Philips-MCD-705-Service-Manual电路原理图.pdf

Version 1.0MCD705© 3141 785 30630Service ManualDVD Micro Systemall versionsPublished by LX 0539 Service Audio Printed in The Netherlands Subject to modification©Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrievalsystem or transmitted, in any form or by any means, electronic, mechanical, photocopying,or otherwise without the prior permission of Philips.Handling chip components .1-1Information about lead-free soldering.1-2Technical specification.2-1Service tools .2-1Service measurement setup.2-2Connections and controls.3-1.3-4Disassembly diagram .4-1.4-2Software version and upgrading.5-1Set block diagram.5-2Set wiring diagram.5-3VFD BOARDcircuit diagram .6-1layout diagram .6-2TUNER BOARD circuit diagram .7-1layout diagram .7-2layout diagram-amp box pcb assy.7-2AMP BOARDcircuit diagram .8-1 layout diagram .8-2CPU BOARDcircuit diagram .9-1 layout diagram .9-2ALC VOLUME BOARDcircuit diagram .10-1 layout diagram .10-2DVD MPEG BOARD circuit diagram .11-1.11-5layout diagram .11-6Exploded view diagram.12-1Mechanical partslist .12-2Electrical partslist.13-1.13-3TABLE OF CONTENTSCLASS 1LASER PRODUCT1 - 1HANDLING CHIP COMPONENTS1 - 2INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE is producing lead-free sets from 1.1.2005 onwards. IDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Example S/N: Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12 So from 0501 onwards = from 1 Jan 2005 onwards Important note : In fact also products of year 2004 must be treated in this way as long as you avoid mixin g solder-alloys ( leaded/ lead -free). So best to always use SAC305 and the higher temperatures belon g t o t his. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 40 o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400 otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use the lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called 'dry-packaging' (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.Philips.com you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine“, chapter “workshop news“. For additional questions please contact your local repair-helpdesk. SERVICE INSTRUCTION 1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.2. Set the AC Power switch to the “on“ position (keep theAC Power cord unplugged!).3. Measure the resistance value between the pins of the AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be larger than 4.5 Mohm (For U.S. it should be between 4.2 Mohm and 12 Mohm).4. Switch “off“ the set, and remove the wire between the two pins of the AC Power plug.Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention tothe following points:· Route the wire trees correctly and fix them with themounted cable clamps.· Check the insulation of the AC Power lead for externaldamage.· Check the strain relief of the AC Power cord for proper function.· Check the electrical DC resistance between the AC PowerPlug and the secondary side (only for sets which have a ACPower isolated power supply): Check the cabinet for defects, to avoid touching of any inner parts by the customer.2 - 1TECHNICAL SPECIFICATIONSGENERALMains voltage -/93-/93:Mains frequency220V-/61 : 220V50 Hz-/61:60 HzBattery remote :3 V (AAA x 2)Power consumption normal 52 WStandby : 33 dBIF Rejection :> 60 dBImage Rejection :> 25dBDistortion : 12 dB:IF rejection :> 24 dBDistortion : 20 dB<DVD / MP3 / CD Laser Type : Semiconductor Disc Diameter : 12cm / 8cm Video Decoding : MPEG-2 / MPEG-1 Signal System : PAL / NTSC Video S/N : 53 dB (min.) Composite Video Output : 1.0 Vp-p, 75 S-Video Output : Y - 1.0 Vp-p, 75 C - 0.286 Vp-p, 75 Audio DAC : 24 Bits / 96 kHz Frequency Response : 20 Hz - 20 kHz Channel Unbalance : < ± 2dB THD Noise : 0.5% No. of programmable tracks : 20 Signal-to-noise ratio : 70 dBA Channel separation : 40 dB (1 kHz) : 35 dB (16 kHz) : 30 dB (20 kHz) Total harmonic distortion : < 0.02% (1 kHz) SERVICE TOOLSAudio signal disc SBC 429.4822 397 30184Playability test disc SBC 444.4822 397 30245Test disc 5 (disc without errors ) +Test disc 5A (disc with dropout errors, black spots and fingerprints)SBC 426/426A.4822 397 30096Burn in test disc (65 min. 1kHz signal at -30 dB level without “pause”).4822 397 30155anti-static table mat large 1200x650x1.25mm 4822 466 10953small 600x650x1.25m 4822 466 10958anti-static wristband 4822 395 10223connection box (3 press stud connections, 1M) 4822 320 11307extendible cable (2m, 2M, to connect wristband to connection box) 4822 320 11305connecting cable (3m, 2M, to connect table mat to connection box) 4822 320 11306earth cable (1M, to connect any product to mat or to connection box) 4822 320 11308KIT ESD3 (combining all 6 prior products - small table mat) 4822 310 10671wristband tester 4822 344 13999AVAILABLE ESD PROTECTION EQUIPMENT2 - 2SERVICE MEASUREMENTBandpass250Hz-15kHze.g. 7122 707 48001LF Voltmetere.g. PM2534DUTRF Generator e.g. PM5326S/N and distortion metere.g. Sound Technology ST1700BTuner SWTo avoid atmospheric interference all AM-measurements have to be carried out in a Faraday«s cage.Use a bandpass filter (or at least a high pass filter with 250Hz) to eliminate hum (50Hz, 100Hz).Ri=50Aerial replacementCapacitorR=50Bandpass250Hz-15kHze.g. 7122 707 48001LF Voltmetere.g. PM2534DUTS/N and distortion metere.g. Sound Technology ST1700BFrame aeriale.g. 7122 707 89001Tuner AM (MW,LW)To avoid atmospheric interference all AM-measurements have to be carried out in a Faraday«s cage.RF Generator e.g. PM5326Ri=50Low pass filter 22kHzLRLEVEL METERe.g. Sennheiser UPM550with FF-filterS/N and distortion metere.g. Sound Technology ST1700BDUTCDUse Audio Signal Disc SBC429 4822 397 30184 (replaces test disc 3)L.P.F. = 13 th order filter 4822 395 302043 - 1CONNECTION AND CONTROLS3 - 2CONNECTION AND CONTROLS3 - 3CONNECTION AND CONTROLS3 - 44CONNECTION AND CONTROLS4 - 14 - 1AB1 B2 C1C2D1D2D3FGHIJA.Remove Bottom Cover A1.remove screws M2.5x4(8pcs)B*.remove screws M3x10(8pcs) and M3x8(3pcs) C*.remove screws M3x8(4pcs) and T3x4(2pcs) E1E2 E2E1*M2.5x5E2*M2.6x8D.Remove Back PanelD*remove screws T3x4(5pcs)and M3x10(5pcs)and T3x8(1pc)E. Remove Top CoverG. Remove DVD Rom and then remove DVD Decoder Card AssyI.Remove VFD board assyH.Remove Slid PlankI.Remove Side metal PlateDISASSEMBLY DIAGRAM - DVD PART