Hitachi-DVP735U-cd-sm维修电路原理图.pdf
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1、SERVICE MANUALSERVICE MANUAL DVD PLAYERDVD PLAYER SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT TKTKNo. 9301ENo. 9301E 2003Digital Media Division, TokaiFebruary DV-P735UDV-P735U DV-P735U(C) DV-P533U DV-P735U(C) DV-P533U RadioFans.CN 收音机爱 好者资料库 CONTENTS 1 CAUTIONS FOR SAFETY IN PERFO
2、RMING REPAIR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1 1-1 LASER BEAM SAFETY PRECAUTIONS . . . . . . . . 1-1 1-2 IMPORTANT SAFETY PRECAUTIONS . . . . . . . . . 1-2 1-2-1 Product Safety Notice . . . . . . . . . . . . . . . . . . . . . 1-2 1-2-2 Precautions during Servicing .
3、. . . . . . . . . . . . . . 1-2 1-2-3 Safety Check after Servicing. . . . . . . . . . . . . . . . 1-3 1-3 STANDARD NOTES FOR SERVICING. . . . . . . . . . 1-4 1-3-1 Circuit Board Indications . . . . . . . . . . . . . . . . . . . 1-4 1-3-2 Instructions for Connectors . . . . . . . . . . . . . . . . .
4、1-4 1-3-3 How to Remove/Install Flat Pack-IC . . . . . . . . . . 1-4 1-3-4 Instructions for Handling Semi-conductors . . . . . 1-6 2 GENERAL INFORMATION . . . . . . . . . . . . . . . . .2-1 2-1 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2-2 COMPARISON OF MODELS. . . . . .
5、 . . . . . . . . . . . . 2-2 2-3 OPERATING CONTROLS AND FUNCTIONS. . . . . 2-4 3 MAINTENANCE AND INSPECTION. . . . . . . . . .3-1 3-1 TROUBLESHOOTING. . . . . . . . . . . . . . . . . . . . . . . 3-1 3-2 FIRMWARE RENEWAL MODE. . . . . . . . . . . . . . . . 3-7 3-2-1 How to Update the Firmware Version
6、 . . . . . . . . . 3-7 3-2-2 How to Verify the Firmware Version . . . . . . . . . . 3-8 4 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . .4-1 4-1 CABINET DISASSEMBLY INSTRUCTIONS . . . . . . 4-1 4-1-1 Disassembly Flowchart . . . . . . . . . . . . . . . . . . . . 4-1 4-1-2 Disassembly
7、Method. . . . . . . . . . . . . . . . . . . . . . 4-1 5 EXPLODED VIEW AND PARTS LIST. . . . . . . . .5-1 5-1 EXPLODED VIEW. . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5-2 REPLACEMENT PARTS LIST. . . . . . . . . . . . . . . . . 5-2 5-2-1 Mechanical Parts List . . . . . . . . . . . . . . .
8、. . . . . . 5-2 5-2-2 Electrical Parts List . . . . . . . . . . . . . . . . . . . . . . . 5-3 SCHEMATIC AND BLOCK DIAGRAMS/CBAS 1 SCHEMATIC DIAGRAMS/CBAS AND TEST POINTS . 1 2 WIRING DIAGRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . .
9、 . . . . . . . . . 4 3-1 DVD Main 1/3 Schematic Diagram . . . . . . . . . . . . . . . 4 3-2 DVD Main 2/3 Schematic Diagram . . . . . . . . . . . . . . . 5 3-3 DVD Main 3/3 Schematic Diagram . . . . . . . . . . . . . . . 7 3-4 AV 1/3 Schematic Diagram . . . . . . . . . . . . . . . . . . . . . 8 3-5 A
10、V 2/3 Schematic Diagram . . . . . . . . . . . . . . . . . . . . . 9 3-6 AV 3/3 when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (1) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-
11、1-6) Caution: 1. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) 2. The flat pack-IC on the CBA is affixed with glue, so be careful
12、 not to break or damage the foil of each pin or the solder lands under the IC when removing it. Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape
13、Fig. S-1-2 1-5 With Soldering Iron: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Lift each lead of the flat pack-IC upward one by one, using a shar
14、p pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3)Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the f
15、lat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4)Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) With Iron Wire: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of t
16、he flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3)While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact
17、pads as shown in Fig. S-1-5 (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using twee- zer
18、s. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fin
19、e Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 1-6 2. Installation (1)Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the
20、CBA so you can install a replacement flat pack-IC more easily. (2)The “I” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3)Solder all pin
21、s of the flat pack-IC. Be sure that none of the pins have solder bridges. 1-3-4 Instructions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electro- static charge during unpacking or repair work. 1. Ground for Human Body
22、Be sure to wear a grounding band (1M) that is prop- erly grounded to remove any static electricity that may be charged on the body. 2. Ground for Workbench (4) Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other surface, where the semi-conductors
23、are to be placed. Because the static electricity charge on clothing will not escape through the body ground- ing band, be careful to avoid contacting semi-con- ductors with your clothing. Example : Pin 1 of the Flat Pack-IC is indicated by a mark.Fig. S-1-7 Presolder CBA Flat Pack-IC Fig. S-1-8 CBA
24、CBA Grounding Band Conductive Sheet or Copper Plate 1M 1M 2-1 2-1 SPECIFICATIONS GENERAL INFORMATION2 2-2 2-2 COMPARISON OF MODELS : Same as on left ITEMDV-P735U/P735U(C)/P533UDV-P725U/P325U/P323U Dimensional435(W) x 55(H) x 211(D) mm435(W) x 75(H) x 216(D) mm Weight1.8 kg2.1 kg Tray PanelClearSilve
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