Sony-SCDXA9000ES-sacd-sm 维修电路原理图.pdf

SERVICE MANUALWhen a super audio CD is playedPlaying frequency range2 Hz to 100 kHzFrequency response2 Hz to 50 kHz (3 dB)Dynamic range108 dB or moreTotal harmonic distortion rate0.0012 % or lessWow and flutterValue of measurable limit ( 0.001 %W. PEAK) or lessWhen a CD is playedFrequency response2 Hz to 20 kHzDynamic range100 dB or moreTotal harmonic distortion rate0.0017 % or lessWow and flutterValue of measurable limit ( 0.001 %W. PEAK) or lessOutput connector*Output only the audio signals of the CDi.LINK sectionPin4 pinsTransmission speedS200(Maximum data transmission speed200 Mbps)Transmission protocolA/M transmission protocolFormat (output)Super Audio CD* (DSD PLAIN)2 channel linear PCM (IEC 60958-3)Sampling frequency: 44.1 kHz* Conforms to the copy protection technology of DTLA (Revision1.2).ANALOG OUTDIGITAL (CD)OUTOPTICAL*DIGITAL (CD)OUTCOAXIAL*PHONESJack typePhonojacksSquareopticaloutputconnectorCoaxialoutputconnectorStereophone jackOutput level2 Vrms(at 50 kilohms)18 dBm0.5 Vp-p10 mWLoad impedanceOver 10 kilohmsLight emittingwave length:660 nm75 ohms32 ohms( )GeneralLaserSemiconductor laser(SA-CD: = 650 nm)(CD: = 780 nm)Emission duration: continuousLaser radiant power:5.47 uW at 650 nm*These output is the value measured at a distance of about 200mm from the objective lens surface on the optical pick-up.Power requirementsUS, Canadian models:120 V AC, 60 HzTaiwan model:110 V AC, 60 HzAEP model:230 V AC, 50/60 HzPower consumption32 WDimensions (w/h/d)430 127 387 mm(17 5 15 1/4 in.)incl. projecting partsMass (approx.)16.2 kg (35 lbs 12 oz.)Supplied accessoriesDesign and specifications are subject to change without notice.Audio connecting cordphono jack 2 (Red and White) y phono jack 2 (Redand White) (3)phono jack 1 (Black) y phono jack 1 (Black) (2)i.LINK connecting cord (1)Remote commander RM-SX700 (1)Size AA (R6) batteries (2) AC power cord (1)Plug adapter (1) (US, Canadian models only)Model Name Using Similar MechanismNEWCD Mechanism TypeCDM19JB-DVBU4C (Except AEP: Silver type)CDM19JB-DVBU4D (AEP: Silver type)Base Unit NameDVBU4C (Except AEP: Silver type)DVBU4D (AEP: Silver type)Optical Pick-up NameKHM-230AAASUPER AUDIO CD PLAYERUS ModelCanadian ModelAEP ModelE ModelSPECIFICATIONSSCD-XA9000ESVer. 1.4 2005.119-961-151-05Sony Corporation2005K05-1Home Audio DivisionC 2005.11Published by Sony Engineering CorporationRadioFans.CN 收音机爱 好者资料库2SCD-XA9000ESCAUTIONThe use of optical instruments with thisproduct will increase eye hazard.For the customers in CanadaThis Class B digital apparatus complieswith Canadian ICES-003.ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT!LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTEDES PICES SONT CRITIQUES POUR LA SCURITDE FONCTIONNEMENT. NE REMPLACER CES COM-POSANTS QUE PAR DES PICES SONY DONT LESNUMROS SONT DONNS DANS CE MANUEL OUDANS LES SUPPLMENTS PUBLIS PAR SONY.SAFETY-RELATED COMPONENT WARNING!COMPONENTS IDENTIFIED BY MARK 0 OR DOTTEDLINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMSAND IN THE PARTS LIST ARE CRITICAL TO SAFEOPERATION. REPLACE THESE COMPONENTS WITHSONY PARTS WHOSE PART NUMBERS APPEAR ASSHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-LISHED BY SONY.Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam-aged by heat.Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C dur-ing repairing. Do not touch the soldering iron on the same conductor of thecircuit board (within 3 times). Be careful not to apply force on the conductor when solderingor unsoldering.CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous ra-diation exposure.This appliance is classified as a CLASS 1LASER product.The CLASS 1 LASER PRODUCTMARKING is located on the rear exterior.SAFETY CHECK-OUTAfter correcting the original service problem, perform the follow-ing safety check before releasing the set to the customer:Check the antenna terminals, metal trim, “metallized” knobs,screws, and all other exposed metal parts for AC leakage.Check leakage as described below.LEAKAGE TESTThe AC leakage from any exposed metal part to earth ground andfrom all exposed metal parts to any exposed metal part having areturn to chassis, must not exceed 0.5 mA (500 microamperes.).Leakage current can be measured by any one of three methods.1.A commercial leakage tester, such as the Simpson 229 or RCAWT-540A. Follow the manufacturers instructions to use theseinstruments.2.A battery-operated AC milliammeter. The Data Precision 245digital multimeter is suitable for this job.3.Measuring the voltage drop across a resistor by means of a VOMor battery-operated AC voltmeter. The “limit” indication is 0.75V, so analog meters must have an accurate low-voltage scale.The Simpson 250 and Sanwa SH-63Trd are examples of a pas-sive VOM that is suitable. Nearly all battery operated digitalmultimeters that have a 2 V AC range are suitable. (See Fig. A)Fig. A.Using an AC voltmeter to check AC leakage.1.5 k0.15 FACvoltmeter(0.75 V)To Exposed MetalParts on SetEarth GroundAEP modelUNLEADED SOLDERBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size): LEAD FREE MARKUnleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40 C higherthan ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350 C.Caution: The printed pattern (copper foil) may peel away ifthe heated tip is applied for too long, so be careful! Strong viscosityUnleaded solder is more viscou-s (sticky, less prone to flow)than ordinary solder so use caution not to let solder bridgesoccur such as on IC pins, etc. Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.RadioFans.CN 收音机爱 好者资料库3SCD-XA9000ESTABLE OF CONTENTS1.SERVICING NOTES.42.GENERAL. 103.DISASSEMBLY3-1.Disassembly Flow . 133-2.Case (Top), Side Plate. 143-3.Loading Panel Assy. 143-4.Front Panel Section . 153-5.MAIN Board, Bracket (MAIN) . 153-6.RF Board, Mechanism Deck(CDM19JB-DVBU4C or CDM19JB-DVBU4D) . 163-7.Disc Table, Belt, Loading Motor (M1). 163-8.Optical Pick-up (KHM-230AAA) . 173-9.Base Unit (DVBU4C or DVBU4D). 184.TEST MODE. 195.DIAGRAMS5-1.Block Diagram RF/SERVO Section . 265-2.Block Diagram MAIN Section (1/2) . 275-3.Block Diagram MAIN Section (2/2) . 285-4.Block Diagram AUDIO Section (1/2) . 295-5.Block Diagram AUDIO Section (2/2) . 305-6.Block Diagram LINK Section . 315-7.Block Diagram PANEL/POWER SUPPLY Section . 325-8.Note for Printed Wiring Boards andSchematic Diagrams . 335-9.Printed Wiring Boards SERVO Section . 345-10. Schematic Diagram SERVO Section . 355-11. Printed Wiring Board MAIN Board (Component Side) . 365-12. Printed Wiring Board MAIN Board (Conductor Side) . 375-13. Schematic Diagram MAIN Board (1/7) . 385-14. Schematic Diagram MAIN Board (2/7) . 395-15. Schematic Diagram MAIN Board (3/7) . 405-16. Schematic Diagram MAIN Board (4/7) . 415-17. Schematic Diagram MAIN Board (5/7) . 425-18. Schematic Diagram MAIN Board (6/7) . 435-19. Schematic Diagram MAIN Board (7/7) . 445-20. Printed Wiring Board D-OUT Board . 455-21. Schematic Diagram D-OUT Board . 455-22. Printed Wiring Board MOTHER Board (Component Side) . 465-23. Printed Wiring Board MOTHER Board (Conductor Side) . 475-24. Schematic Diagram MOTHER Board (1/2) . 485-25. Schematic Diagram MOTHER Board (2/2) . 