Philips-HTS-5110-Service-Manual电路原理图.pdf

Published by KC-LQ 1004 AVM Printed in he Netherlands HTS5110/12/51/98Subject to modication EN 3139 785 35230Home Theater SystemContents Page Contents Page©Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.Version 1.02 Importand Safety Precautions . 2-1 to 2-2 3 Safety Check After Servicing . 3-1 4 Safety Information Genard Notes when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)Fig. S-1-13. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.With Soldering Iron:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)With Iron Wire:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMaskingTapeFig. S-1-2Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-3Fine TipSoldering IronSharpPinFig. S-1-4To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-5Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-66-2