Sony-HBD-T57-Service-Manual电路原理图.pdf

SERVICE MANUAL Sony Corporation Audio rated 60 watts per channel minimum RMS power, with no more than 1% total harmonic distortion from 250 milli watts to rated output. Other models: POWER OUTPUT (rated) Front L/Front R:108 W + 108 W (at 3 ohms, 1 kHz, 1% THD) HBD-E370: POWER OUTPUT (reference) Front L/Front R/Center/Surround L/Surround R: 142 W (per channel at 3 ohms, 1 kHz) Subwoofer:140 W (at 3 ohms, 80 Hz) HBD-E870/HBD-E570/HBD-E470/HBD-T57: POWER OUTPUT (reference) Front L/Front R/Center/Surround L/Surround R: 167 W (per channel at 3 ohms, 1 kHz) Subwoofer:165 W (at 3 ohms, 80 Hz) Inputs (Analog) AUDIO (AUDIO IN)Sensitivity: 450/250 mV Inputs (Digital) SAT/CABLE (COAXIAL), TV (OPTICAL) Supported formats: LPCM 2CH (up to 48 kHz), Dolby Digital, DTS Video Section OutputsVIDEO: 1 Vp-p 75 ohms COMPONENT: Y: 1 Vp-p 75 ohms PB/CB, PR/CR: 0.7 Vp-p 75 ohms HDMI OUT: Type A (19 pin) BD/DVD/Super Audio CD/CD System Signal format systemNTSC (US and USB Section (USB) port:Type A (For connecting USB memory, memory card reader, digital still camera, and digital video camera) Maximum current:500 mA LAN Section LAN (100) terminal100BASE-TX Terminal Tuner Section SystemPLL quartz-locked digital synthesizer FM tuner section Tuning range North American models:87.5 MHz - 108.0 MHz (100 kHz step) Other models:87.5 MHz - 108.0 MHz (50 kHz step) Antenna (aerial)FM wire antenna (aerial) Antenna (aerial) terminals 75 ohms, unbalanced Intermediate frequency10.7 MHz General Power requirements North American model:120 V AC, 60 Hz Other models: 50/60 Hz Power consumptionOn: 170 W Standby: 0.3 W (at the Power Saving mode) Dimensions (approx.)430 mm 85 mm 335 mm (17 in 3 3/8 in 13 1/4 in) (w/h/d) incl. projecting parts Mass (approx.)4.8 kg (10 lb 10 oz) Design and specifications are subject to change without notice. Canadian models) PAL/NTSC (AEP and UK models) 220 - 240 V AC, RadioFans.CN 收音机爱 好者资料库 HBD-E370/E470/E570/E870/T57 2 NOTES ON CHIP COMPONENT REPLACEMENT Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. FLEXIBLE CIRCUIT BOARD REPAIRING Keep the temperature of soldering iron around 270 C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A) 1.5 k0.15 F AC voltmeter (0.75 V) To Exposed Metal Parts on Set Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONC- TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DON- NS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. This product incorporates copyright protection technology that is protected by U S patents and other intellectual property rights Use of this copyright protection technology must be authorized by Macrovision, and is intended for home and other limited viewing uses only unless otherwise authorized by Macrovision Reverse engineering or disassembly is prohibited This system incorporates with Dolby* Digital and Dolby Pro Logic (II) adaptive matrix surround decoder and the DTS* Digital Surround System * Manufactured under license from Dolby Laboratories Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Labora- tories * Manufactured under license under U S Patent #s: 5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,212,872; 7,333,929; 7,392,195; 7,272,567 clamp qd MB-134 board HBD-E370/E470/E570/E870/T57 13 2-4. BRACKET (MB) BLOCK 2-5. FUSE (F901), POWER BOARD 6 screw (P3 ? 6) 7 screw (BV3) 8 three screws (BV3) 1 power cord connector (CN901) 2 cord bush (2104) 4 connector (CN403) 3 power-supply cord (US, Canadian) power cord (AEP, UK) 8 two screws (BV3) 9 bracket (MB) block 5 connector (CN400) 1 glass fuse (DIA. 5) (8A/125V) (F901) (US, Canadian) fuse (H. B. C.) (T5AH/250V) (F901) (AEP, UK) 8 Remove the POWER board from PC board holder. 7 eight screws (BV3) 5 connector (CN904) 6 connector (CN17) 2 screw (BV3) 0 POWER board 9 fuse label (T. H) 4 bracket R (MB foot) 3 (AEP, UK) HBD-E370/E470/E570/E870/T57 14 2-6. FRONT PANEL BLOCK Note: Please prepare the thin wire (clip etc.). 