Technics-SLC700E-cd-sm 维修电路原理图.pdf

Panasonic Corporation 2015. All rights reserved.Unauthorized copying and distribution is a violation of law.ORDER NO.PSG1502003CECompact Disc PlayerModel No.SL-C700EProduct Colour:(S) . Silver TypeRadioFans.CN 收音机爱 好者资料库2TABLE OF CONTENTSPAGEPAGE1 Safety Precautions -31.1. General guidelines-32 Warning -42.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices-42.2. Service caution based on legal restrictions-52.3. Precaution of Laser Diode -62.4. Handling Precaution for CD DRIVE UINT(Optical Pickup)-73 Specifications-84 Location of Controls and Components-95 Troubleshooting Guide- 115.1. Check the problem is reproduced- 115.2. No power-125.3. LED does not illuminate -175.4. No buzzer -175.5. Remote control does not operate -175.6. No Display -185.7. No CD operation-195.8. Connector pin configuration -205.9. Blocks related to each function-216 Disassembly and Assembly Instructions-226.1. PCB layout drawing-236.2. Removing the disc when the disc cannot be removed using the opening-closing button -256.3. Disassembly flow chart -266.4. SET LEG UNIT -276.5. TOP AL PANEL-276.6. TOP CABINET BLOCK-276.7. SIDE PANEL (R), SIDE PANEL (L), TOP PANEL -276.8. FRONT PANEL UNIT -286.9. TOUCH SENSOR PCB, PICT LIGHTING WINDOW-286.10. DISPLAY PCB, OLED ASSY-286.11. IR PCB, MAIN SWITCH PCB-296.12. FRONT PANEL ASSY -296.13. BELT LOADING -296.14. CD MECHA BLOCK, DOOR -296.15. SPRING, CD LOADING UNIT -306.16. INSULATOR, CD DRIVE UNIT-306.17. REAR PANEL-306.18. MAIN PCB -316.19. SOFTWARE IN 1 PCB, SOFTWARE IN 2 PCB-316.20. CD MECHA DRIVE PCB-316.21. PS PCB-326.22. AC INLET PCB -327 Dimensions -338 Block Diagram -349 Wiring Connection Diagram-35RadioFans.CN 收音机爱 好者资料库31Safety Precautions1.1.General guidelines1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.1.1.1.Leakage current cold check1. Unplug the AC cord and connect a jumper between the two prongs on the plug.2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M.When the exposed metal does not have a return path to the chassis, the reading must be .1.1.2.Leakage current hot check (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.4. Check each exposed metallic part, and measure the voltage at each point.5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliampere. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.Figure 142Warning2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) DevicesSome semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient to damage ES devices.5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.CautionBe sure no power is applied to the chassis or circuit, and observe all other safety precautions.8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device).52.2.Service caution based on legal restrictions2.2.1.General description about Lead Free Solder (PbF)The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder.Definition of PCB Lead Free Solder being usedService caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used.(Definition: The letter of PbF is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the lead free solder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 35030 degrees C (66286F).Recommended Lead Free Solder (Service Parts Route.) The following 3 types of lead free solder are available through the service parts route.SVKZ000001-(0.3mm 100g Reel)SVKZ000002-(0.6mm 100g Reel)SVKZ000003-(1.0mm 100g Reel)Note:* Ingredient: Tin (Sn) 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%. (Flex cored)The letter of PbF is printed either foil side or components side on the PCB using the lead free solder.(See right figure)62.3.Precaution of Laser DiodeCaution:This product utilizes a laser diode with the unit turned on, invisible laser radiation is emitted from the pickup lens.Wavelength: 790 nm (CD)Maximum output radiation power from pickup: 100 W/VDELaser radiation from the pickup unit is safety level, but be sure the followings:1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.3. Do not look at the focus lens using optical instruments.4. Recommend not to look at pickup lens for a long time.ACHTUNG:Dieses Produkt enthlt eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheitadgestrahit.Wellenlnge : 790nm (CD)Maximale Strahlungsleistung der Lasereinheit :100 W/VDEDie Strahlung an der Lasereinheit ist ungefhrlich, wenn folgende Punkte beachtet werden:1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefhrlich ist.2. Den werkseitig justierten Einstellregler der Lasereinhit nicht verstellen.3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken.4. Nicht ber lngere Zeit in die Fokussierlinse blicken.CAUTION!THIS PRODUCT UTILIZES A LASER.USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.72.4.Handling Precaution for CD DRIVE UINT(Optical Pickup)The laser diode in the CD DRIVE UINT(Optical Pickup) may break down due to static electricity of clothes or human body. Special care must be taken avoid caution to electrostatic breakdown when servicing and handling the laser diode in the Traverse Unit.2.4.1.Cautions to Be Taken in Handling the CD DRIVE UINT(Optical Pickup)The laser diode in the CD DRIVE UINT(Optical Pickup) may be damaged due to electrostatic discharge generating from clothes or human body.Special care must be taken avoid caution to