495-26. Printed Wiring Board AUDIO FRONT Board . 505-27. Schematic Diagram AUDIO FRONT Board . 515-28. Printed Wiring Board AUDIO SURR Board . 525-29. Schematic Diagram AUDIO SURR Board . 535-30. Printed Wiring Board AUDIO C/SW Board . 545-31. Schematic Diagram AUDIO C/SW Board . 555-32. Schematic Diagram LINK Board (1/2) . 565-33. Schematic Diagram LINK Board (2/2) . 575-34. Printed Wiring Board LINK Board . 585-35. Printed Wiring Boards PANEL Section . 595-36. Schematic Diagram PANEL Section (1/2) . 605-37. Schematic Diagram PANEL Section (2/2) . 615-38. Printed Wiring Board A-POWER Board (Component Side) . 625-39. Printed Wiring Boards A-POWER (Conductor Side)/IC Boards . 635-40. Schematic Diagram A-POWER/IC Boards . 645-41. Printed Wiring Board D-POWER Board . 665-42. Schematic Diagram D-POWER Board . 675-43. Printed Wiring Boards AC/AC SW Boards . 685-44. Schematic Diagram AC/AC SW Boards . 695-45. IC Pin Function Description . 746.EXPLODED VIEWS6-1.Case Section . 946-2.Front Panel Section-1. 956-3.Front Panel Section-2. 966-4.Bottom Section. 976-5.Board Section-1. 986-6.Board Section-2. 996-7.Chassis Section .1006-8.Mechanism Deck Section .1016-9.Base Unit Section.1027.ELECTRICAL PARTS LIST.103Ver. 1.34SCD-XA9000ESSECTION 1SERVICING NOTESThe laser diode in the optical pick-up block may suffer electro-static break-down because of the potential difference generatedby the charged electrostatic load, etc. on clothing and the humanbody.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The flexible board is easily damaged and should be handled withcare.NOTES ON LASER DIODE EMISSION CHECKThe laser beam on this model is concentrated so as to be focusedon the disc reflective surface by the objective lens in the opticalpick-up block. Therefore, when checking the laser diode emis-sion, observe from more than 30 cm away from the objective lens.CLEANING OF OPTICAL PICK-UP LENSIn cleaning the lens of optical pick-up, use the air blower.Never use a cotton swab for cleaning the lens of optical pick-up,which otherwise causes a trouble.RESETTING OPERATION AT POWER ONIf the power is turned on with a disc loaded in the set, a sequenceof operation as shown below will be performed.(The operation varies depending on the type of disc)Condition: continue mode(1) CD 1.Sled reverse move (sled in) 2.Disc detect 3.IC setting for CD 4.Servo error signal offset auto adjustment 5.Spindle kick for LD on 6.LD on 7.Focus search 8.Focus servo on 9.Spindle kick 10. Spindle servo on 11. E-F balance auto adjustment 12. Tracking & sled servo on 13. Focus bias auto adjustment 14. Focus servo gain auto adjustment 15. Tracking servo gain auto adjustment 16. Jump to lead-in area 17. Read TOC 18. StopNOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNIT(2) SACD (single layer) 1.Sled reverse move (sled in) 2.Disc detect 3.IC setting for SACD 4.Servo error signal offset auto adjustment 5.Spindle kick for LD on 6.LD on 7.Focus search 8.Focus servo on 9.Spindle kick 10. Spindle servo on 11. E-F balance auto adjustment 12. Tracking & sled servo on 13. Focus bias auto adjustment 14. Focus servo gain auto adjustment 15. Tracking servo gain auto adjustment 16. Jump to lead-in area 17. Read TOC 18. Stop(3) SACD (dual layer) 1.Sled reverse move (sled in) 2.Disc detect 3.IC setting for SACD 4.Servo error signal offset auto adjustment 5.Spindle kick for LD on 6.LD on 7.Focus search 8.Focus servo on (layer 0) 9.Spindle kick 10. Spindle servo on 11. E-F balance auto adjustment (layer 0) 12. Tracking & sled servo on (layer 0) 13. Focus bias auto