Philips-HTS-3051-BF-7-Service-Manual电路原理图.pdf

SERVICE MANUALBLU-RAY DISC HOME THEATERHTS3251B/F7HTS3051B/F7IMPORTANT SAFETY NOTICEProper service and repair is important to the safe, reliable operation of all P when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-11-4-2 BDN_SN3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.With Soldering Iron:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-2Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-41-4-3 BDN_SNWith Iron Wire:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.2. Installation1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.2. The “ I ” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the pin 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.)3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-6Example :Pin 1 of the Flat Pack-ICis indicated by a “ “ mark.Fig. S-1-7PresolderCBAFlat Pack-ICFig. S-1-8