Philips-MX-5100-VR-Service-Manual电路原理图.pdf
CLASS 1LASER PRODUCTService ManualServiceServiceServiceMX5100VR/00/02/05©Copyright 2003 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system ortransmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwisewithout the prior permission of Philips.Published by KC 0339 Service Audio Printed in The Netherlands Subject to modificationGB3139 785 30490DVD-VCR ReceiverVersion 1.0CONTENTSSection 1: Main SectionAdjustment ProcedureSchematic Diagrams and CBAs (PC Boards)Exploded ViewsElectrical when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Caution:1. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damage tothe chip parts may occur. Put masking tape aroundthe flat pack-IC to protect other parts from damage.(Fig. S-1-2)2. The flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC when removingit.Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-1Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-21-3-2 NOTE_1-3With Soldering Iron:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Lift each lead of the flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating the pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)(3) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)With Iron Wire:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Affix the wire to a workbench or solid mountingpoint, as shown in Fig. S-1-5.(3) While heating the pins using a fine tip solderingiron or hot air blower, pull up the wire as the soldermelts so as to lift the IC leads from the CBA contactpads as shown in Fig. S-1-5(4) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(5) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Note:When using a soldering iron, care must be takento ensure that the flat pack-IC is not being held byglue. When the flat pack-IC is removed from theCBA, handle it gently because it may be damagedif force is applied.Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-4To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-61-3-3 NOTE_1-32. Installation(1) Using desoldering braid, remove the solder fromthe foil of each pin of the flat pack-IC on the CBA soyou can install a replacement flat pack-IC moreeasily.(2) The “ I ” mark on the flat pack-IC indicates pin 1.(See Fig. S-1-7.) Be sure this mark matches the 1on the PCB when positioning for installation. Thenpresolder the four corners of the flat pack-IC. (SeeFig. S-1-8.)(3) Solder all pins of the flat pack-IC. Be sure that noneof the pins have solder bridges.Instructions for Handling Semi-conductorsElectrostatic breakdown of the semi-conductors mayoccur due to a potential difference caused by electro-static charge during unpacking or repair work.1. Ground for Human BodyBe sure to wear a grounding band (1M) that is prop-erly grounded to remove any static electricity that maybe charged on the body.2. Ground for WorkbenchBe sure to place a conductive sheet or copper platewith proper grounding (1M) on the workbench orother surface, where the semi-conductors are to beplaced. Because the static electricity charge on cloth-ing will not escape through the body grounding band,be careful to avoid contacting semi-conductors withyour clothing.Example :Pin 1 of the Flat Pack-ICis indicated by a “ “ mark.Fig. S-1-7PresolderCBAFlat Pack-ICFig. S-1-8CBACBAGrounding BandConductive Sheet orCopper Plate1M1M1-4-1 E9015PFSPREPARATION FOR SERVICING How to Enter the Service ModeAbout Optical SensorsCaution:An optical sensor system is used for the Tape Startand End Sensors on this equipment. Carefully readand follow the instructions below. Otherwise the unitmay operate erratically.What to do for preparationInsert a tape into the Deck Mechanism Assembly andpress the PLAY button. The tape will be loaded intothe Deck Mechanism Assembly. Make sure the poweris on, connect TP501 (SENSOR INHIBITION) toGND. This will stop the function of Tape Start Sensor,Tape End Sensor and Reel Sensors. (If these TPs areconnected before plugging in the unit, the function ofthe sensors will stay valid.) See Fig. 1.Note: Because the Tape End Sensors are inactive, donot run a tape all the way to the start or the end of thetape to avoid tape damage.TP501S-INHQ504Q503Fig. 11-5-1 E9015IBOPERATING CONTROLS AND FUNCTIONS MX5100VR/00
