLOCK DIAGRAM（） CIRCUIT DIAGRAM（回路図） CONTENTS（目次） USB AUDIO INTERFACE SY011918 20080801 RadioFans.CN 收音机爱 好者资料库 AUDIOGRAM3 2 WARNING Components having speci

3、al characteristics are marked and must be replaced with parts having specifi cation equal to those originally installed. IMPORTANT NOTICE This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that basic service procedures inherent t

4、o the industry, and more specifically Yamaha Products, are already known and understood by the users, and have therefore not been restated. WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in personal injury, destruction of expensive compon

5、ents and failure of the product to perform as specified. For these reasons, we advise all Yamaha product owners that all service required should be performed by an authorized Yamaha Retailer or the appointed service representative. IMPORTANT : This presentation or sale of this manual to any individu

6、al or firm does not constitute authorization certification, recognition of any applicable technical capabilities, or establish a principal-agent relationship of any form. The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and s

7、ervice departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, please contact the distributors Service Divi

8、sion. WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to this bus.) IMPORTANT : Turn the unit OFF during disassembly and parts replacemen

9、t. Recheck all work before you apply power to the unit. WARNING: This product contains chemicals known to the State of California to cause cancer, or birth defects or other reproductive harm. DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT SO EVER!

10、Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to solder/ flux vapor! If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling food. 印部品、安全維持重要部品。交換場合、安

11、全必指定部品使用。 MIC/INST 端子（XLR ）配列、以下。 （IEC60268 規格基） 1: （GND） 、2: （） 、3: （） ） 3 21 MIC/INST jacks (XLR-type) are wired as follows (IEC60268 standard): pin 1: ground, pin 2: hot (+), and pin 3: cold (-). RadioFans.CN 收音机爱 好者资料库 3 AUDIOGRAM3 SPECIFICATIONS（総合仕様） JacksMIC/INST Input Jackx 1 Combo jack (Mic

12、/HiZ) LINE Input Jacks (L, R)x 1 Phone jacks x 1 RCA pin jacks PHONES Jackx 1 Phone jack STEREO OUT Jacks (L, R)x 1 Phone jacks x 1 RCA pin jacks USB Connectorx 1 USB 1.1 44.1/48 kHz, 16 bit ControlsMIC/INST Switchx 1 MIC: for microphones INST (Hi-Z): for guitars, etc. LEVEL Controlx 2 Adjust the le

13、vel of CH 1, 2 PHANTOM +48V Switchx 1 48 V, only for CH1 OUT LEVEL Controlx 1 Adjusts the overall signal IndicatorsPhantom Powerx 1 Red Level Indicatorsx 1 2 points (green, red) Powerx 1 Green Power SupplyUSB bus-powered Dimensions (W x H x D)180 x 61 x 112 mm Net Weight490 g Included AccessoriesCub

14、ase AI 4 DVD-ROM USB cable Owners Manual General Specifi cations DIMENSIONAL DIAGRAM（寸法図） W: 180 D: 112108 36 H: 61 522 Unit: mm AUDIOGRAM3 4 PANEL LAYOUT（） Control Panel ? ? ? Control panel q PHANTOM +48V Switch/Indicator w MIC/INST Switch e LEVEL Controls r POWER Indicator t Level Indicators y OUT

15、 LEVEL Control u USB Connector Rear Panel ? q PHANTOM +48V / w MIC/INST 切替 e LEVEL r POWER t y OUT LEVEL u USB 端子 Rear panel i MIC/INST Input Jack o LINE Input Jacks !0 STEREO OUT Jacks !1 PHONES Jack i MIC/INST 入力端子 o LINE入力端子(L/R) !0 STEREO OUT 出力端子 !1 PHONES端子 5 AUDIOGRAM3 CIRCUIT BOARD LAYOUT（）

16、MIX3 BOTTOM CASE PRINTED （印刷上） JACK3 BOTTOM CASE PRINTED （印刷上） PS-USB ASSEMBLY （PSUSB Ass y） PSUSB SHIELD PS-USB PS-USB ASSEMBLY （PSUSB） AUDIOGRAM3 6 DISASSEMBLY PROCEDURE（分解手順） 1. Top Cover Assembly (Time required: About 1 minute) 1-1 Remove the four (4) screws marked 140. The top cover assembly ca

17、n then be removed. (Fig. 1) 2. MIX3 Circuit Board (Time required: About 2 minutes) 2-1 Remove the top cover assembly. (See procedure 1.) 2-2 Remove the screw marked 120. The MIX3 circuit board can then be removed. (Fig. 2) 2-3 Pull out the three (3) volume knobs marked 100 and two (2) push buttons m

