Philips-HTS-3151-D-Service-Manual电路原理图.pdf
HTS3151D/3771-21-21-31-41-51-61-72345678DVD Home Theatre SystemKC-ET07393139 7853 3080ChapterLOCATION OF PCB BOARDSVERSION VARIATION:1-2TUNER PCBMAIN PCBPOWER PCBPHONE PCBUSB PCBVOL PCBCONTROL PCBSTANDBY PCBType/VersionFeature für Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol !markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con !.GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth groundto assure no shock hazard exist, The leakage current must notexceed 0.5mA.CLASS 1LASER PRODUCT3122 110 03420GB Warning !Invisible laser radiation when open.Avoid direct exposure to beam.S Varning !Osynlig laserstrålning när apparaten är öppnad och spärrenär urkopplad. Betrakta ej strålen.SF Varoitus !Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiinanäkymättömälle laserisäteilylle. Älä katso säteeseen!GB WARNINGAll ICs and many other semi-conductors aresusceptible to electrostatic discharges (ESD).Careless handling during repair can reduce lifedrastically.When repairing, make sure that you areconnected with the same potential as the massof the set via a wrist wrap with resistance.Keep components and tools also at thispotential.FATTENTIONTous les IC et beaucoup dautressemi-conducteurs sont sensibles auxdécharges statiques (ESD).Leur longévité pourrait être considérablementécourtée par le fait quaucune précaution nestprise à leur manipulation.Lors de réparations, sassurer de bien être reliéau même potentiel que la masse de lappareil etenfiler le bracelet serti dune résistance desécurité.Veiller à ce que les composants ainsi que lesoutils que lon utilise soient également à cepotentiel.ESDD WARNUNGAlle ICs und viele andere Halbleiter sindempfindlich gegenüber elektrostatischenEntladungen (ESD).Unsorgfältige Behandlung im Reparaturfall kandie Lebensdauer drastisch reduzieren.Veranlassen Sie, dass Sie im Reparaturfall überein Pulsarmband mit Widerstand verbundensind mit dem gleichen Potential wie die Massedes Gerätes.Bauteile und Hilfsmittel auch auf dieses gleichePotential halten.DK Advarse !Usynlig laserstråling ved åbning når sikkerhedsafbrydere erude af funktion. Undgå udsaettelse for stråling.F“Pour votre sécurité, ces documents doivent être utilisés pardes spécialistes agréés, seuls habilités à réparer votreappareil en panne“.GBESD PROTECTION EQUIPMENTComplete Kit ESD3 (small tablemat, wristband,connection box, estention cable and earth cable . 4822 310 10671Wristband tester . 4822 344 139991-7Pb(Lead) Free SolderWhen soldering , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated)one must treat all sets from 1 Jan 2005 onwards, accordingnext rules:Important note: In fact also products of year 2004 mustbe treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305and the higher temperatures belong to this.Due to lead-free technology some rules have to berespected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 withorder code 0622 149 00106. If lead-free solder-pasteis required, please contact the manufacturer of yoursolder-equipment. In general use of solder-pastewithin workshops should be avoided because paste isnot easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be ableTo reach at least a solder-temperature of 400°C,To stabilize the adjusted temperature at the solder-tipTo exchange solder-tips for different applications. Adjust your solder tool so that a temperature around360°C 380°C is reached and stabilized at the solderjoint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400°C otherwisewear-out of tips will rise drastically and flux-fluid willbe destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solderalloy / parts is possible but PHILIPS recommendsstrongly to avoid mixed solder alloy types (leaded andlead-free).If one cannot avoid or does not know whether productis lead-free, clean carefully the solder-joint from oldsolder alloy and re-solder with new solder alloy(SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities)has to be purchased at external companies. Special information for BGA-ICs: Always use the 12nc-recognizable solderingtemperature profile of the specific BGA (for de-soldering always use the lead-free temperature profile,in case of doubt) Lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) toprotect the IC against moisture. After opening,dependent of MSL-level seen on indicator-label in thebag, the BGA-IC possibly still has to be baked dry.(MSL=Moisture Sensitivity Level). This will becommunicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except productsof 2004), containing leaded solder-alloy andcomponents, all needed spare-parts will be availabletill the end of the service-period. For repair of suchsets nothing changes. On our website www.atyourservice.ce.Philips.comyou find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used inPhilips-setsYou will find this and more technical informationwithin the “magazine”, chapter “workshop news”.For additional questions please contact your localrepair-helpdesk.2 - 12 - 1System , Region Code , etc. Setting Produre1)System Reseta) press “system “ buttom on R/C,TV show “setup“b) select the menu using the and on R/Cc) go preference page to do sysytem reset3)Version Control Changea) In open model, press “1“ “5“ “9“ on R/Cc) TV will show message as below: 2)Region Code Changea) press the “stop” buttom on R/C in open modelc) press”7” “3“ “4“ “4“ “6“ “6“ on R/C,then input desired numberto change region code : 1 USA 2 EU 3 AP 4 Australia ,NZ , Latam5 Russia , INDIA 6 CHINACurrent model HTS3151D/37 Ver 00.00.09-70810-00 region : 1 Servo: OF.60.00.00 8032: 05.00.04.06 RISC:00.00.03.07 IF current model does not match you set use down arrow key on the remote to change4)Password Changea) press “system “ buttom on R/C,TV show “setup“b) select the menu using the and on R/Cc) go preference page select “password“ to change * 000000 is default password supplied.5)Check on the Sofeware Versiona)open the CD Doorb) press “display“ buttom on R/C c) TV will show the version on screen6)Upgrading new sofewarea)open the CD Door,then insert the CD-R program discb)close the DOORc) TV will show: “loading“ pop message“upgrading“ “writhing” about 2 minutes “done “ * the latest upgraded is in version VER 00.00.09-70810-00CAUTION!Thisinformationisconncialandmaynotbedistributed.OnlyaquadservicepersonshouldreprogramtheRegionCode.2 - 22 - 2REPAIR INSTRUSTRATOR3 - 13 - 1DISASSEMBLY INSTRUCTIONSDismantling of the Front Panel Assembly1)Open the DVD Tray by using the Open/Close Button while the Set is ON and disconnect the mains supply after removing the Tray Cover.Note:If this is not possible, the DVD Tray has to be open manually.Take a mini screw driver about 2mm diameter and make a set on its side, insert the mini screw driver till the marking Tray moves out of the Front Panel.2)Return the set to its upright position and remove the Tray Cover as shown in Figure 3 and close the tray manually by pushing it back in.3)Loosen 5 screws and remove the Top Cover by lifting the rear portion upwards before sliding it out towards the rear.- 3 screws on the back- 1 screws each on the left & right side4)Loosen 6 screws & lift up the top edge of Front Panel assembly to free some catches before sliding it out towards the front.- 3 screws on the bottom- 1 screw on the inside - 1 screw each on the left & right sideFigure 3Figure 2Dismantling of the Main PCB1)Loosen 4 screw “ A “ on the top of main board as shown in AFigure 4Figure 5pullFigure 1B
