Philips-DVP-620-VR-Service-Manual电路原理图.pdf
ContentsChapterTechnical SpecificationsSchematic Diagrams and CBA'sExploded ViewsMechanical and Electrical Parts ListsSec. 1: Sec. 2: Standard MaintenanceMechanism Alignment ProceduresDisassembly / Assembly of MechanismDeck Exploded ViewsSurvey of versions:Published by FU 0436 Service AVS Printed in The Netherlands Subject to modificationVersion 1.0/04 PALDVD + VCR Combi DVP620VR/04cCopyright 2004 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.CLASS 1 LASER PRODUCTKLASSE 1 LASER PRODUKTKLASS 1 LASER APPARATCLASSE 1 PRODUIT LASERGB 3139 785 30810Service ManualServiceServiceServiceMAIN SECTIONDIGITAL VIDEO DISC PLAYER when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Caution:1. The Flat Pack-IC shape may differ by models. Usean appropriate hot-air flat pack-IC desolderingmachine, whose shape matches that of the FlatPack-IC.2. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damage tothe chip parts may occur. Put masking tape aroundthe flat pack-IC to protect other parts from damage.(Fig. S-1-2)Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-11-3-2 NOTE_13. The flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC when removingit.With Soldering Iron:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Lift each lead of the flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating the pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)(3) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)With Iron Wire:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Affix the wire to a workbench or solid mountingpoint, as shown in Fig. S-1-5.(3) While heating the pins using a fine tip solderingiron or hot air blower, pull up the wire as the soldermelts so as to lift the IC leads from the CBA contactpads as shown in Fig. S-1-5Fig. S-1-2Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-3Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-4Fine TipSoldering IronSharpPin1-3-3 NOTE_1(4) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(5) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Note:When using a soldering iron, care must be takento ensure that the flat pack-IC is not being held byglue. When the flat pack-IC is removed from theCBA, handle it gently because it may be damagedif force is applied.2. Installation(1) Using desoldering braid, remove the solder fromthe foil of each pin of the flat pack-IC on the CBA soyou can install a replacement flat pack-IC moreeasily.(2) The “ I ” mark on the flat pack-IC indicates pin 1.(See Fig. S-1-7.) Be sure this mark matches the 1on the PCB when positioning for installation. Thenpresolder the four corners of the flat pack-IC. (SeeFig. S-1-8.)(3) Solder all pins of the flat pack-IC. Be sure that noneof the pins have solder bridges.Fig. S-1-5To Solid Mounting PointSoldering IronIron WireorHot Air BlowerFig. S-1-6Fine TipSoldering IronCBAFlat Pack-ICTweezersFig. S-1-7Example :Pin 1 of the Flat Pack-ICis indicated by a “ “ mark.Fig. S-1-8PresolderCBAFlat Pack-IC1-3-4 NOTE_1Instructions for Handling Semi-conductorsElectrostatic breakdown of the semi-conductors mayoccur due to a potential difference caused by electro-static charge during unpacking or repair work.1. Ground for Human BodyBe sure to wear a grounding band (1M) that is prop-erly grounded to remove any static electricity that maybe charged on the body.2. Ground for WorkbenchBe sure to place a conductive sheet or copper platewith proper grounding (1M) on the workbench orother surface, where the semi-conductors are to beplaced. Because the static electricity charge on cloth-ing will not escape through the body grounding band,be careful to avoid contacting semi-conductors withyour clothing.CBAGrounding BandConductive Sheet orCopper Plate1M1MCBA1-4-1 H9720FISFUNCTION INDICATOR SYMBOLSNote:If a mechanical malfunction occurs, the power is turned off. When the power comes on again after that bypressing STANDBY-ON button, an error message is displayed on the TV screen for 5 seconds.TV screenWhen reel or capstan mechanism is not functioningcorrectlyWhen tape loading mechanism is not functioning cor-rectlyWhen cassette loading mechanism is not functioningcorrectlyWhen the drum is not working properlyP-ON Power safety detectionMODE INDICATOR ACTIVEWhen reel or capstan mechanism is not functioning correctly“EJECT R” is displayed on a TV screen. (Refer to Fig. 1.)When tape loading mechanism is not func-tioning correctly“EJECT T” is displayed on a TV screen. (Refer to Fig. 2.)When cassette loading mechanism is not functioning correctly“EJECT C” is displayed on a TV screen. (Refer to Fig. 3.)When the drum is not working properly“EJECT D” is displayed on a TV screen. (Refer to Fig. 4.)P-ON Power safety detection“EJECT P” is displayed on a TV screen. (Refer to Fig. 5.)EJECT RFig. 1EJECT TFig. 2EJECT CFig. 3Fig. 4EJECT DEJECT PFig. 5
