Yamaha-HS80M-spk-sm 维修电路原理图.pdf

HAMAMATSU, JAPANCopyright (c) Yamaha Corporation. All rights reserved. PDF Printed in Japan 05.12POWERED MONITOR SPEAKERHS80M SPECIFICATIONS （総合仕様） . 3HS50M SPECIFICATIONS （総合仕様） . 4DIMENSIONS （寸法図）. 5PANEL LAYOUT （） . 6CIRCUIT BOARD LAYOUT （） . 7HS80M DISASSEMBLY PROCEDURE （分解手順）. 8HS50M DISASSEMBLY PROCEDURE （分解手順）. 11CIRCUIT BOARDS （基板図） . 14HS80M INSPECTIONS （検査） . 15HS50M INSPECTIONS （検査） . 16BLOCK DIAGRAM （）OVERALL CIRCUIT DIAGRAM （総回路図）PARTS LISTI CONTENTS （目次）HS80M: 200510-47250HS50M: 200510-26250HS80M/HS50M011806PASERVICE MANUAL（ECF：無塩素系漂白）使用。RadioFans.CN 收音机爱 好者资料库HS80M/HS50M2IMPORTANT NOTICEThis manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumedthat basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under-stood by the users, and have therefore not been restated.WARNING :Failure to follow appropriate service and safety procedures when servicing this product may result in per-sonal injury, destruction of expensive components and failure of the product to perform as specified. Forthese reasons, we advise all Yamaha product owners that all service required should be performed by anauthorized Yamaha Retailer or the appointed service representative.IMPORTANT :This presentation or sale of this manual to any individual or firm does not constitute authorization, certifi-cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship ofany form.The data provided is believed to be accurate and applicable to the unit (s) indicated on the cover. The research engineering, andservice departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitableand changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear toexist, please contact the distributors Service Division.WARNING :Static discharges can destroy expensive components. Discharge any static electricity your body may haveaccumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect tothis bus).IMPORTANT :Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply powerto the unit.WARNING: CHEMICAL CONTENT NOTICE!The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Whereapplicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possiblyother entities) to cause cancer and/or birth defects or other reproductive harm.DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHATSO EVER!Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or exposeeyes to solder/flux vapor!If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handlingfood.I WARNINGComponents having special characteristics are marked and must bereplaced with parts having specification equal to those originally installed.印部品、安全維持重要部品。交換場合、安全必指定部品使用。