Philips-HDD-100-Service-Manual电路原理图.pdf

Technical specification .1-1Accessories .1-1Safety & Warnings.1-2Service hintsRepair positions .2-1Handling chip components.2-2ESD protection equipment .2-2Pin descriptions of IC .3-1 to 3-7Blockdiagram.3-8Circuit diagrams .4-1 to 4-4Layout diagramsCopper side view.4-5Component side view.4-6Exploded view .5-1Mechanical partslist .5-1Electrical partslist .6-1 to 6-3Revision List .7-1© 3140 785 32431Published by YT 0425 Service Audio Printed in The Netherlands Subject to modificationDigital Harddisk PlayerTABLE OF CONTENTS©Copyright 2001 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrievalsystem or transmitted, in any form or by any means, electronic, mechanical, photocopying,or otherwise without the prior permission of Philips.all versionsHDD100, HDD120Version 1.11-1TECHNICAL SPECIFICATIONGeneralDimensions : 106.5 x 64.5 x 20.0mmWeight : 167gOutput power : 2 x 5mWFrequency response : 20-20,000HzHard disk : low profile 1.8”HDD100Capacity : 15GB (HDD100): 20GB (HDD120)Battery life time : >10hrFile transfer rate using USB1.1 : 900kbyte/sFile transfer rate using USB2.0 : 11Mbyte/sBattery charging current : 600-700mAMaximum charging time : 4hrBattery cutoff voltage : 3.0VPower supply Battery level detection Current consumptionHeadphone out (headphone output load: 2x16)Maximum output power :+/-1.0mW (1kHz)Frequency response(16ohm load) :55Hz-15kHzFrequency response(15kohm load) :30Hz-15kHzSNR (A-wght) :>75dB (80dB typ.)THD (1kHz) :50dB (55dB typ.)Left-Right Channel Balance :25dBA (32dBA typ.)THD (1kHz) :70dB (75dB typ.)THD (1kHz) :50dB (55dB typ.)Left-Right Channel Balance :<1.5dBAccessoriesROFSEIROSSECCAHDD10000/ 50/ 71/rotpadACD/CAY3192 ArotpadACD/CAY3192 ArotpadACD/CAY3192 AXXXXHE570/77PHARDDISK PLAYERAY3779 Remote controlAY3911 Cable USB2.0X X XX XX X X3140 118 338013140 118 338113140 118 338219082 100 020013140 118 515413140 110 22411AY3274 PouchX X X3140 113 10661HeadphoneHDD12000/ 50/ 71/XXXXX X XX XX X XX X XCD Rom-IFU HDD100X X X3140 118 72071X X XRegulated Voltage Supply Remarks+3.3V+2.5V+1.8VFor SPDIF Receiver onlyFor CPU and Audio CodecLEVELNOITCETED Typ.4-step to 3-step voltage3-step to 2-step voltage2-step to 1-step voltageForce Power Off voltage3.90V3.75V3.65V3.50V)V0.5(YLPPUSNI-CD )V .83(YLPPUS.TTAB1.5µA typ.775mA typ.File tranfer using USB2.0 Idle with LCD Backlight onIdle with LCD Backlight offPlayback without HDD readingFile tranfer using USB2.055mA typ.85mA typ.980mA typ.100mA typ.70mA typ.650mA typ.Playback without HDD readingBattery Charging CurrentStandbyShutdown2.2mA typ.1 - 2© WARNINGAll ICs and many other semiconductors are susceptible toelectrostatic discharges (ESD). Careless handling duringrepair can reduce life drastically.When repairing, make sure that you are connected with thesame potential as the mass of the set via a wristband withresistance. Keep components and tools at this potential.f ATTENTIONTous les IC et beaucoup d´autres semi-conducteurs sontsensibles aux décharges statiques (ESD). Leur longévitepourrait être considérablement écourtée par le fait qu´aucuneprécaution nést prise à leur manipulation.Lors de réparations, s´assurer de bien être relié au mêmepotentiel que la masse de l´appareil et enfileer le braceletserti d´une résistance de sécurité.Veiller à ce que les composants ainsi que les outils que l´onutilise soient également à ce potentiel.d WARNUNGAlle ICs und viele andere Halbleiter sind empfindlichgegenüber elektrostatischen Entladungen (ESD).Unsorgfältige Behandlung im Reparaturfall kann dieLebensdauer drastisch reduzieren.Sorgen Sie dafür, daß Sie im Reparaturfall über ein Puls-armband mit Widerstand mit dem Massepotential desGerätes verbunden sind.Halten Sie Bauteile und Hilfsmittel ebenfalls auf diesemPotential.