electrostatic discharge damage when servicing the laser diode.1. Do not give a considerable shock to the CD DRIVE UINT(Optical Pickup) as it has an extremely high-precise structure.2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the CD DRIVE UINT(Optical Pickup) removed should be short-circuited with a short pin or a clip.3. The flexible cable may be cut off if an excessive force is applied to it. Use caution when handling the flexible cable.4. The antistatic FFC is connected to the new CD DRIVE UINT(Optical Pickup). After replacing the CD DRIVE UINT(Optical Pickup) and connecting the flexible cable, cut off the antistatic FFC.2.4.2.Grounding for electrostatic breakdown preventionSome devices such as the CD player use the optical pickup (laser diode) and the optical pickup will be damaged by static electricity in the working environment. Proceed servicing works under the working environment where grounding works is completed.2.4.2.1.Worktable grounding1. Put a conductive material (sheet) or iron sheet on the area where the CD DRIVE UINT(Optical Pickup) is placed, and ground the sheet.2.4.2.2.Human body grounding1. Use the anti-static wrist strap to discharge the static electricity form your body.83Specifications94Location of Controls and Components10115Troubleshooting Guide5.1.Check the problem is reproduced5.2 No power1213141516175.3.LED does not illuminate5.4.No buzzer5.5.Remote control does not operate185.6.No Display195.7.No CD operation205.8.Connector pin configuration215.9.Blocks related to each function226Disassembly and Assembly Instructions236.1.PCB layout drawing6.1.1.Inside the main unit246.1.2.Front part256.2.Removing the disc when the disc cannot be removed using the opening-closing button1. Turn OFF the main unit, and remove the AC cord.2. Place the main unit in the way that its bottom can be seen.3. Using a flathead screwdriver (small), slide the cam slide seen from the slit at the bottom of the deck in the arrow direction, then slightly eject the tray.4. The tray appears in front by approx. 1 cm. Holding the front part of the drive, pull it in the arrow direction lightly, and move the tray.266.3.Disassembly flow chartThe following flow chart shows the procedure to disassemble exterior and interior parts for internal inspection.Assembly is done in reverse order of the flow chart.276.4.SET LEG UNIT1. Remove the screws for removal. Screw: 46.5.TOP AL PANEL1. Remove the screws for removal. Screw: 46.6.TOP CABINET BLOCK1. Remove the TOP AL PANEL.(See 6.5. TOP AL PANEL, step 1.)2. Remove the screws for removal. Screw: 96.7.SIDE PANEL (R), SIDE PANEL (L), TOP PANEL1. Remove the TOP AL PANEL.(See 6.5. TOP AL PANEL, step 1.)2. Remove the TOP CABINET BLOCK.(See 6.6. TOP CABINET BLOCK, step 2.)3. Turn it over, and remove the screws for removal. Screw: 4286.8.FRONT PANEL UNIT1. Remove the couplers. Coupler: P805A, P806A, P813A2. Remove the screws for removal. Screw: 86.9.TOUCH SENSOR PCB, PICT LIGHTING WINDOW1. Remove the FRONT PANEL UNIT.(See 6.8. FRONT PANEL UNIT, step 1 and 2.)2. Remove the coupler, screws and F brackets for removal. Coupler: P805B Screw: 23. Remove.6.10.DISPLAY PCB, OLED ASSY1. Remove the FRONT PANEL UNIT.(See 6.8. FRONT PANEL UNIT, step 1 and 2.)2. Remove the couplers and screws for removal.*Remove binding wires as necessary. Coupler: P813B, P8881B Screw: 43. Remove.296.11.IR PCB, MAIN SWITCH PCB1. Remove the FRONT PANEL UNIT.(See 6.8. FRONT PANEL UNIT, steps 1 and 2.)2. Remove the coupler and screws for removal.*Remove binding wires as necessary. Coupler: P831B Screw: 73. Remove the solders (P951A and P951B). Note when replacing the IR PCB and MAIN SWITCH PCB When replacing the IR PCB and MAIN SWITCH PCB, remove the solder on the PCB to be replaced, and then reconnect it again.6.12.FRONT PANEL ASSY1. Remove the FRONT PANEL UNIT.(See 6.8. FRONT PANEL UNIT, steps 1 and 2.)2. Remove the TOUCH SENSOR PCB and PICT LIGHTING WINDOW.(See 6.9. TOUCH SENSOR PCB, PICT LIGHTING WINDOW, steps 2 and 3.)3. Remove the DISPLAY PCB and OLED ASSY.(See 6.10. DISPLAY PCB, OLED ASSY, steps 2 and 3.)4. Remove the IR PCB and MAIN SWITCH PCB.(See 6.11. IR PCB, MAIN SWITCH PCB, steps 2 and 3.)6.13.BELT LOADING1. Stand the main unit carefully. Using a flathead screwdriver, slide the lever of the cam slide in the arrow direction. (The tray comes out approx. 1 cm as shown.)2. Remove. Note when attaching the BELT LOADING When attaching the BELT LOADING, make sure there is no twist or deflection.6.14.CD MECHA BLOCK, DOOR1. Remove the couplers. Coupler: P0102, P0103, P01042. Remove the screws for removal. Screw: 430 Note when attaching the CD MECHA BLOCK When attaching the CD MECHA BLOCK, pass the FFC into the gap between CD MECHA DRIVE PCB and MAIN PCB, and then connect it to the Coupler: P0102.6.15.SPRING, CD LOADING UNIT1. Remove the CD MECHA BLOCK.(See 6. 14. CD MECHA BLOCK, DOOR, steps 1 and 2.)2. Remove the coupler. Coupler: P1053. Remove the screws for removal. Screw: 4 Note when attaching the SPRINGs (SILVER) and (GOLD) When attaching the SPRINGs (SILVER) and (GOLD), make sure each position is correct.6.16.INSULATOR, CD DRIVE UNIT1. Remove the CD MECHA BLOCK.(See 6. 14. CD MECHA BLOCK, DOOR, steps 1 and 2.)2. Re move the SPRINGs and CD LOADING UNIT.(See 6. 15. SPRING, CD LOADING UNIT,