2-7. CONNECT BOARD 5 three screws (BV3) 7 three screws (BV3) 6 three ground plates (front) 2 9 3 three claws 4 loading panel assy (10EZ) 8 three claws 8 two claws 8 three claws q; connector (CN700) qa front panel block 7 three screws (BV3) 3 claw clip etc. 1 3 four screws (BV3) 4 1 connector (CN301) 5 CONNECT board 2 wire (flat type) (15 core) (CN300) four claws HBD-E370/E470/E570/E870/T57 15 2-8. BD DRIVE (BPX-5) 2-9. BACK PANEL BLOCK 3 bracket L (MB foot) 9 bracket (S-AIR foot) qs sound sheet qd BD drive (BPX-5) 0 four screws (BV3) 5 three screws (BV3) 1 screw (BV3) 7 screw (BV3) 2 8 qa 6 bracket (S-AIR UME) 4 screw (BV3) 4 wire (flat type) (9 core) (CN10) (US, Canadian) wire (flat type) (11 core) (CN11) (AEP, UK) 7 screw (BV3) 1 screw (BV3) 7 screw (BV3) 8 back panel block 7 screw (BV3) 7 two screws (BV3) 6 two screws (BV3) 5 fan connector (CN3000) 2 three screws (BV3) 3 bracket (S-AIR UME) HBD-E370/E470/E570/E870/T57 16 2-10. MAIN BOARD 2-11. AUDIO BOARD 5 wire (flat type) (27 core) (CN505) 6 wire (flat type) (15 core) (CN508) 1 screw (BV3) 3 bracket R (MB foot) 2 4 connector (CN904) 7 wire (flat type) (15 core) (CN504) (US, Canadian) wire (flat type) (17 core) (CN502) (AEP, UK) 8 wire (flat type) (15 core) (CN702) q; wire (flat type) (16 core) (CN703) 9 wire (flat type) (18 core) (CN701) qa four screws (BV3) qd two screws (BV3) qd six screws (BV3) qf MAIN board qs heat sink (S-master DDV) 6 three screws (BV3) 7 AUDIO board 3 bracket L (MB foot) 1 screw (BV3) 2 4 connector (CN17) 5 wire (flat type) (15 core) (CN13) (US, Canadian) wire (flat type) (17 core) (CN15) (AEP, UK) HBD-E370/E470/E570/E870/T57 17 2-12. OPTICAL DEVICE (KEM-460AAA), WIRE (FLAT TYPE) Note: Please prepare the thin wire (clip etc.). 1 two screws (BVTP 2.6) 7 two float screws (S) qa insulator 5 Insert the thin wire (clip etc.). qa insulator qa insulator qs optical device (KEM-460AAA) qa insulator qd non-halogene tape qf wire (flat type) (5 core) qk wire (flat type) (45 core) qj wire (flat type) (9 core) loading assy (D) qh ffc holder (rear) 2 two claws 6 8 9 qg 0 3 two claws 4 chuck holder assy (D) Bottom view 1 wire (flat type) (45 core) Fold. Under the guide. Under the guide. (Fold area) boss boss loading assy (D) terminal face terminal face 2 Through the hole. 4 Through the hole. 3 wire (flat type) (9 core) 5 ffc holder (rear) 7 two claws 7 three claws 6 ? ? ? ? ? ? ? ? ? ? ? ? ? ? Note: This illustration sees the loading assy (D) from bottom side. HBD-E370/E470/E570/E870/T57 18 SECTION 3 TEST MODE COLD RESET The cold reset clears data except BD/DVD data stored in the RAM to initial conditions. Execute this mode when returning the set to the customers. Procedure: 1. Press the ?/1 button to turn the power on. 2. Press the x and VOLUME buttons simultaneously and hold down (around 5 seconds). 3. The message “COLD RESET” appears on fl uorescent indica- tor tube, then becomes standby states. DEMO MODE This mode let you lock the disc tray. When this mode is activated, the disc will not eject when the Z button is pressed. The message “LOCKED” will be displayed on the fluorescent indicator tube. Procedure: 1. Press the ?/1 button to turn the power on. 2. Press the FUNCTION button to select the “BD/DVD”. 3. Press the x and Z buttons simultaneously and hold down until “DEMO ON” or “DEMO OFF” displayed on the fluores- cent indicator tube (around 5 seconds). S-AIR ID SETTING CHANGE Procedure: 1. Press the ?/1 button to turn the power on. 2. Press the FUNCTION and VOLUME + buttons simultane- ously and hold down (around 5 seconds). 3. S-AIR ID setting is changed (A B C A.). PANEL TEST Procedure: 1. Press the ?/1 button to turn the power on. 2. Press button in order of the RETURN 0 0 1 SUBTITLE on the remote commander (Make the interval when each button is pressed within two seconds). 3. All segments in fl uorescent indicator tube are lighted up. And half segments in fl uorescent indicator tube are lighted up, oth- ers half segments in fl uorescent indicator tube are lighted up, then LEDs and all segments in fl uorescent indicator tube are lighted up. This operation is repeated. 4. When all segments in fl uorescent indicator tube are lighted up in the state of step 3, press the VOLUME + button on the remote commander and model information is displayed on the fl uorescent indicator tube. Each time the VOLUME + button on the remote commander is pressed, the display changes from destination information, STR version, SYS version, UI version, BDLIB version, ST version, TA version, DSP version, TM version, CEC version, SAIR version, PF version in this order, and returns to the mod- el information display. Each time the VOLUME button on the remote commander is pressed, the version and date are switched. 5. In the state of step 3, press the FUNCTION button on the remote commander and “K 0” is displayed on the fluorescent indicator tube. “K 0” value increases whenever a button on the set is pressed. However, once a button has been pressed, it is no longed taken into account. All buttons on the set are pressed, “OK” and “K 7” are alter- nately displayed on the fluorescent indicator tube. 6. To release from this mode, press the ?/1 button. AMP TEST Procedure: 1. Press the ?/1 button to turn the power on. 2. Press button in order of the RETURN 0 1 1 SUBTITLE on the remote commander (Make the interval when each button is pressed within two seconds). 3. The message “MEASURE” appears on the fluorescent indica- tor tube and enter the AMP test mode. 4. Press the BLUE button on the remote commander, the state of D.C.A.C. microphone is displayed on the fl uorescent indica- tor tube. * $ * : Either of “IN”/“NON” is displayed by the state of detection of the microphone. : Either of “OK”/“NG” is displayed by the state of digital audio data input. $ : Microphone input audio data A/D value (0 255). 5. Press the MUTING button on the remote commander, “VOL N” (The change in the volume is usual)/“VOL MSM” (The change in the volume is a switch of MIN/1/20/MAX) can be switched. 6. Press the SUBTITLE button on the remote commander, the message “VACS ON” or “VACS OFF” appears on the fl uores- cent indicator tube and thus the VACS on/off are changed. 7. To release from this mode, press the ?/1 button. BD SERVICE MODE Note: The operation in this mode must use a remote commander. Setting method of the BD service mode: 1. Press the ?/1 button to turn the power on. 2. Press button in order of the RETURN 0 2 1 SUBTITLE on the remote commander. (Make the interval when each button is pressed within two seconds) 3. Enter the BD service mode. 1. Main Functions ErrorLog display Display the error log. Displayed contents can also be saved in an USB memory device. Diag Performs unit test of devices installed on the board. Factory Initialize Restores the set to its factory settings. Network Checks the wired network connection. Version Up (version update) Not used. System Information Displays the system information of the set. Displays information such as the software version, drive infor- mation, etc. EMC Test Mode Not used. Drive Write drive OP data and check drive. HBD-E370/E470/E570/E870/T57 19 2. Menu Tree ?Service Mode Menu 1 Diag 2 Log 3 Factory Initialize 4 Network 5 Version Up 6 System Information 7 EMC Test Mode 8 Drive ?Version Up ? Not used ?System Information ? Displays system information ?Factory Initialize ? ?stores set to factory settings ?Log Displays Error Log Error Log ? Displays error log ?Diag ?Network ? ?twork diagnosis for wired Ping ? ? ? ? Ifconfig ? View network status Device Test ? ? ? Video Test ? Video output test ?udio Test ? ?udio output test ?udio Input Test ? ? ? ? ? ? ? ? Not used ?EMC Test Mode ? Not used ?Drive ? Write drive OP data and check drive Start Initialize for TV ? ? ? Start Initialize ? ? ? ? ? ? ? ? ? HBD-E370/E470/E570/E870/T57 20 3. Service Mode Menu (Top Menu) This is the top menu of service mode. Each function is accessed from this screen. Operation: 1 Moves to Diag screen 2 Moves to Log screen 3 Moves to Factory Initialize screen 4 Moves to Network screen 5 Moves to Version Up (DISC version update) screen (Not used) 6 Moves to System Information screen 7 Moves to EMC test mode screen (Not used) 8 Moves to Drive screen M/m Moves the cursor 3 Moves to the screen of the item selected with the cursor * Cursor is not displayed when the menu is fi rst displayed. ?Service Mode Menu 2 Log 3 Factory Initialize 4 Network 5 Version Up 6 System Information 7 EMC Test Mode 8 Drive HELP : DOWN ENT (NUM) HELP (currently available keys, etc.) is displayed 1 Diag 4. Diag (Device Test) This screen is used to test devices mounted on the board. Screen 1: Selects the test category Operation: </, Selects the category m/3 Moves to the selected category Screen 2: Device test Selects the device to test after selecting Device Test in screen 1. Operation: </, Selects the device to t