Sony-BDP-BX58-Service-Manual电路原理图.pdf

Sony Corporation Home Entertainment Business Group SERVICE MANUAL 9-890-745-11 2010L6900-1 2010.12 Published by Design Engineering Dept. BLU-RAY DISC / DVD PLAYER Ver. 1.0 2010.12 BDP-BX58/S480/S483/S580 RMT-B109A/B109P/B110A/B110P SPECIFICATIONS System Laser: Semiconductor laser Inputs and Outputs: (Jack name:Jack type/Output level/Load impedance) HDMI Out : HDMI 19-pin standard connector Component Video out: (Y, PB, PR Phono jack/Y: 1 0 Vp-p/ PB, PR: 0 7 Vp-p/75 ohms Phono jack/1 0 Vp-p/75 ohms LAN (100): 100BASE-TX Terminal USB: USB jack Type A (For connecting a USB memory, General Power requirements: 120V AC, 60Hz (US, CND) 220 240V AC, 50/60Hz (AEP,UK, AUS,RUS,) Power consumption: 20W (BDP-S480/S483) Dimensions (approx.): 430 mm 199 mm 36mm (17 in 7 4/5 in 17/16 in.) (width/depth/height) incl projecting parts Mass (approx.): gk71 Operating temperature: 5 C to 35 C(41 F to 95 F) Operating humidity: 25 % to 80 % Supplied accessories: Specifications and design are subject to change without notice Audio/video cable (phono plug 3) (1) Remote commander (remote) (1) Size AA (R6) batteries (2) Photo: BDP-S480 Remote : RMT-B109A HDMI cable (1) (BDP-BX58:US) (BDP-S480:US/S580:US/BX58:US) ENERGY STAR and the ENERGY STAR mark are registered U.S. marks. ENERGY STAR is a registered mark owned by the U.S. government. US Model Canadian Model Saudi Arabia Model Latin America Model Korean Model Indian Model Brazilian Model Taiwan Model AEP Model UK Model Australia/NZ ModelArgentina Model Middle East Model memory card reader,digital still camera and digital video camera) (1) (BDP-S480 : TW only) LAN cable (Except AEP,UK,E,AR,KR,IN,TW,BR) 22W (BDP-S580) 110 240V AC, 50/60Hz (E,AR,BR,EA,KS,IN) 110V AC, 60Hz (TW) ) : Line Out R-Audio-L: Phone jack/2 Vrms/10 kilohms Digital Out(Coxial): Phono jack/0 5 Vp-p/75 ohms BDP-S480 BDP-S480/S580/BX58 BDP-S480/S580 TM BDP-S580 BDP-S480/S483 BDP-S480/S580 220V AC, 60Hz (KR) Russian Model Wireless(BDP-S580/BX58 only) IEEE 802 11 b/g/n Frequency Range: Wireless LAN standard: 2 4GHz Band:Channels 1-11(US, CND) Modulation: DSSS and OFDM 2 4GHz Band:Channels 1-13 (OTHERS) Line Out Video: RadioFans.CN 收音机爱 好者资料库 2 BDP-BX58/S480/S483/S580 SAFETY CHECK-OUT LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable (See Fig. A) 1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are “pinched” or contact high-wattage resistors. 3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement. 5. Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer. 6. Check the B+ voltage to see it is at the values specified. 7. Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. After correcting the original service problem, perform the following safety checks before releasing the set to the customer: 1.5k0.15F (0.75 V) Parts on Set Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. CAUTION: The use of optical instrument with this product will increase eye hazard CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia- tion exposure. This label is located on the laser protective housing inside the enclosure. WARNING! WHEN SERVICING, DO NOT APPROACH THE LASER EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO CONFIRM LASER BEAM EMISSION, BE SURE TO OBSERVE FROM A DISTANCE OF MORE THAN 25 cm FROM THE SURFACE OF THE OBJEC- TIVE LENS ON THE OPTICAL PICK-UP BLOCK. For customers in European countries product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK OR DOTTED LINE WITH MARK ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE- MENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFS PAR UNE MARQUE SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PISES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPMENTS PUBLIS PAR SONY. RadioFans.CN 收音机爱 好者资料库 3 TABLE OF CONTENTS 1. SERVICE NOTE 1-1. Disc Removal Procedure If The Tray Cannot Be Ejected (Forced Ejection) . 1-1 1-2. Work when optical device are replaced . 1-1 1-3. Test Disc . 1-2 1-3-1. Operation and Display . 1-2 1-4. Drive Repairing. 1-15 1-4-1. Preparation . 1-15 1-4-2. Checking Flow Drive (BU) section . 1-15 1-4-3. BU Check Flow zz . 1-16 1-4-4. BU (Optical Block) Repair Guide . 1-16 1-4-5. BU Adjustment Flow yy . 1-17 1-4-6. KEM-470AAA/C2RP Packing Spec. . 1-17 1-4-7. KEM-470AAA/C2RP Packing . 1-18 1-4-8. BU Data Decode Jig . 1-19 1-4-9. Loading For Service . 1-20 1-4-10. Laser Caution Label . 1-20 2. DISASSEMBLY 2-1. Disassembly Flow . 2-1 2-2. Upper Case . 2-1 2-3. Tray Cover Assy . 2-2 2-4. Front Panel Assy, FL-203 and IF-170 Board . . 2-2 2-5. Rear Panel Block . 2-3 2-6. MB-139 Board . 2-3 2-7. BD Drive . . 