Technics-SAHT-340-EE-Service-Manual电路原理图.pdf

lGeneral Power Source:AC 230V, 50Hz Power consumption:90 W Dimensions (WHD):43060342 mm Mass:3kg lAmplifier section RMS Output Power: Dolby Digital Mode lTotal RMS Dolby Digital mode Power:330 W At 1kHz and total harmonic of 10% lFront:55 W/ Channel (5) lCenter:55 W/ Channel (5) lSurround:55 W/ Channel (5) At 100Hz and total harmonic of 10% lActive subwoofers:55 W/ Channel (5) DIN Output Power: Dolby Digital Mode: lTotal DIN Dolby Digital mode Power: 150 W At 1kHz and total harmonic of 1% lFront:25 W/ Channel (5) lCenter:25 W/ Channel (5) lSurround:25 W/ Channel (5) At 100Hz and total harmonic of 1% lSubwoofer:25 W/ Channel (5) 2006 Panasonic AVC Networks Singapore Pte. Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law. SA-HT340EE Colour (S).Silver Type Preset Memory:FM 15 stations AM/MW 15 stations lFrequency Modulation (FM) Frequency Range:87.5-108.00MHz (50kHz step) Sensitivity:1.8V (IHF) S/N 26dB1.4V Antenna Terminals:75 (unbalanced) lAmplitude Modulation (AM/ MW) Frequency Range:522-1629kHz (9kHz step) AM Sensitivity S/N 20dB at 999kHz: 560V/m lMic jack: Sensitivity:0.7mV (1.2k) Terminal:Mono 6.3mm jack (1 system) lDisc section Discs played (8 cm or 12 cm): (1) DVD DVD-Video, DivX(*6,7) (2) DVD-RAM DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (3) DVD-R DVD-Video, DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) (4) DVD-R DL DVD-Video, DVD-VR (5) DVD-RW DVD-Video, DVD-VR, MP3(*2,7), JPEG(*4,7), MPEG4(*5,7), DivX(*6,7) DVD Home Theater Sound System Specifications ORDER NO.MD0605177CE (6) +R/RW Video (7) +R DL Video (8) CD, CD-R/RW CD-DA, Video CD, SVCD(*1), MP3(*2,7), WMA(*3,7), JPEG(*4,7), MPEG4(*5,7), DivX (*6,7), HighMAT Level 2 (Audio and Image) *1Conforming to IEC62107 *2MPEG-1 Layer 3, MPEG-2 Layer 3 *3Windows Media Audio Ver.9.0 L3 lNot compatible with Multiple Bit Rate (MBR) *4Exif Ver 2.1 JPEG Baseline files lPicture resolution: between 160 x 120 and 6144 x 4096 pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2, 4:4:4). Extremely long and narrow pictures may not be displayed. *5MPEG4 data recorded with Panasonic SD multi cameras or DVD video recorders. lConforming to SD VIDEO specifications (ASF standard)/ MPEG4 (Simple Profile) video system/G.726 audio system. *6Plays all versions of DivX video (including DivX6) with standard playback of DivX media files. Certified to the DivX Home Theater Profile. lGMC (Global Motion Compensation) is not supported. *7The total combined maximum number of recognizable audio, picture and video contents and groups: 4000 audio, picture and video contents and 400 groups. Pick up: Wavelength: lCD:785nm lDVD:662nm Laser power: lCD:CLASS 1M lDVD:CLASS 1 Audio output (DISC): Number of channels:5.1 ch (FL, FR, C, SL, SR, SW) Audio performance: Frequency response: DVD (linear audio):4 Hz-22 kHz (48 kHz sampling) 4 Hz-44 kHz (96 kHz sampling) CD-Audio:4 Hz-20 kHz S/N ratio: CD-Audio:105 dB Dynamic range: DVD (linear audio):95 dB CD-Audio:95 dB Total harmonic distortion: CD-Audio:0.005 % lVideo section Video system: Signal system:PAL 625/50, PAL 525/60, NTSC Composite video output: Output level:1 Vp-p (75 ) Terminal:Pin jack (1 system) Scart jack (1 system) S-video output: Y output level:1 Vp-p (75 ) C output level:PAL; 0.3Vp-p (75) NTSC; 0.286 Vp-p (75 ) TerminalS terminal (1 system) Scart jack (1 system) Component video output: NTSC: 480p/480i, PAL:576p/576i Y output level:1 Vp-p (75 ) PBoutput level:0.7 Vp-p (75 ) PRoutput level:0.7 Vp-p (75 ) Terminal:Pin jack (Y: green, PB: blue, PR: red) (1 system) RGB video output: R output level:0.7 Vp-p (75 ) G output level:0.7 Vp-p (75 ) B output level:0.7 Vp-p (75 ) Terminal:Scart jack (1 system) Power consumption in standby mode: approx 1W Note: 1.Specifications are subject to change without notice. Mass and dimensions are approximate. 2.Total harmonic distortion is measured by the digital spectrum analyzer. Solder: This model uses lead free solder (PbF). Mechanism: This model uses DL2SU (Single tray) mechanism. Power Supply: This model uses Switching Mode Power Supply (SMPS) Module for power-up unit. Refer to the original service manual for *1, *2, *3, *4. 