WARNING: THIS APPARATUS MUST BE EARTHEDIMPORTANTTHE WIRES IN THIS MAINS LEAD ARE COLOURED INACCORDANCE WITH THE FOLLOWING CODE:GREEN-AND-YELLOW :EARTHBLUE :NEUTRALBROWN :LIVEAs the colours of the wires in the mains lead of this apparatus maynot correspond with the coloured markings identifying the terminals inyour plug, proceed as follows:The wire which is coloured GREEN and YELLOW must beconnected to the terminal in the plug which is marked by the letter Eor by the safety earth symbol or coloured GREEN and YELLOW.The wire which is coloured BLUE must be connected to theterminal which is marked with the letter N or coloured BLACK.The wire which is coloured BROWN must be connected to the terminalwhich is marked with the letter L or coloured RED.* This applies only to products distributed by YAMAHA KEMBLEMUSIC (U.K.) LTD.RadioFans.CN 收音机爱 好者资料库HS80M/HS50M3I HS80M SPECIFICATIONS （総合仕様）General specificationsType . Biamp 2-way Powered speakerCrossover Frequency . 2 kHzOverall Frequency Response. 42 Hz-20 kHz (-10 dB)Dimensiones (W x H x D). 250 x 390 x 332 mm (9-13/16” x 15-3/8” x 13-1/6”)Weight . 11.3 kgSpeaker ComponentsSpeaker Components . LF: 8 Cone (Magnetic shielding Type)HF: 1 Dome (Magnetic shielding Type)Enclosure . Type: Bass-reflex TypeMaterial: MDFAmp. unitOutput Power. Total: 120 W (dynamic power)(LF: 75 W, 4 ohms, 1 kHz)(HF: 45 W, 8 ohms, 10 kHz)Input Sensitivity/Impedance. -10 dBu/ 10 k-ohmsInput Connectors (parallel) . 1: XLR-3-31 type (balanced)2: PHONE (balanced)Controls . LEVEL control (+4 dB/ center click)LOW CUT switch (FLAT/ 80/ 100 Hz, 12 dB/ octave)MID EQ switch (+/- 2 dB at 2 kHz)HIGH TRIM switch (+/- 2 dB at HF)ROOM CONTROL switch (0/ -2/ -4 dB under 500 Hz)Power Indicator . Power ON: White LEDPower Consumption . 60 W総合仕様形式 . 2 周波数 . 2 kHz再生周波数帯域 . 42 Hz20 kHz （-10 dB）最大外形寸法 （WHD）. 250390332 mm質量 . 11.3 kg部 . LF：20 cm （防磁型）HF：2.5 cm （防磁型）. 方式：型材質：MDF部最大出力 . 総合：120 W （）（LF：75 W、4 ohms、1 kHz）（HF：45 W、8 ohms、10 kHz）入力感度/. -10 dBu/ 10 k-ohms入力端子 （） . 1：XLR-3-31端子 （）2：端子 （） . LEVEL （+4 dB/ center click）LOW CUT （FLAT/ 80/ 100 Hz、12 dB/ octave）MID EQ （+/- 2 dB at 2 kHz）HIGH TRIM （+/- 2 dB at HF）ROOM CONTROL （0/-2/-4 dB under 500Hz） . 電源ON：白色LED消費電力 . 60 W Performance graph （特性図）10k1k100200+10RESPONSE (dB)-10-20-30-40FREQUENCY (Hz)HS80MHS80M/HS50M410k1k100200+10RESPONSE (dB)-10-20-30-40FREQUENCY (Hz)I HS50M SPECIFICATIONS （総合仕様）General specificationsType . Biamp 2-way Powered speakerCrossover Frequency . 3 kHzOverall Frequency Response. 55 Hz-20 kHz (-10 dB)Dimensiones (W x H x D). 165 x 268 x 222 mm (6-1/2” x 10-9/16” x 8-3/4”)Weight . 5.8 kgSpeaker ComponentsSpeaker Components . LF: 5 Cone (Magnetic shielding Type)HF: 0.75 Dome (Magnetic shielding Type)Enclosure . Type: Bass-reflex TypeMaterial: MDFAmp. unitOutput Power. Total: 70 W (dynamic power)(LF: 45 W, 4 ohms, 1 kHz)(HF: 25 W, 8 ohms, 10 kHz)Input Sensitivity/Impedance. -10 dBu/ 10 k-ohmsInput Connectors (parallel) . 1: XLR-3-31 type (balanced)2: PHONE (balanced)Controls . LEVEL control (+4 dB/ center click)LOW CUT switch (FLAT/ 80/ 100 Hz, 12 dB/ octave)MID EQ switch (+/- 2 dB at 2 kHz)HIGH TRIM switch (+/- 2 dB at HF)ROOM CONTROL switch (0/ -2/ -4 dB under 500 Hz)Power Indicator . Power ON: White LEDPower Consumption . 