ñ WAARSCHUWINGAlle IC´s en vele andere halfgeleiders zijn gevoelig voorelectrostatische ontladingen (ESD).Onzorgvuldig behandelen tijdens reparatie kan de levensduurdrastisch doen vermindern. Zorg ervoor dat u tijdens reparatievia een polsband met weerstand verbonden bent met hetzelfdepotentiaal als de massa van het apparaat.Houd componenten en hulpmiddelen ook op ditzelfde potentiaal.i AVVERTIMENTOTutti IC e parecchi semi-conduttori sono sensibili alle scarichestatiche (ESD).La loro longevità potrebbe essere fortemente ridatta in caso dinon osservazione della più grande cauzione alla loromanipolazione. Durante le riparationi occorre quindi esserecollegato allo stesso potenziale che quello della massadelápparecchio tramite un braccialetto a resistenza.Assicurarsi che i componenti e anche gli utensili con quali silavora siano anche a questo potenziale.©Safety regulations require that the set be restored to itsoriginal condition and that parts which are identical withthose specified be used.Safety components are marked by the symboliLe norme di sicurezza estigono che l´apparecchio vengarimesso nelle condizioni originali e che siano utilizzati ipezzi di ricambiago identici a quelli specificati.Componenty di sicurezza sono marcati conñVeiligheidsbepalingen vereisen, dat het apparaat in zijnoorspronkeliijke toestand wordt teruggebracht en datonderdelen, identiek aan de gespecificeerde, worden toegepast.De Veiligheidsonderdelen zijn aangeduid met het symbools Varning !Osynlig laserstrålning när apparaten är öppnad ochspärren är urkopplad. Betrakta ej strålen. Advarsel !Usynlig laserstråling ved åbning når sikkerhedsafbrydere er ude af funktion. Undgå udsaettelse for stråling.ß Varoitus !Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiinanäkymättömälle laserisäteilylle. Älä katso säteeseen !f“Pour votre sécurite, ces documents doivent être utilisés pardes spécialistes agréés, seuls habilités à réparer votreappareil en panne“.ESDSAFETYdBei jeder Reparatur sind die geltenden Sicherheitsvor-schriften zu beachten. Der Originalzustand des Gerätesdarf nicht verändert werden. Für Reparaturen sind Original-ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol markiert.fLes normes de sécurité exigent que lappareil soit remisà létat dorigine et que soient utilisées les pièces derechange identiques à celles spécifiées.Les composants de sécurité sont marqués© DANGER: Invisible laser radiation when open.©After servicing and before returning the set to customerperform a leakage current measurement test from all exposed metal parts to earth ground, to assure noshock hazard exists.The leakage current must not exceed 0.5mA.AVOID DIRECT EXPOSURE TO BEAM.© AVAILABLE ESD PROTECTION EQUIPMENT :anti-static table mat large 1200x650x1.25mm 4822 466 10953small 600x650x1.25mm 4822 466 10958anti-static wristband 4822 395 10223connection box (3 press stud connections, 1M) 4822 320 11307extendible cable (2m, 2M, to connect wristband to connection box) 4822 320 11305connecting cable (3m, 2M, to connect table mat to connection box) 4822 320 11306earth cable (1M, to connect any product to mat or to connection box) 4822 320 11308KIT ESD3 (combining all 6 prior products - small table mat) 4822 310 10671wristband tester 4822 344 13999SAFETY & WARNINGS2 -1SERVICE HINTSREPAIR POSITION COPPERSIDETo get access to the copperside of the printed board assembly proceed as follows:1.Remove screws 2pcs (1.4X4 on the cap assy)Remove CAP right and left2.Remove screws 5pcs (1.7x5 on the rear cabinet)3.Lift battery and copper foilREPAIR POSITION COMPONENTSIDETo get access to the compomentside of the printed board assembly proceed as follows:1.Remove screws 2pcs (1.4X4 on the cap assy)Remove CAP right and left2.Remove screws 5pcs (1.7x5 on the rear cabinet)3.Lift battery and copper foil4.Remove screws 5pcs(1.4x4 on the PCB assy)2 - 2ESD PROTECTION EQUIPMENT Anti-static table mat large 1200x650x1.25mm 4822 466 10953 small 600x650x1.25mm 4822 466 10958Anti-static wristband 4822 395 10223Connection box (3press stud connections,1M) 4822 320 11307Extendible cable (2m,2M ,to connect wristband to connection box) 4822 320 11305Connecting cable (3m,2M ,to connect table mat to connection box) 4822 320 11306Earth cable (1M , to connect any product to mat or to connection box) 4822 320 11308KIT ESD3(combining all 6 prior products - small table mat) 4822 310 10671Wristband tester 4822 344 12999HANDLING CHIP COMPONENTS3 - 14.1 CY7C68013 Pin Descriptions Table 4-1. FX2 Pin Descriptions5128 TQFP100 TQFP56SSOP56QFN Name Type Default Description10 9 10 3 AVCC Power N/A Analog VCC. This signal provides power to the analog section of the chip. 13 12 13 6 AGND Power N/A Analog Ground. Connect to ground with as short a path as possi-ble.19 18 16 9DMINUS I/O/Z Z USB D Signal. Connect to the USB D signal.18 17 15 8 DPLUS I/O/Z Z USB D+ Signal. Connect to the USB D+ signal. 94 A0 Output L 8051 Address Bus. This bus is driven at all times. When the 8051 is addressing internal RAM it reflects the internal address.95 A1 Output L96 A2 Output L97 A3 Output L117 A 4 Output L118 A 5 Output L119 A 6 Output L120 A 7 Output L126 A 8 Output L127 A 9 Output L128 A 10 Output L21 A11 Output L22 A12 Output L23 A13 Output L24 A14 Output L25 A15 Output L59 D0 I/O/Z Z 8051 Data Bus. This bidirectional bus is high-impedance when inactive, input for bus reads, and output for bus writes. The data bus is used for external 8051 program and data memory. The data bus is active only for external bus accesses, and is driven LOW in suspend. 60 D1 I/O/Z Z61 D2 I/O/Z Z62 D3 I/O/Z Z63 D4 I/O/Z Z86 D5 I/O/Z Z87 D6 I/O/Z Z88 D7 I/O/Z Z39 PSEN# Output H Program Store Enable. This active-LOW signal indicates an 8051 code fetch from external memory. It is active for program memory fetches from 0x20000xFFFF when the EA pin is LOW, or from 0x00000xFFFF when the EA pin is HIGH. 34 28 BKPT Output L Breakpoint. This pin goes active (HIGH) when the 8051 address bus matches the BPADDRH/L registers and breakpoints are en-abled in the BREAKPT register (BPEN = 1). If the BPPULSE bit in the BREAKPT register is HIGH, this signal pulses HIGH for eight 12-/24-/48-MHz clocks. If the BPPULSE bit is LOW, the signal re-mains HIGH until the 8051 clears the BREAK bit (by writing 1 to it) in the BREAKPT register.99 77 49 42 RESET# Input N/A Active LOW Reset. Resets the entire chip. This pin is normally tied to VCCthrough a 100K resistor, and to GND through a 0.1-µF ca-pacitor. Note:5. Unused inputs should not be left floating. Tie either HIGH or LOW as appropriate. Outputs should only be pulled up or down to ensure signals at power-up and in standby.PIN DESCRIPTIONS OF IC CY7C680133 - 235 EA Input N/A External Access. This pin determines where the 8051 fetches code between addresses 0x0000 and 0x1FFF. If EA = 0 the 8051 fetches this code from its internal RAM. IF EA = 1 the 8051 fetches this code from external memory. 12 11 12 5 XTALIN Input N/A Crystal Input. Connect this signal to a 24-MHz parallel-resonant, fundamental mode crystal and 20-pF capacitor to GND. It is also correct to drive XTALIN with an external 24 MHz square wave derived from another clock source.11 10 11 4 XTALOUT Output N/A Crystal Output. Connect this signal to a 24-MHz parallel-resonant, fundamental mode crystal and 20-pF capacitor to GND.If an external clock is used to drive XTALIN, leave this pin open.1100 5 54 CLKOUT O/Z 12 MHz 12-, 24- or 48-MHz clock, phase locked to the 24-MHz input clock. The 8051 defaults to 12-MHz operation. The 8051 may tri-state this output by setting CPUCS.1 = 1. Port A82 67 40 33 PA0 orINT0# I/O/Z I(PA0)Multiplexed pin whose function is selected by: PORTACFG.0 PA0 is a bidirectional IO port pin.INT0# is the active-LOW 8051 INT0 interrupt input signal, which is either edge triggered (IT0 = 1) or level triggered (IT0 = 0).83 68 41 34 PA1 orINT1# I/O/Z I(PA1)Multiplexed pin whose function is selected by: PORTACFG.1PA1 is a bidirectional IO port pin.INT1# is the active-LOW 8051 INT1 interrupt input signal, which is either edge triggered (IT1 = 1) or level triggered (IT1 = 0).84 69 42 35 PA2 orSLOEI/O/Z I(PA2)Multiplexed pin whose function is selected by two bits: IFCONFIG1:0.PA2 is a bidirectional IO port pin.SLOE is an input-only output enable with programmable polarity (FIFOPOLAR.4) for the slave FIFOs connected to FD7.0 or FD15.0.85 70 43 36 PA3 or WU2I/O/Z I(PA3)Multiplexed pin whose function is selected by:WAKEUP.7 and OEA.3PA3 is a bidirectional I/O port pin.WU2 is an alternate source for USB Wakeup, enabled by WU2EN bit (WAKEUP.1) and polarity set by WU2POL (WAKEUP.4). If the 8051 is in suspend and WU2EN = 1, a transition on this pin starts up the oscillator and interrupts the 8051 to allow it to exit the sus-pend mode. Asserting this pin inhibits the chip from suspending, if WU2EN=1. 89 71 44 37 PA4 orFIFOADR0I/O/Z I(PA4)Multiplexed pin whose function is selected by: IFCONFIG1.0.PA4 is a bidirectional I/O port pin.FIFOADR0 is an input-only address select for the slave FIFOs con-nected to FD7.0 or FD15.0.90 72 45 38 PA5 orFIFOADR1I/O/Z I(PA5)Multiplexed pin whose function is selected by: IFCONFIG1.0.PA5 is a bidirectional I/O port pin.FIFOADR1 is an input-only address select for the slave FIFOs con-nected to FD7.0 or FD15.0.91 73 46 39 PA6 or PKTENDI/O/Z I(PA6)Multiplexed pin whose function is selected by the IFCONFIG1:0 bits.PA6 is a bidirectional I/O port pin.PKTEND is an input-only packet end with programmable polarity (FIFOPOLAR.5) for the slave FIFOs connected to F