2 SA-HT340EE 3 SA-HT340EE 1 Safety Precautions 5 1.1. GENERAL GUIDELINES 5 1.2. Before Repair and Adjustment (Using SMPS) 5 1.3. Protection Circuitry 5 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 6 3 Precaution of Laser Diode 7 4 About Lead Free Solder (PbF) 8 4.1. Service caution based on legal restrictions 8 5 Handling Precautions for Traverse Unit 9 5.1. Cautions to Be Taken in Handling the Optical Pickup Unit 9 5.2. Grounding for electrostatic breakdown prevention 9 6 Accessories 11 7 Operation Procedures 12 7.1. Remote Control Key Buttons Operations 12 7.2. Main Unit Key Buttons Operations (SA-HT340) 13 7.3. Disc information 14 7.4. About DivX VOD Content 16 8 Self-Diagnosis and special mode setting 17 8.1. Service Mode Summary Table 17 8.2. Service Mode Table 17 8.3. DVD Self Diagnostic Function-Error Code 22 8.4. Sales Demonstration Lock Function 24 8.5. Service Precautions 25 9 Assembling and Disassembling 26 9.1. Disassembly Flow Chart 27 9.2. Main Components and P.C.B. Locations 27 9.3. Disassembly of Top Cabinet 28 9.4. Disassembly of the DVD Lid (When taking out disc manually) 28 9.5. Disassembly of Front Panel 29 9.6. Disassembly of FL P.C.B., Mic P.C.B. & Volume P.C.B. 29 9.7. Disassembly of DVD Mechanism Unit 30 9.8. Disassembly of DVD Module P.C.B. 30 9.9. Disassembly of Rear panel 31 9.10. Disassembly of SMPS Module P.C.B. 31 9.11. Disassembly of Main P.C.B. & Tuner Extent P.C.B. 31 9.12. Disassembly of Digital Amp IC (IC5100) 31 10 Service Position 33 10.1. Servicing position of the DVD Module P.C.B. 33 10.2. Servicing position of the Main P.C.B. 33 10.3. Servicing position of the SMPS Module P.C.B. 33 11 Assembly and disassembly of Mechanism Unit 34 11.1. Disassembly Procedure 34 12 Measurements and Adjustments 40 12.1. Service Tools and Equipment 40 12.2. Important points in adjustment 40 12.3. Storing and handling of test discs 40 12.4. Optical adjustment 41 13 Abbreviations 42 14 Voltage and Waveform Chart 44 14.1. DVD Module P.C.B. 44 14.2. Main P.C.B. 45 14.3. FL P.C.B., Mic P.C.B. & Tray Loading P.C.B. 46 14.4. SMPS Module P.C.B. 46 14.5. Waveform Chart 47 15 Illustration of ICs, Transistors and Diodes 48 16 Wiring Connection Diagram 49 17 Block Diagram 51 18 Schematic Notes 57 19 Schematic Diagram 59 19.1. (A) Optical Pickup Unit & DVD Module (DV3.2) Circuit 59 19.2. (B) Main/Power, FL, Volume & Mic Circuit 63 19.3. (C) Tray Loading & Tuner Extent Circuit 69 20 Printed Circuit Board 71 20.1. (A) DVD Module P.C.B. 71 20.2. (B) Main/Power P.C.B. 72 20.3. (C) FL, Volume, Mic, Tray Loading & Tuner Extent P.C.B. 73 21 Basic Troubleshooting Guide 75 21.1. Basic Troubleshooting Guide for Traverse Unit (DVD Module P.C.B.) 75 22 Overall Block (HT340) 76 22.1. HT340 DVD Unit Block 77 22.2. HT340 Block (Analog Signal : DVD 5.1ch Play Back Mode) 78 22.3. HT340 Block (Analog Signal : 2ch Analog Input Mode) 79 22.4. HT340 Power Supply Block 80 22.5. HT340 Power (Main) Block 81 23 Terminal Function of ICs 82 23.1. IC2018 (C2CBYY000194): Microprocessor IC 82 24 Exploded Views 83 24.1. Cabinet Parts Location 83 24.2. Packaging 85 25 Replacement Parts List 86 25.1. Component Parts List 87 CONTENTS Page Page 4 SA-HT340EE 1 Safety Precautions 1.1. GENERAL GUIDELINES 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed. 3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards. 1.1.1. LEAKAGE CURRENT COLD CHECK 1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the chassis, the reading must be. Figure 1 1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. 1.2. Before Repair and Adjustment (Using SMPS) This model uses Switching Mode Power Supply (SMPS) Module to provide the neccessary voltages for the unit. DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices. After repairs are completed, restore power gradually using a variac, to avoid overcurrent. Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode (at volume minimum) should be 650 mA. 1.3. Protection Circuitry The protection circuitry may have operated if either of the following conditions are noticed: No sound is heard when the power is turned on. Sound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used. If this occurs, follow the procedure outlines below: 5 SA-HT340EE 1. Turn off the power. 2. Determine the cause of the problem and correct it. 3. Turn on the power once again after one minute. Note: When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again. 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device). 6 SA-HT340EE 3 Precaution of Laser Diode CAUTION : This product utilizers a class 1 laser. Invisible laser radiation is emitted from the optical pick up lens. When the unit is turned on: Wavelength : 662nm/785nm Maximum output radiation power from pick up : 100W/VDE Laser radiation from pick up unit is safety level, but be sure the followings: 1. Do not disassemble the optical pick up unit, since radiation from exposed laser diode is dangerous. 2. Do not adjust the variable resistor on the pick up unit. It was already adjusted. 3. Do not look at the focus lens using optical instruments. 4. Recommend not to look at pick up lens for a long time. 7 SA-HT340EE 4 About Lead Free Solder (PbF) 4.1. Service caution based on legal restrictions 4.1.1. General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure) Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder