Hitachi-DVP745U-cd-sm维修电路原理图.pdf
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1、SERVICE MANUALSERVICE MANUAL DVD PLAYERDVD PLAYER SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT TKNo. 0401ETKNo. 0401E 2004Digital Media Division, TokaiFebruary DV-P745UDV-P745U DV-P745U(C)DV-P745U(C) DO NOT RESELL OR DIVERT IMPROPERLY.DO NOT RESELL OR DIVERT IMPROPERLY. RadioFans.C
2、N 收音机爱 好者资料库 CONTENTS 1 CAUTIONS FOR SAFETY IN PERFORMING REPAIR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1 1-1 LASER BEAM SAFETY PRECAUTIONS . . . . . . . . 1-1 1-2 IMPORTANT SAFETY PRECAUTIONS . . . . . . . . . 1-2 1-2-1 Product Safety Notice . . . . . . . . . . . . . . . .
3、 . . . . . 1-2 1-2-2 Precautions during Servicing . . . . . . . . . . . . . . . 1-2 1-2-3 Safety Check after Servicing. . . . . . . . . . . . . . . . 1-3 1-3 STANDARD NOTES FOR SERVICING. . . . . . . . . . 1-4 1-3-1 Circuit Board Indications . . . . . . . . . . . . . . . . . . . 1-4 1-3-2 Instructio
4、ns for Connectors . . . . . . . . . . . . . . . . . 1-4 1-3-3 Pb (PbF) Free Solder . . . . . . . . . . . . . . . . . . . . . 1-4 1-3-4 How to Remove/Install Flat Pack-IC . . . . . . . . . . 1-4 1-3-5 Instructions for Handling Semi-conductors . . . . . 1-7 2 GENERAL INFORMATION . . . . . . . . . . .
5、. . . . . .2-1 2-1 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2-2 COMPARISON OF MODELS. . . . . . . . . . . . . . . . . . 2-2 2-3 OPERATING CONTROLS AND FUNCTIONS. . . . . 2-4 2-4 COMPARISON OF MAIN CONTROL ICS . . . . . . . . 2-6 2-5 LIST OF ABBREVIATIONS AND TERMS FOR D
6、VD PLAYER . . . . . . . . . . . . . . . . . . . . . . . . . 2-7 3 MAINTENANCE AND INSPECTION. . . . . . . . . .3-1 3-1 TROUBLESHOOTING. . . . . . . . . . . . . . . . . . . . . . . 3-1 3-2 FIRMWARE RENEWAL MODE. . . . . . . . . . . . . . . . 3-7 3-2-1 How to Update the Firmware Version . . . . . . .
7、. . 3-7 3-2-2 How to Verify the Firmware Version . . . . . . . . . . 3-8 4 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . .4-1 4-1 CABINET DISASSEMBLY INSTRUCTIONS . . . . . . 4-1 4-1-1 Disassembly Flowchart . . . . . . . . . . . . . . . . . . . . 4-1 4-1-2 Disassembly Method. . . . .
8、 . . . . . . . . . . . . . . . . . 4-1 5 EXPLODED VIEW AND PARTS LIST. . . . . . . . .5-1 5-1 EXPLODED VIEW. . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5-2 REPLACEMENT PARTS LIST. . . . . . . . . . . . . . . . . 5-2 5-2-1 Mechanical Parts List . . . . . . . . . . . . . . . . . . . . . 5-2
9、 5-2-2 Electrical Parts List . . . . . . . . . . . . . . . . . . . . . . . 5-3 SCHEMATIC AND BLOCK DIAGRAMS/CBAS 1 SCHEMATIC DIAGRAMS/CBAS AND TEST POINTS . 1 2 WIRING DIAGRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . .
10、. . 4 3-1 DVD Main 1/3 Schematic Diagram . . . . . . . . . . . . . . . 4 3-2 DVD Main 2/3 Schematic Diagram . . . . . . . . . . . . . . . 5 3-3 DVD Main 3/3 Schematic Diagram . . . . . . . . . . . . . . . 7 3-4 AV 1/3 Schematic Diagram . . . . . . . . . . . . . . . . . . . . . 8 3-5 AV 2/3 Schematic
11、 Diagram . . . . . . . . . . . . . . . . . . . . . 9 3-6 AV 3/3 when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (1) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Caution: 1
12、. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape
13、 around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 1-5 3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil
14、 of each pin or the solder lands under the IC when removing it. With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Lift each lead
15、of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pa
16、ck-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When
17、 you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solde
18、r melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5 Fig. S-1-2 Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-3 Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-4 Fine Tip Soldering Iron Sharp Pin 1-6 (4)Bottom of the fl
19、at pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5)Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Note: When using a soldering iron
20、, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Installation (1) Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC
21、on the CBA so you can install a replacement flat pack-IC more easily. (2) The “I” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3) Solde
22、r all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Fig. S-1-5 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-6 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-7 Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-
23、1-8 Presolder CBA Flat Pack-IC 1-7 1-3-5 Instructions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electro- static charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1M) t
24、hat is prop- erly grounded to remove any static electricity that may be charged on the body. 2. Ground for Workbench (4)Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static ele
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