Hitachi-DVP323U-cd-sm维修电路原理图.pdf
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1、SERVICE MANUALSERVICE MANUAL Digital Media Products Division, Tokai DVD PLAYERDVD PLAYER SPECIFICATIONS AND PARTS ARE SUBJECT TO CHANGE FOR IMPROVEMENT TKNo. 9202ETKNo. 9202E DV-P325UDV-P325U DV-P323UDV-P323U February2002 REV SURROUNDAUDIOSUB TITLE OPEN / CLOSE FWD POWER / STANDBY RadioFans.CN 收音机爱
2、好者资料库 CONTENTS SPECIFICATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1-1 COMPARISON OF MODELS . . . . . . . . . . . . . . . . . . . . . . .1-2-1 LASER BEAM SAFETY PRECAUTIONS. . . . . . . . . . . . . .1-3-1 IMPORTANT SAFETY PRECAUTIONS . . . . . . . . . . . . . . .1-4-1 Prod
3、uct Safety Notice . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4-1 Precautions during Servicing. . . . . . . . . . . . . . . . . . . . . .1-4-1 Safety Check after Servicing . . . . . . . . . . . . . . . . . . . . . .1-4-2 STANDARD NOTES FOR SERVICING . . . . . . . . . . . . . . .1-5-1 Circ
4、uit Board Indications . . . . . . . . . . . . . . . . . . . . . . . . .1-5-1 Instructions for Connectors . . . . . . . . . . . . . . . . . . . . . . .1-5-1 How to Remove/Install Flat Pack-IC . . . . . . . . . . . . . . . .1-5-1 Instructions for Handling Semi-conductors . . . . . . . . . . .1-5-3 ORE
5、RATING CONTROLS AND FUNCTIONS . . . . . . . . . .1-6-1 CABINET DISASSEMBLY INSTRUCTIONS . . . . . . . . . . .1-7-1 1. Disassembly Flowchart . . . . . . . . . . . . . . . . . . . . . . . .1-7-1 2. Disassembly Method . . . . . . . . . . . . . . . . . . . . . . . . . .1-7-1 ROM RENEWAL MODE . . . . . .
6、 . . . . . . . . . . . . . . . . . . . . .1-8-1 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-9-1 BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10-1 System Control Block Diagram . . . . . . . . . . . . . . . . . . .1-10-1 RF Signal Process/Servo
7、 Block Diagram . . . . . . . . . . .1-10-2 DVD Signal Process Block Diagram . . . . . . . . . . . . . . .1-10-3 Video Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10-4 Audio Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10-5 Power Supply Block Diagram .
8、 . . . . . . . . . . . . . . . . . . .1-10-6 SCHEMATIC DIAGRAMS/CBAS AND TEST POINTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11-1 DVD Main 1/4 Schematic Diagram . . . . . . . . . . . . . . . .1-11-3 DVD Main 2/4 Schematic Diagram . . . . . . . . . . . . . . . .1-11-4 DVD Main 3/
9、4 Schematic Diagram . . . . . . . . . . . . . . . .1-11-5 DVD Main 4/4 Schematic Diagram . . . . . . . . . . . . . . . .1-11-6 AV 1/3 Schematic Diagram . . . . . . . . . . . . . . . . . . . . . .1-11-7 AV 2/3 Schematic Diagram . . . . . . . . . . . . . . . . . . . . . .1-11-8 AV 3/3, Function when r
10、emoving entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (1) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Caution: 1. Do not supply hot air to the chip parts around the flat pack-IC for
11、over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) 2. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when re
12、moving it. Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 1-5-2 With Soldering Iron: (1)Using desoldering braid, remove the solder f
13、rom all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, u
14、se a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3)Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4)Release
15、 the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) With Iron Wire: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Affix the wire to a work
16、bench or solid mounting point, as shown in Fig. S-1-5. (3)While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5 (4) Bottom of the flat pack-IC is fixed with glue to th
17、e CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure tha
18、t the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Ir
19、on Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 1-5-3 2. Installation (1)Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. (2)The “I” mark on
20、 the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3)Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Instruc
21、tions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electro- static charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1M) that is prop- erly grounded to remove any static
22、electricity that may be charged on the body. 2. Ground for Workbench (4) Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape thr
23、ough the body ground- ing band, be careful to avoid contacting semi-con- ductors with your clothing. Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-1-7 Presolder CBA Flat Pack-IC Fig. S-1-8 CBA CBA Grounding Band Conductive Sheet or Copper Plate 1M 1M 1-6-1 REV SURROUNDAUDIOSUB T
24、ITLE OPEN / CLOSE FWD POWER / STANDBY 123 4 5 6 7 1213 8 91011 DV-P325U only FRONT PANEL REMOTE CONTROL +10 CLOSE 3 MODE 2 SEARCHOPEN 9 ZOOM DISPLAY 8 AUDIO 0 TOP MENU SETUP FF PLAY SKIP SEARCH CH 56 1 A-B REPEAT REPEAT 7 CLEAR SUBTITLE MODE ANGLE RETURN MENU STOP FR SEARCH TV POWER VIDEO/TV 4 SURRO
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