18、arked 110 from the MIX3 cir- cuit board. (Fig. 2) * The volume knobs and push buttons are not compo- nents of the MIX3 circuit board. When replacing the MIX3 circuit board, remove the volume knobs and push buttons and install them on the new MIX3 circuit board. 1. Assy（所要時間：約 1 分） 1-1 140 4 本外、 Assy

19、 外。 （図 1） 2. MIX3 （所要時間：約 2 分） 2-1 Assy 外。 （1 項参照） 2-2 120 1 本外、MIX3 外 。 （図 2） 2-3 MIX3 上面、100 VR （小）3 個 110 HPF2 個外。 （図 2） VR （小） HPF MIX3 構成部品 。 MIX3交換際、 VR （小） HPF 取外新 MIX3 取 付。 140 x2 140 x2 TOP COVER ASSEMBLY （Ass y） 140: BIND HEAD TAPPING SCREW（B BIND） 3.0X12 MFZN2W3 (WE98740R) Fig. 1（図 1） MIX

20、3 110 x2 100 100 100 120 BOTTOM CASE （） 120: BIND HEAD B-TIGHT SCREW（B BIND） 3.0X8 MFZN2W3 (WE774300) Fig. 2（図 2） Precautions（注意事項） During assembly, pay attention that connectors, cables or the like are not pinched by circuit boards, frames, etc. 組立、基板類注意。 7 AUDIOGRAM3 3. PSUSB Circuit Board (Time r

21、equired: About 6 minutes) 3-1 Remove the top cover assembly. (See procedure 1.) 3-2 Remove the MIX3 circuit board. (See procedure 2.) 3-3 Remove the two (2) screws marked 80. The inner chassis on which the JACK3 circuit board and PS-USB assembly are installed can then be removed. (Fig. 3) 3-4 Remove

22、 the two (2) screws marked 60. The PS-USB assembly can then be removed. (Fig. 4) 3-5 Unsolder the four (4) hooks A from the PSUSB cir- cuit board and turn the hooks until they are in the same direction as the notches on the circuit board to separate the PSUSB circuit board and shield PS-USB. (Photo

23、1) 4. JACK3 Circuit Board (Time required: About 5 minutes) 4-1 Remove the top cover assembly. (See procedure 1.) 4-2 Remove the MIX3 circuit board. (See procedure 2.) 4-3 Remove the PS-USB assembly. (See procedures 3-3 and 3-4.) 4-4 Remove the fi ve (5) each hexagonal nuts marked B and washers marke

24、d C, remove the four (4) screws marked 30 and remove the JACK3 circuit board. (Fig. 4) 3. PSUSB （所要時間：約 6 分） 3-1 Assy 外。 （1 項参照） 3-2 MIX3 外。 （2 項参照） 3-3 80 2 本外、JACK3 PS- USB Assy 載外。 （図 3） 3-4 60 2 本外、PS-USB Assy 外 。 （図 4） 3-5 PSUSB 半田付 A （4 箇所） 半田取除、 基板切 同向、PSUSB PS-USB 分離。 （写真 1） 4. JACK3 （所要時間：約

25、 5 分） 4-1 Assy 外。 （1 項参照） 4-2 MIX3 外。 （2 項参照） 4-3 PS-USB Assy 外。 （3-3 項、3-4 項参照） 4-4 B 六角 C 5 個外、30 4 本外、JACK3 外。 （図 4） PS-USB ASSEMBLY （PS-USB Ass y） JACK3INNER CHASSIS （） 60 x2 30 x3 30 Bx2 Cx2Bx2 Cx2 B C Fig. 4（図 4） 80 x2 BOTTOM CASE （） PS-USB ASSEMBLY （PS-USB Ass y） JACK3 INNER CHASSIS （） 80: BI

26、ND HEAD B-TIGHT SCREW（B BIND） 3.0X8 MFZN2W3 (WE774300) Fig. 3（図 3） Photo 1（写真 1） PSUSB SHIELD PS-USB （ PS-USB） Hooks (Soldering) （ （半田付） ） A A Hooks (Soldering) （ （半田付） ） 30: BIND HEAD B-TIGHT SCREW（B BIND） 3.0X8 MFZN2W3 (WE774300) 60: BIND HEAD B-TIGHT SCREW（B BIND） 3.0X8 MFZN2W3 (WE774300) AUDIOGR