adjustment (layer 0) 14. Focus servo gain auto adjustment (layer 0) 15. Tracking servo gain auto adjustment (layer 0) 16. Jump to lead-in area 17. Read TOC 18. Focus jump (layer 0tlayer 1) 19. E-F balance auto adjustment (layer 1) 20. Tracking & sled servo on (layer 1) 21. Focus bias auto adjustment (layer 1) 22. Focus servo gain auto adjustment (layer 1) 23. Tracking servo gain auto adjustment (layer 1) 24. Focus Jump (layer 1tlayer 0) 25. StopPart No.MODEL IDENTIFICATION Back Panel ModelPart No.AEP model4-247-231-0US and Canadian models4-247-231-2Taiwan model4-247-231-3Ver. 1.45SCD-XA9000ESHOW TO OPEN THE DISC TABLE WHEN POWER SWITCH TURNS OFFOPTICAL PICK-UP SERVICE POSITIONPlace the insulator on the MAIN board, then install the base unit (DVBU4C or DVBU4D) on it as shown in the figure.DVBU4C: Except AEP (Silver type)DVBU4D: AEP (Silver type)tapering drivercover (CAM)2Draw out the loading panel assyin the direction of arrow B.1Insert a tapering driver in the holeat the bottom of the unit,turn the cover (CAM) fully in thedirection of arrow A.BAloading panel assybase unit(DVBU4C or DVBU4D)MAIN boardinsulatorVer. 1.36SCD-XA9000ESNote: Follow the disassembly procedure in the numerical order given.D-POWER/POWER BOARDS AND RF BOARD SERVICE POSITION2Turn over the set.4two bottom plates3four screws (3 8)3eight screws (3 8)D-power boardpower boardINSTALLATION TWO WIRES (FLAT TYPE) (25/35 CORE)Note: When the wire (flat type) (35 core) is disconnected from the RF board, then it is again connected, disconnect the wire (flat type) (25 core) once, and reconnect the wire (flat type) (35 core) first.wire (flat type) (35 core)wire (flat type) (25 core)RF board BOTTOM VIEW 7SCD-XA9000ESMAIN BOARD SERVICE POSITIONIn checking the MAIN board, prepare jig (extension cable J-2501-205-A: 1.50 mm Pitch, 7 cores, Length 300 mm/J-2501-086-A: 1.00 mm Pitch, 19 cores, Length 300 mm).Note: Be sure to ground the MAIN board with a lead wire when checking it.lead wiremain boardMOTHER boardconnect jig (extension cable J-2501-086-A) to the main board (CN701) and mother board (CN301),main board (CN702) and mother board (CN302).connect jig (extension cable J-2501-205-A) to the main board (CN706) and display board (CN801).FRONT PANEL SECTION SERVICE POSITIONfront panel section8SCD-XA9000ESNOTE FOR INSTALLATION (AUDIO MODULE BLOCK)Note: When installing the audio module block, insert the audio module block as shown below.audio module blockAUDIO MODULE BLOCK SERVICE POSITIONaudio module block9SCD-XA9000ESNOTE ON POSITION OF WIRE (FLAT TYPE)MAIN boardwire (flat type)heatsinkA-POWER boardHeatsink gets heated up to a high temperature.Be careful to keep the position of wire (flat type).B FRONT10SCD-XA9000ESSECTION 2GENERALThis section is extracted frominstruction manual.6 A OPEN/CLOSE buttonPress to open or close the disc tray.7 N buttonPress to start play.N indicatorLights up during playback.8 X buttonPress to pause play.X indicatorLights up during pause.9 x buttonPress to stop play.0 PHONESConnect the headphones.During playback of a Multi-channel Super Audio CD,the same signal that is output from the ANALOG5.1CH FRONT L/R jacks is output from the PHONESjack.qa PHONE LEVELAdjust the headphones volume.qs MENUPress to enter the menu.Press to exit from the menu and return to the normaldisplay.qd MULTI/2CH buttonPress to select the playback area when the 2 channel +Multi-channel Super Audio CD is loaded.qf Remote sensorqg Display windowShows various information.qh . AMS dial (AMS: Automatic Music Sensor)When you turn the . AMS dialcounterclockwise by one click, you