45 W総合仕様形式 . 2 周波数 . 3 kHz再生周波数帯域 . 55 Hz20 kHz （-10 dB）最大外形寸法 （WHD） . 165268222 mm質量 . 5.8 kg部 . LF：13 cm （防磁型）HF：2.0 cm （防磁型）. 方式：型材質：MDF部最大出力 . 総合：70 W （）（LF：45 W、4 ohms、1 kHz）（HF：25 W、8 ohms、10 kHz）入力端子 （） . 1：XLR-3-31端子 （）2：端子 （） . LEVEL （+4 dB/ center click）LOW CUT （FLAT/ 80/ 100 Hz、12 dB/ octave）MID EQ （+/- 2 dB at 2 kHz）HIGH TRIM （+/- 2 dB at HF）ROOM CONTROL （0/-2/-4 dB under 500Hz） . 電源ON：白色LED消費電力 . 45 W Performance graph （特性図）HS50MHS80M/HS50M5I DIMENSIONS （寸法図）250 (9-13/16)332 (13-1/16)390 (15-3/8)165 (6-1/2)222 (8-3/4)268 (10-9/16) HS80M HS50MUnit: mm (inch)単位：mm （）Unit: mm (inch)単位：mm （）HS80M/HS50M6I PANEL LAYOUT （）OFFINPUTLEVELPOWERONAC INHS50MHS80M12345678ROOM CONTROLHIGH TRIM+2dB+2dB0dB0dB-2dB-2dB0dB-2dB-4dBMID EQLOW CUT2kHz3kHz500Hz100Hz80Hz+2dB+2dB0dB0dB-2dB-2dB0dB-2dB-4dB2kHz2kHz500Hz100HzFLAT80HzROOM CONTROLHIGH TRIMMID EQLOW CUTFLATMID EQROOMCONTROLHIGHTRIMLOW CUT+2dB0-2dB0-2dB-4dB+2dB0-2dBFLAT80Hz100Hz-10dB+4dB12MIN91POWER switch2LEVEL control3INPUT 1, 2 connector4MID EQ switch5ROOM CONTROL switch6HIGH TRIM switch7LOW CUT switch8AC IN Connector9Power indicator1POWER 2LEVEL3INPUT 1、2 端子4MID EQ5ROOM CONTROL6HIGH TRIM7LOW CUT8AC IN端子9Power HS80M/HS50M7I CIRCUIT BOARD LAYOUT （） HS80M HS50MINPUTAC INLETTRANSAMP(LF 2/4)(LF 3/4)(LF 1/4)(LF 4/4)INPUTAC INLETTRANSAMP(LF 2/4)(LF 3/4)(LF 1/4)(LF 4/4)HS80M/HS50M8I HS80M DISASSEMBLY PROCEDURE （分解手順）1.Woofer (Time required: about 1 minute)1-1Remove the six (6) screws marked 55. The wooferring can then be removed. (Fig. 1)1-2Remove the six (6) screws marked 40. The woofercan then be removed. (Fig. 1)2.Tweeter (Time required: about 1 minute)Remove the four (4) screws marked 20. The tweetercan then be removed. (Fig. 1)20:Hexagonal Socket Tapping Screw 4x20 (WG341100) 6角穴付 TP1種40:Bind Head Tapping Screw 4x16 (WG540200) TP1種55:Hexagonal Socket Tapping Screw 4x20 (WG341100) 6角穴付 TP1種Fig. 1 （図 1）3.Rear Panel Assembly (Time required: about1 minute)Remove the ten (10) screws marked 155. The rearpanel assembly can then be removed. (Fig. 2)4.AMP Circuit Board(Time required: about 2 minutes)4-1Remove the rear panel assembly.(See procedure 3.)4-2Remove the five (5) screws marked 90. The AMPunit can then be removed. (Fig. 2)*At this time, be careful not to lose the spacer whichalso comes off.Fig. 2 （図 2）90:Bind Head Tapping Screw-S 3x16 (WG341600) S155:Bind Head Tapping Screw 4x16 (WG540200) TP1種1.（所要時間：約1分）1-155 六角孔付6本外、外。 （図 1）1-240 6本外、外。 （図 1）2.（所要時間：約1分）20 六角孔付4本外、外。 （図 1）4.AMP（所要時間：約2分）4-1Ass y外。 （3項参照）4-290 5本外、AMP外。（図 2） 、同時外注意。3.Ass y（所要時間：約1分）155 10本外、Ass y外。 （図 2）HS80M202040Woofer Ring555540WooferTweeter90155155Rear Panel AssemblyAssyHS80M/HS50M9HS80M5.INPUT Circuit Board(Time required: about 3 minutes)5-1Remove the rear panel assembly. (See procedure 3.)5-2Remove the four (4) screws marked 110 and thescrew marked 115. (Fig. 3)5-3Remove the LEVEL knob, the hexagonal nut E andwasher D. (Fig. 3, Photo. 