Philips-HTS-3541-Service-Manual电路原理图.pdf

TABLE OF CONTENTS Page Service Manual . Mechanical and Dismantling Instructions.3-1 . Software Upgrades .4-1 . Trouble Shooting Chart.5-1 . Wiring Diagram.6-1 . Electrical Diagrams and Print-layouts.7-1 . Set Mechanical Exploded view Step2: Remove the solder joint on the ESD protection point; （NOTICE: REMOVE THE SOLDER JOINT AS THE WHITE ARROW DIRECTION IN ABOVE PICTURE） Step3: Connect the 4PIN cable with the base. (Figure 2/3) Step4: Take a label (can be reused) to cover the pane to prevent dust and touching the protection point (Figure 4) 1. L oad er 2. 4 pin bas e 3. I nser t 4pi n ca ble 1-9 Note: The ESD protection point needs to be soldered if: 1). it is still under good condition; 2). It is defective but need to sent back for failure analysis to support back charging evidence. This is also applicable to all partnership workshops. 2. Reference about the loader: DESCRIPTION POSITION BLU-RAY LOADER L9829+414H08 OPU LOADER LABEL LABEL 4PIN CONNECTOR L=260MM 4P1). The ASSY-loader includes three components, as below picture: 2). top and bottom pictures : TOP Bottom The ASSY-loader The cable The loader The label 1-10Lead-Free requirement for service INDENTIFICATION: Regardless of special logo (not always indicated) One must treat all sets from 1.1.2005 onwards, according next rules. Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360°C 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use highest lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website: www.atyourservice.ce.Philips.com You find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. Notes 1-11