2-4 2-8. Switching Regulator . 2-5E 3. BLOCK DIAGRAM 3-1. Overall Block Diagram. 3-1 3-2. DSP Block Diagram . 3-2 3-3. AV OUT Block Diagram . 3-3 3-4. USB/ETHER, Block Diagram . 3-4 3-5. Power Block Diagram . 3-5E 4. SCHEMATIC DIAGRAM 4-1. This Note Is Common For Schematic Diagrams . 4-1 4-2. Frame Schematic Diagram. 4-2 4-3. IF-170 Board (FRONT RIGHT) Schematic Diagram . 4-3 4-4. IF-170 Board (USB FRONT) Schematic Diagram . 4-4 4-6. MB-139 Board (DDR 3 A) Schematic Diagram (1/17). 4-6 4-7. MB-139 Board (DDR 3 B) Schematic Diagram (2/17). 4-7 4-14. MB-139 Board (AUDIO) Schematic Diagram (9/17). 4-14 4-15. MB-139 Board (VIDEO) Schematic Diagram (10/17). 4-15 4-16. MB-139 Board (GPIO/JTAG) Schematic Diagram (11/17) . 4-16 4-17. MB-139 Board (IF CON) Schematic Diagram (12/17). 4-17 4-18. MB-139 Board (FE OP/GIO) Schematic Diagram (13/17). 4-18 4-19. MB-139 Board (FE_POWER/MOTOR DRIVE) 4-23. Waveforms . 4-23E 5. PRINTED WIRING BOARD 5-1. This Note Is Common For Printed Wiring Boards . 5-1 5-2. FL-203 Board (REAR) Printed Wiring Board. 5-2 5-3. IF-170 Board Printed Wiring Board . 5-3 5-4. MB-139 Board(MAIN) Printed Wiring Board (Side A) . . 5-4 5-5. MB-139 Board (MAIN) Printed Wiring Board (Side B) . 5-5E 6. IC PIN FUNCTION DESCRIPTION . 6-1 7. SERVICE MODE . 7-1 8. ERROR LOG LIST . 8-1 9. TROUBLESHOOTING . 9-1 10. REPAIR PARTS LIST 10-1. Exploded Views . 10-1 10-1-1. Case Section . 10-1 10-1-2. . 10-2 10-1-3. Main Chassis Section . 10-3 10-1-4. BD Section . 10-4 Accessories 10-2. Electrical Parts List . 10-5 BDP-BX58/S480/S483/S580 Schematic Diagram (14/17) . 4-19 4-11. MB-139 Board (USB) Schematic Diagram (6/17). 4-11 4-12. MB-139 Board (HDMI) Schematic Diagram (7/17). 4-12 4-13. MB-139 Board (ETHERNET) Schematic Diagram (8/17). 4-13 2-9. Circuit Boards Location . 2-5E 1-5. Rear Panel Assembly Caution. . 1-23E egaP e l t iT no i t ceSegaP e l t iT no i t ceS 1-3-2. Main functions . 1-9 4-9. MB-139 Board (POWER 2) Schematic Diagram (4/17). 4-9 4-10. MB-139 Board (FLASH/HOST) Schematic Diagram (5/17). 4-10 4-8. MB-139 Board (POWER) Schematic Diagram (3/17). 4-8 4-5. FL-203 Board (POWER) Schematic Diagram . 4-5 4-20. MB-139 Board (DC FAN) Schematic Diagram (15/17). 4-20 4-21. MB-139 Board (VIDEO IN OUT) Schematic Diagram (16/17). 4-21 4-22. MB-139 Board (SATA) Schematic Diagram (17/17) . 4-22 1-1 BDP-BX58/S480/S483/S580 SECTION 1 SERVICE NOTE 1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION) 1. Remove the upper case. (Refer to page 2-1) 2. Insert a clip in the hole of a drive and open a tray. Note 1-2. Work when optical device are replaced Note: Please do the following work when you replace the optical device. 1. Install it in PC after downloading two set of software from following URL. (Refer to “1-4-8. BU Data Decode Jig” on page 1-19) STEP 1 Microsoft .NET Framework Version 2.0 Redistributable Package (x86) (1)Replace BU (MB is original) (2)Replace MB (BU is original) (3)Replace both BU and MB JIG Requirement Digital camera (recommend with macro mode) Barcode decoder (BDPRdec_ver2.0) installed in JIG PCs USB memory ESD work bench Procedure (all cases) Refer the diagram Remarks: The servo adjustment procedure will be carried out during OP data Writing. There is no manual adjustment procedure. LD ON TIME history doesnt carry over. Do not touch any optical block parts, Turn Table and during replacing. BD Laser diode is very sensitive! Optical Block Unit (BU) IOP check flow (zz) Before BU Replacement Enter Service Mode Press ., , and plug in AC Power Inside *Service Mode Menu Select 8 Drive Inside *Drive Select 7 OP Check Menu Inside *OP Check Menu Select 2 dIOP then press ENTER Specification dIOP BD: 6mA DVD, CD: 9mA IOP out of specification need BU replacement Optical Block Unit (BU) replace (Flowchart yy) AC Power OFF NO YES + - + - BDP-BX58/S480/S483/S580 1-17 1-4-5. BU Adjustment Flow yy 1-4-6. KEM-470AAA/C2RP Packing Spec. Optical Block Unit (BU) OP Data Write Flow (yy) After BU/MB Replacement Remove the defective BU from Loading Assy and also remove BU insulator (4pcs) Unpack new BU and take OP Data Barcode photo by camera Assemble BU with Insulators to Loading Assy (tighten screw with 2kgf) Decode the OP Data Barcode phot using BDPRdec.exe and save the test data to USB memory(File Name: BuData.txt) Enter Service Mode and insert USB memory to USB connector Select 8 Drive - Select 1 Drive OP data Write Press ENTER After Finishing ReWrite OP data - Turn AC Power OFF And confirm dIOP by select 7 OP Check Menu to verify IOP in specification IOP in specification - Turn AC Power OFF Turn Power ON and check playback perfor