5)5-4Remove the hexagonal nut F on the phone type in-put connector. The INPUT assembly can then be re-moved. (Photo. 5)5-5Remove the three (3) screws marked G and removethe case PWB. (Photo. 3)The Input circuit board can then be removed.*The case PWB is not a component of the INPUT cir-cuit board. When replacing the INPUT circuit board,remove the case PWB and reuse it.5.INPUT（所要時間：約3分）5-1Ass y外。 （3項参照）5-2110 4本 115 1本外。（図 3）5-3LEVEL E 六角 D 外。 （図 3、写真 5）5-4入力端子六角 F 外、INPUT Ass y外。 （写真 5）5-5G 3本外PWB外、INPUT取出。 （写真 3）PWBINPUT構成部品。交換時、取外使用。4-3IC801IC802側 （22所） 外。 （写真 1）4-4A 2本外、放熱板 （IC801、IC802付） 外。 （写真 1）B 2本外、IC801IC802外。（写真 1）4-5C 4本外、AMP取付金具外AMP取出。 （写真 1）ACCCCBBIC801IC801IC802IC802AMP mounting BRACKET（AMP取付金具） AMP mounting BRACKET（AMP取付金具） AMP mounting BRACKET（AMP取付金具） AMP mounting BRACKET（AMP取付金具） AMP circuit board（AMP） AMP circuit board（AMP） SPACER（） SPACER（） HEAT SINK（放熱板） HEAT SINK（放熱板） INPUT Circuit Board（INPUT） INPUT Circuit Board（INPUT） CASE PWB（ PWB） CASE PWB（ PWB） Photo. 1 （写真 1）AMPPhoto. 2 （写真 2）Input Ass y4-3Unsolder soldered parts (22 locations) on the pat-tern side of IC801 and IC802. (Photo. 1)4-4Remove the two (2) screws marked A and removethe heat sink with IC801 and IC802. (Photo. 1)Remove the two (2) screws marked B and removeIC801 and IC802. (Photo. 1)4-5Remove the four (4) screws marked C, remove theAMP mounting bracket. The AMP circuit board canthen be removed. (Photo. 1)Photo. 3 （写真 3）GGHS80M/HS50M106.TRANS Circuit Board and Power Trans-former (Time required: about 2 minutes)6-1Remove the rear panel assembly. (See procedure 3.)6-2Remove the four (4) screws marked 130. The TRANScircuit board with the power transformer can then beremoved. (Fig. 3)6-3Unsolder the power transformer mounting solder (6locations) and separate the power transformer fromthe TRANS circuit board.*The power transformer is not a component of theTRANS circuit board.7.AC INLET Circuit Board(Time required: about 2 minutes)7-1Remove the rear panel assembly. (See procedure 3.)Unsold soldered parts (2 locations) of the powerswitch.7-2Remove the two (2) screws marked 150. (Fig. 3)7-3Unsold the soldered part of the AC inlet groundingwire and remove the AC INLET circuit board.(Photo. 4)110:Bind Head Tapping Screw-S 3x10 (WG341400) S115:Bonding Tapping Screw-B 3x10 (WH042000) B130:Bind Head Tapping Screw-S 4x10 (WG341300) S150:Bind Head Screw-S 3x15 (WG341500) 小6.TRANS/電源（所要時間：約2分）6-1Ass y外。 （3 項参照）6-2130 4本外、TRANS （電源付） 外。 （図 3）6-3電源取付 （6所） 外、TRANS電源分離。電源TRANS構成部品。7.AC INLET（所要時間：約2分）7-1Ass y外。 （3項参照）電源外。7-2150 2本外。 （図 3）7-3AC INLET線外、AC INLET外。 （写真 4）110115130150LEVEL KnobLEVELFig. 3 （図 3）HS80MSolder（） Solder（） AC Inlet（AC INLET） AC Inlet（AC INLET） AC INLET Circuit Board（AC INLET ） AC INLET Circuit Board（AC INLET ） Power Switch（電源 ） Power Switch（電源 ） DDEEFFPhoto. 