27、AM3 8 LSI PIN DESCRIPTION（LSI 端子機能表） PIN NO. I/OFUNCTIONNAME PIN NO. I/ONAME PCM2904DBR (X9570A00)STEREO AUDIO CODEC WITH USB INTERFACE DAC analog output for R-channnel DAC analog output for L-channnel Internal analog power supply for PLL Analog ground for PLL Internal analog power supply for PLL Cr

28、ystal oscillator output Crystal oscillator input Analog ground for oscillator Internal analog power supply for oscillator Test pin, must be connected to GND Test pin, must be left open Digital ground Internal digital power supply Suspend flag, active low (Low: suspend, Hihg: operational) FUNCTION O

29、O - - - O I - - I O - - O VOUTR VOUTL VCCP1I AGNDP VCCP2I XTO XTI AGNDX VCCXI TEST0 TEST1 DGND VDDI SSPND 15 16 17 18 19 20 21 22 23 24 25 26 27 28 USB differential input/output plus USB differential input/output minus Connect to USB power (VBUS) Digital ground for USB transceiver HID key state inpu

30、t (mute), active high HID key state input (volume up), active high HID key state input (volume down), active high Must be set to high Internal analog power supply for codec Analog ground for codec ADC analog input for L-channnel ADC analog input for R-channnel Common for ADC/DAC (VCCCI/2) I/O I/O -

31、- I I I I I - - I I - D+ D- VBUS DGNDU HID0 HID1 HID2 SEL0 SEL1 VCCCI AGNDC VINL VINR VCOM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PSUSB: IC102 9 AUDIOGRAM3 IC BLOCK DIAGRAM（IC 図） BA10339F-E2 (X6266A0R) MIX3: IC402 Ground Sense Comparator 1 2 3 4 5 6 7 OUT2 OUT1 Vcc -IN1 +IN1 -IN2 +IN2 14 13 12 11 10 9 8 O

32、UT3 OUT4 VEE +IN4 -IN4 +IN3 -IN3 +- +- +- +- 1 1.5A Maximum ON duty 9.1 OSC BLOCK 4 3 2 8 5 6 7 V+ Es GND PWM Logic R SQ Vref 1.25V 2% CD CT Cs SI IN+ Vth=300mV Ipk Sense PWM COMP ERR. AMP 160 1 2 3 4 8 7 6 5 Cs CT GND CD SI V+ IN+ Es NJM2374AM-TE1 (X9482A00) PSUSB: IC401, IC501, IC601 PWM DC/DC Con

33、verter NJM072BM-E-TE1 (X4543A01) MIX3: IC101 Dual Operational Amplifier 1 2 3 4 8 7 6 5 A Output +V A +Input V- V+ B Output B -Input B +Input A -Input +- +- NJM2068MD-TE2 (X3505A00) MIX3: IC201 PSUSB: IC201, IC202 Dual Operational Amplifier 1 2 3 4-V 8 7 6 5 Output A+V Non-Inverting Input A -DC Volt

34、age Supply +DC Voltage Supply Output B Inverting Input B Non-Inverting Input B Inverting Input A+- +- NJM4580L (XF195A00) MIX3: IC303 Dual Operational Amplifier 1 A 2345678 OUT A -IN A +IN A +IN B -IN B OUT B -V+V - + B - + BA4560RF-E2 (X6897A00) MIX3: IC301, IC302, IC401 Dual Operational Amplifier

35、1 2 3 4-V 8 7 6 5 Output 1+V +Input 1 VEE VCC Output 2 -Input 2 +Input 2 -Input 1 +- +- 1 2 3 4 8 7 6 5 GND EN1 EN2 /OC1 OUT1 OUT2 /OC2 IN BD2056AFJ-E2 (X9691A00) PSUSB: IC301 USB High Side Switch Gate Logic1 TSD1 TSD2 Charge pump1 OCD1 OCD2 SW1 SW2 UVLO 8 3 2 4 1 7 6 5 /OC1 EN1 EN2 GND IN /OC2 OUT1

36、 OUT2 Charge pump2 Gate Logic2 AUDIOGRAM3 10 CIRCUIT BOARDS（基板図） JACK3 Circuit Board (X9390D0) . 11 MIX3 Circuit Board (X9390D0) .10 PSUSB Circuit Board (X9388C0) . 11 Note: See parts list for details of circuit board component parts. 注 : 部品詳細参照。 to JACK3-CN101to JACK3-CN301 to PSUSB-CN702 PHANTOM M

37、IC /INST LEVEL 1 PEAK L PEAK R POWER SIG LSIG R LEVEL 2 LEVEL 2 LEVEL OUT LEVEL OUT PHANTOM MIX3 Circuit Board Component side（部品側） Pattern side（側） MIX3: 2NA-WM90310-1 2 11 AUDIOGRAM3 JACK3: 2NA-WM90310-1 2 PSUSB: 2NA-WW90300-1 1 to MIX3-CN102to MIX3-CN302 MIC/INST L R L R L R L RPHONESPHONES LINESTE

38、REO OUT X9390C0 R502 USB to MIX3-CN501 JACK3 Circuit Board Component side（部品側） Pattern side（側） PSUSB Circuit Board Component side（部品側） Pattern side（側） AUDIOGRAM3 12 1. Measurement condition 1-1 Environment Temperature (5C 40C) Humidity (30% 90%) 1-2 Power supply Power is supplied from a personal com

39、puter. (Powered through USB bus) 2. Electric characteristics 2-0 0 dBu = 0.775 Vrms 2-1 Preparation Load resistor of each output terminal is as follows: PHONES (L, R) : 40 (3 W or more) Others : 10k 2-2 Unless otherwise specifi ed, the operation elements shall be set as follows, INPUT1 LEVEL control

40、 (GAIN control) : Maximum MIC/INST switch : OFF (MIC) INPUT2 LEVEL control (GAIN control) : Maximum OUTPUT LEVEL control (MASTER level control) : Maximum Others PHANTOM switch : OFF 2-3 Use 1 kHz sine wave for input signal unless otherwise specifi ed. 2-4 Signal source impedance should be 150 . 2-5

41、Power indicator Check that the POWER LED lights when the personal computer is connected. INSPECTIONS INPUT1INPUT2OUTPUT Level control (GAIN control) Level control (GAIN control) Level control (MASTER Level control) MIC/INST switch PHANTOM switch 13 AUDIOGRAM3 2-6 Gain Check that the output level of

42、each output terminal is within the range shown in the Table 2-6.1 and Table 2-6.2. * Check that the difference in the level between channels is 2.0 dB or less. Table 2-6.1 INPUT1 dBu INPUT Input level LEVEL control STEREO OUT L (PHONE) STEREO OUT R (PHONE) qPHONE-66.0Maximum-2.0 2.0 wXLR-22.0Minimum

43、-3.0 2.0-3.0 2.0 e PHONE (UNBAL) -50.0Maximum-2.0 2.0 *1 r-6.0Minimum-2.0 2.0 *1 *1 Set the MIC/INST switch to ON (INST). Table 2-6.2 INPUT2 dBu INPUT Input level LEVEL control STEREO OUT L (PIN) STEREO OUT R (PIN) PHONES LPHONES R t PHONE (UNBAL) L -40.0Maximum -2.0 2.0-14.8 2.0 yR-2.0 2.0-14.8 2.0

44、 u PIN L +4.0Minimum -2.0 2.0 iR-2.0 2.0 2-7 Frequency characteristics In the signal path of q to i in the Table 2-6.1 and Table 2-6.2, check that the output level of each output terminal is within the range of +1.0/-3.0 dB compared with that of 1 kHz when the signal frequency is set to 20 Hz and 20

45、 kHz. (LEVEL control (GAIN control) : Minimum) * Check that the frequency characteristics is within the range of +1.0/-4.5 dB when the signal frequency is set to 20 Hz and 20 kHz and the LEVEL control (GAIN control) is at maximum. 2-8 Crosstalk Input signal from the INPUT2 L and check that the leaka

46、ge level to the STEREO OUT R is -57.0 dBu or less when the output level of the STEREO OUT L is +10.0 dBu. Input signal from the INPUT2 R and check that the leakage level to the STEREO OUT L is -57.0 dBu or less when the output level of the STEREO OUT R is +10.0 dBu. * Set the LEVEL control of the IN

47、PUT1 and INPUT2 to minimum. * Set the LEVEL control of the OUT to NOMINAL. (Direction of clock hand at 3 oclock) 2-9 MASTER PEAK/SIGNAL indicator Check that the MSTER PEAK/SIGNAL LED lights up when a signal within the range shown in the Table 2-9.1 is fed to the input. Table 2-9.1 dBu INPUT Input level PEAKSIGNAL 1-44.0 2.0-64.0 2.0 2-10 Distortion In the signal path of w, r, u and i of the Table 2-6.1 and Table 2-6.2, check that t