4 （写真 4）Photo. 5 （写真 5）HS80M/HS50M111.Woofer (Time required: about 1 minute)1-1Remove the four (4) screws marked 55. The wooferring can then be removed. (Fig. 1)1-2Remove the four (4) screws marked 40. The woofercan then be removed. (Fig. 1)2.Tweeter (Time required: about 1 minute)Remove the four (4) screws marked 20. The tweetercan then be removed. (Fig. 1)20:Hexagonal Socket Tapping Screw 4x20 (WG341100) 6角穴付 TP1種40:Bind Head Tapping Screw 4x16 (WG540200) TP1種55:Hexagonal Socket Tapping Screw 4x20 (WG341100) 6角穴付 TP1種Fig. 1 （図 1）3.Rear Panel Assembly (Time required: about1 minute)Remove the ten (10) screws marked 155. The rearpanel assembly can then be removed. (Fig. 2)4.AMP Circuit Board(Time required: about 2 minutes)4-1Remove the rear panel assembly. (See procedure 3.)4-2Remove the three (3) screws marked 90. The AMPunit can then be removed. (Fig. 2)*At this time, be careful not to lose the plate whichalso comes off.Fig. 2 （図 2）90:Bind Head Tapping Screw-S 3x10 (WG341400) S155:Bind Head Tapping Screw 4x16 (WG540200) TP1種1.（所要時間：約1分）1-155 六角孔付4本外、外。 （Fig. 1）1-240 4本外、外。 （図 1）2.（所要時間：約1分）20 六角孔付4本外、外。 （図 1）4.AMP（所要時間：約2分）4-1Ass y外。 （3項参照）4-290 3本外、AMP外。（図 2）、絶縁同時外注意。3.Ass y（所要時間：約1分）155 10本外、Ass y外。 （図 2）202040Woofer Ring555540WooferTweeter90155155Rear Panel AssemblyAssyI HS50M DISASSEMBLY PROCEDURE （分解手順）HS50MHS80M/HS50M125.INPUT Circuit Board(Time required: about 3 minutes)5-1Remove the rear panel assembly. (See procedure 3.)5-2Remove the four (4) screws marked 110 and thescrew marked 115. (Fig. 3)5-3Remove the LEVEL knob, the hexagonal nut E andwasher D. (Fig. 3, Photo. 5)5-4Remove the hexagonal nut F on the phone type in-put connector. The INPUT assembly can then be re-moved. (Photo. 5)5-5Remove the three (3) screws marked G and removethe case PWB. (Photo. 3)The Input circuit board can then be removed.*The case PWB is not a component of the INPUT cir-cuit board. When replacing the INPUT circuit board,remove the case PWB and reuse it.5.INPUT（所要時間：約3分）5-1Ass y外。 （3項参照）5-2110 4本 115 1本外。（図 3）5-3LEVEL E 六角 D 外。 （図 3、写真 5）5-4入力端子六角 F 外、INPUT Ass y外。 （写真 5）5-5G 3本外PWB外、INPUT取出。 （写真 3）PWBINPUT構成部品。交換時、取外使用。HS50M4-3IC801IC802側 （22所） 外。 （写真 1）4-4A 2本外、放熱板 （IC801、IC802付） 外。 （写真 1）B 2本外、IC801IC802外。（写真 1）4-5C 4本外、AMP取付金具外AMP取出。 （写真 1）AACCCCBBIC801IC801IC802IC802AMP mounting BRACKET（AMP取付金具） AMP mounting BRACKET（AMP取付金具） AMP mounting BRACKET（AMP取付金具） AMP mounting BRACKET（AMP取付金具） HEAT SINK（放熱板） HEAT SINK（放熱板） AMP Circuit Board（AMP） AMP Circuit Board（AMP） PLATE（絶縁） PLATE（絶縁） INPUT Circuit Board（INPUT） INPUT Circuit Board（INPUT） CASE PWB（ PWB） CASE PWB（ PWB） Photo. 1 （写真 1）AMPPhoto. 2 （写真 2）Input Ass y4-3Unsolder soldered parts (22 locations) on the pat-tern side of IC801 and IC802. (Photo. 1)4-4Remove the two (2) screws marked A and removethe heat sink with IC801 a